IC 51 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM27, PLASTIC, SOT878-1, RDBS-27, Audio/Video Amplifier
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| Objectid | 1036970161 |
| 零件包装代码 | SOT |
| 包装说明 | PLASTIC, SOT878-1, RDBS-27 |
| 针数 | 27 |
| 制造商包装代码 | SOT878-1 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| compound_id | 5014071 |
| 标称带宽 | 22 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 谐波失真 | 10% |
| JESD-30 代码 | R-PZFM-T27 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 27 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 51 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLANGE MOUNT |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 6 V |
| 表面贴装 | NO |
| 技术 | BCDMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | ZIG-ZAG |

| TDF8544SD/N2 | TDF8544J/N2 | TDF8544J/N2,112 | TDF8544SD/N2,112 | TDF8544TH/N2,518 | TDF8544TH/N2 | |
|---|---|---|---|---|---|---|
| 描述 | IC 51 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM27, PLASTIC, SOT878-1, RDBS-27, Audio/Video Amplifier | IC 51 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM27, PLASTIC, SOT827-1, DBS-27, Audio/Video Amplifier | TDF8544 - I²C-bus controlled 4 x 50 W power amplifier ZIP 27-Pin | TDF8544 - I²C-bus controlled 4 x 50 W power amplifier ZIP 27-Pin | TDF8544 - I²C-bus controlled 4 x 50 W power amplifier SOIC 36-Pin | IC 51 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO36, PLASTIC,SOT851-1, HSOP-36, Audio/Video Amplifier |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SOT | SOT | ZIP | ZIP | SOIC | SOIC |
| 针数 | 27 | 27 | 27 | 27 | 36 | 36 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| 包装说明 | PLASTIC, SOT878-1, RDBS-27 | PLASTIC, SOT827-1, DBS-27 | - | - | SSOP, SSOP36,.56 | PLASTIC,SOT851-1, HSOP-36 |
| 制造商包装代码 | SOT878-1 | SOT827-1 | SOT827-1 | SOT878-1 | SOT851-2 | - |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 代码 | R-PZFM-T27 | R-PZFM-T27 | - | - | R-PDSO-G36 | R-PDSO-G36 |
| 功能数量 | 1 | 1 | - | - | 4 | 1 |
| 端子数量 | 27 | 27 | - | - | 36 | 36 |
| 最高工作温度 | 105 °C | 105 °C | - | - | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | -40 °C | - | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLANGE MOUNT | FLANGE MOUNT | - | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | - | - | YES | YES |
| 技术 | BCDMOS | BCDMOS | - | - | BCDMOS | BCDMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | - | GULL WING | GULL WING |
| 端子位置 | ZIG-ZAG | ZIG-ZAG | - | - | DUAL | DUAL |
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