Flash Module, 8MX32, 150ns, CQFP68, 40 X 40 MM, 5.20 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microsemi |
| 零件包装代码 | QFP |
| 包装说明 | GQFF, |
| 针数 | 68 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.1.A |
| 最长访问时间 | 150 ns |
| 其他特性 | ALSO CONFIGURABLE AS 32M X 8 |
| JESD-30 代码 | S-CQFP-F68 |
| 长度 | 39.6 mm |
| 内存密度 | 268435456 bit |
| 内存集成电路类型 | FLASH MODULE |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8MX32 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | GQFF |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, GUARD RING |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 编程电压 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 类型 | NOR TYPE |
| 宽度 | 39.6 mm |
| WF8M32-150G4DI5 | WF8M32-120G4DM5 | WF8M32-100G4DC5 | WF8M32-100G4DM5 | WF8M32-150G4DM5 | |
|---|---|---|---|---|---|
| 描述 | Flash Module, 8MX32, 150ns, CQFP68, 40 X 40 MM, 5.20 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Flash Module, 8MX32, 120ns, CQFP68, 40 X 40 MM, 5.20 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Flash Module, 8MX32, 100ns, CQFP68, 40 X 40 MM, 5.20 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Flash Module, 8MX32, 100ns, CQFP68, 40 X 40 MM, 5.20 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Flash Module, 8MX32, 150ns, CQFP68, 40 X 40 MM, 5.20 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | GQFF, | GQFF, | GQFF, | GQFF, | GQFF, |
| 针数 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.1.A | 3A001.A.2.C | 3A991.B.1.A | 3A001.A.2.C | 3A001.A.2.C |
| 最长访问时间 | 150 ns | 120 ns | 100 ns | 100 ns | 150 ns |
| 其他特性 | ALSO CONFIGURABLE AS 32M X 8 | ALSO CONFIGURABLE AS 32M X 8 | ALSO CONFIGURABLE AS 32M X 8 | ALSO CONFIGURABLE AS 32M X 8 | ALSO CONFIGURABLE AS 32M X 8 |
| JESD-30 代码 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 |
| 长度 | 39.6 mm | 39.6 mm | 39.6 mm | 39.6 mm | 39.6 mm |
| 内存密度 | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit |
| 内存集成电路类型 | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 |
| 字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 125 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | - | -55 °C | -55 °C |
| 组织 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | GQFF | GQFF | GQFF | GQFF | GQFF |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.2 mm | 5.2 mm | 5.2 mm | 5.2 mm | 5.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 39.6 mm | 39.6 mm | 39.6 mm | 39.6 mm | 39.6 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
