IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16, Multiplexer or Switch
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Vishay(威世) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-CDIP-T16 |
| JESD-609代码 | e0 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 68 dB |
| 通态电阻匹配规范 | 14.4 Ω |
| 最大通态电阻 (Ron) | 400 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 最大供电电流 (Isup) | 2.4 mA |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长断开时间 | 1000 ns |
| 最长接通时间 | 1500 ns |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| DG509AAP/883 | DG508AAP/883{SOLDER-DIP} | DG508AAP/883(SOLDER-DIP) | DG508AAP/883(GOLD-PLATE) | DG508AAP/883{GOLD-PLATE} | DG508AAP | DG509ADY-T1 | 77052012A | DG508AAL | DG508AAL883B | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, Multiplexer or Switch | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16 | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, Multiplexer or Switch | Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDSO16, SOIC-16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CQCC20, CERAMIC, LCC-20 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDFP16, | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16, DFP-16, Multiplexer or Switch |
| 包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | SOP, | , | DFP, FL16,.3 | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-PDSO-G16 | S-CQCC-N20 | R-XDFP-F16 | R-CDFP-F16 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 4 | 8 | 8 | 8 | 8 | 8 | 4 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 20 | 16 | 16 |
| 最大通态电阻 (Ron) | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 450 Ω | 300 Ω | 500 Ω | 400 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | NO LEAD | FLAT | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| 厂商名称 | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | - | Vishay(威世) | - | Vishay(威世) |
| 标称断态隔离度 | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | 50 dB | - | 68 dB |
| 通态电阻匹配规范 | 14.4 Ω | 14.4 Ω | 14.4 Ω | 14.4 Ω | 14.4 Ω | 14.4 Ω | 14.4 Ω | - | - | 14.4 Ω |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | SOP | - | DFP | DFP |
| 最大供电电流 (Isup) | 2.4 mA | 2.4 mA | 2.4 mA | 2.4 mA | 2.4 mA | 2.4 mA | - | - | - | - |
| 最长断开时间 | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns | - | 500 ns | - | 1000 ns |
| 最长接通时间 | 1500 ns | 1500 ns | 1500 ns | 1500 ns | 1500 ns | 1500 ns | - | 500 ns | - | 1500 ns |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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