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M95512-DWMC4TP/K: 产品描述64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8; 产品类别存储存储; 文件大小357KB，共39页; 制造商ST(意法半导体); 官网地址http://www.st.com/; 标准

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M95512-DWMC4TP/K概述

64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8

M95512-DWMC4TP/K规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	ST(意法半导体)
零件包装代码	DFP
包装说明	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8
针数	8
Reach Compliance Code	compliant
ECCN代码	3A001.A.2.A
最大时钟频率 (fCLK)	10 MHz
JESD-30 代码	R-PDSO-N8
长度	3 mm
内存密度	524288 bit
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	8
字数	65536 words
字数代码	64000
工作模式	SYNCHRONOUS
最高工作温度	145 °C
最低工作温度	-40 °C
组织	64KX8
封装主体材料	PLASTIC/EPOXY
封装代码	HVSON
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
座面最大高度	0.6 mm
串行总线类型	SPI
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子形式	NO LEAD
端子节距	0.5 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	2 mm
最长写入周期时间 (tWC)	4 ms

M95512-DWMC4TP/K相似产品对比

	M95512-DWMC4TP/K	M95512-DRMC3TP/K	M95512-DWMC4G/K	M95512-DWMC4TG/K	M95512-DRMC3G/K	M95512-DWMC4P/K	M95512-DRMC3P/K	M95512-DRMC3TG/K
描述	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	64KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)
零件包装代码	DFP	DFP	DFP	DFP	DFP	DFP	DFP	DFP
包装说明	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, UFDFP-8
针数	8	8	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A001.A.2.A	EAR99	3A001.A.2.A	3A001.A.2.A	EAR99	3A001.A.2.A	EAR99	EAR99
最大时钟频率 (fCLK)	10 MHz	5 MHz	10 MHz	10 MHz	5 MHz	10 MHz	5 MHz	5 MHz
JESD-30 代码	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8
长度	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
内存密度	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端子数量	8	8	8	8	8	8	8	8
字数	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
字数代码	64000	64000	64000	64000	64000	64000	64000	64000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	145 °C	125 °C	145 °C	145 °C	125 °C	145 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HVSON	HVSON	HVSON	HVSON	HVSON	HVSON	HVSON	HVSON
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
座面最大高度	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm
串行总线类型	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2.5 V	1.8 V	2.5 V	2.5 V	1.8 V	2.5 V	1.8 V	1.8 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	2 mm	2 mm	2 mm	2 mm	2 mm	2 mm	2 mm	2 mm
最长写入周期时间 (tWC)	4 ms	4 ms	4 ms	4 ms	4 ms	4 ms	4 ms	4 ms

M95512-DWMC4TP/K

M95512-DWMC4TP/K概述

M95512-DWMC4TP/K规格参数

M95512-DWMC4TP/K相似产品对比

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