IC 128K X 8 FLASH 12V PROM, 120 ns, PDSO32, 8 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP-32, Programmable ROM
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Toshiba(东芝) |
零件包装代码 | TSOP |
包装说明 | TSOP1, |
针数 | 32 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 120 ns |
其他特性 | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. |
JESD-30 代码 | R-PDSO-G32 |
JESD-609代码 | e0 |
长度 | 18.4 mm |
内存密度 | 1048576 bit |
内存集成电路类型 | FLASH |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP1 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 240 |
编程电压 | 12 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
类型 | NOR TYPE |
宽度 | 7.9 mm |
TC58F010FT-12 | TC58F010P-10 | TC58F010F-10 | TC58F010TR-12 | TC58F010F-12 | TC58F010TR-10 | TC58F010T-12 | TC58F010P-12 | TC58F010T-10 | TC58F010FT-10 | |
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描述 | IC 128K X 8 FLASH 12V PROM, 120 ns, PDSO32, 8 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 100 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 100 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 120 ns, PDSO32, 8 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 120 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 100 ns, PDSO32, 8 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 120 ns, PQCC32, 0.450 INCH, PLASTIC, QFJ-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 120 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 100 ns, PQCC32, 0.450 INCH, PLASTIC, QFJ-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 100 ns, PDSO32, 8 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP-32, Programmable ROM |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | TSOP | DIP | SOIC | TSOP | SOIC | TSOP | QFJ | DIP | QFJ | TSOP |
包装说明 | TSOP1, | DIP, | SOP, | TSOP1-R, | SOP, | TSOP1-R, | QCCJ, | DIP, | QCCJ, | TSOP1, |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 120 ns | 100 ns | 100 ns | 120 ns | 120 ns | 100 ns | 120 ns | 120 ns | 100 ns | 100 ns |
其他特性 | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. | BULK ERASE; 10K ERASE/WRITE CYCLES MIN. |
JESD-30 代码 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 | R-PDIP-T32 | R-PQCC-J32 | R-PDSO-G32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP1 | DIP | SOP | TSOP1-R | SOP | TSOP1-R | QCCJ | DIP | QCCJ | TSOP1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | IN-LINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
编程电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | YES | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | THROUGH-HOLE | J BEND | GULL WING |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
厂商名称 | Toshiba(东芝) | - | - | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
长度 | 18.4 mm | 42 mm | 20.6 mm | 18.4 mm | 20.6 mm | 18.4 mm | - | 42 mm | - | 18.4 mm |
座面最大高度 | 1.2 mm | 4.8 mm | 2.8 mm | 1.2 mm | 2.8 mm | 1.2 mm | - | 4.8 mm | - | 1.2 mm |
端子节距 | 0.5 mm | 2.54 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm | - | 2.54 mm | - | 0.5 mm |
宽度 | 7.9 mm | 15.24 mm | 10.7 mm | 7.9 mm | 10.7 mm | 7.9 mm | - | 15.24 mm | - | 7.9 mm |
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