AHCT/VHCT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH DIRECTION CONTROL |
| 系列 | AHCT/VHCT |
| JESD-30 代码 | R-GDFP-F20 |
| 长度 | 13.09 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 11 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.92 mm |
| SN54AHCT245W | SN54AHCT245J | SN54AHCT245FK | SN74AHCT245DGV | |
|---|---|---|---|---|
| 描述 | AHCT/VHCT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | AHCT/VHCT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | AHCT/VHCT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20 | AHCT/VHCT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO20, PLASTIC, TVSOP-20 |
| 零件包装代码 | DFP | DIP | QFN | SOIC |
| 包装说明 | DFP, | DIP, | QCCN, | TSSOP, TSSOP20,.25,16 |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
| 系列 | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT |
| JESD-30 代码 | R-GDFP-F20 | R-GDIP-T20 | S-CQCC-N20 | R-PDSO-G20 |
| 长度 | 13.09 mm | 24.195 mm | 8.89 mm | 5 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | DFP | DIP | QCCN | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 11 ns | 11 ns | 11 ns | 9.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 5.08 mm | 2.03 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 0.4 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL |
| 宽度 | 6.92 mm | 7.62 mm | 8.89 mm | 4.4 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | - |
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