电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CDR14BP132AFWM

产品描述Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
产品类别无源元件    电容器   
文件大小147KB,共9页
制造商AVX
相似器件已查找到20个与CDR14BP132AFWM功能相似器件
下载文档 详细参数 全文预览

CDR14BP132AFWM概述

Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP

CDR14BP132AFWM规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
包装说明, 1111
Reach Compliance Code_compli
ECCN代码EAR99
电容0.0013 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度1.676 mm
JESD-609代码e0
长度2.79 mm
制造商序列号CDR
安装特点SURFACE MOUNT
多层Yes
负容差1%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法WAFFLE PACK
正容差1%
额定(直流)电压(URdc)50 V
参考标准MIL-PRF-55681
系列CDR(MICROWAVE)
尺寸代码1111
表面贴装YES
温度特性代码BP
温度系数30ppm/Cel ppm/°C
端子面层Tin/Lead (Sn/Pb)
端子形状WRAPAROUND
宽度2.79 mm
Base Number Matches1

文档预览

下载PDF文档
Microwave MLC’s
CDR Series — MIL-PRF-55681 (RF/Microwave Chips)
MILITARY DESIGNATION PER MIL-PRF-55681
W
W
T
L
L
T
A 0J
47
10
0J
bw
bw
CDR11/12
CDR13/14
CROSS REFERENCE: AVX/MIL-PRF-55681
Per MIL-C-55681
CDR11
CDR12
CDR13
CDR14
AVX
Style
AQ11
AQ12
AQ13
AQ14
Length (L)
.055±.015
(1.40±.381)
.055±.025
(1.40±.635)
.110±.020
(2.79±.508)
.110 +.035 -0.20
(2.79 +.889 -.508)
Width (W)
.055±.015
(1.40±.381)
.055±.015
(1.40±.381)
.110±.020
(2.79±.508)
.110±.020
(2.79±.508)
Thickness (T)
Max
Min
.057
(1.45)
.057
(1.45)
.102
(2.59)
.102
(2.59)
.020
(.508)
.020
(.508)
.030
(.762)
.030
(.762)
Termination Band (bw)
Max
Min
.020
(.508)
.020
(.508)
.025
(.635)
.025
(.635)
.005
(.127)
.005
(.127)
.005
(.127)
.005
(.127)
HOW TO ORDER
CDR12
MIL Style
CDR11, CDR12,
CDR13, CDR14
BG
101
Capacitance
EIA Capacitance Code in pF.
First two digits = significant figures
or “R” for decimal place.
Third digit = number of zeros or
after “R” significant figures.
A
K
Capacitance
Tolerance Code
B = ±.1 pF
C = ±.25 pF
D = ±.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
U
S
Failure Rate
Level
Termination
Finish (Military
Designations)
Code
M = 1.0%
P = .1%
R = .01%
S = .001%
Voltage
Temperature
Limits
BG = +90±20 ppm/°C with and without
rated voltage from -55°C to + 125°C
BP = 0±30ppm/°C with and without
rated voltage from -55°C to +125°C
Rated Voltage
Code
A = 50V
B = 100V
C = 200V
D = 300V
E = 500V
PACKAGING
Standard Packaging Quanity
CDR11-12 = 100 pcs per waffle pack
CDR13-14 = 80 pcs per waffle pack
M = Palladium/Silver (CDR11 & 13 only)
N = Silver, Nickel, Gold (CDR11 & 13 only)
S = Solder Coated, Final (CDR12 & 14 only)
U = Base Metallization, Barrier Metal, Solder
Coated. (Solder M.P. 200°C or less)
(CDR12 & 14 only)
W = Base Metallization, Barrier Metal,
Tinned (Tin or Tin/Lead Alloy)
(CDR12 & 14 only)
Y = 100% Tin
(CDR12 & 14 only)
Z = Base Metallization, Barrier Metal
(TIn Lead Alloy With 4% Lead Min.)
(CDR12 & 14 only)
7
Not RoHS Compliant
TAPE & REEL:
All tape and reel specifications are in compliance with EIA RS481
(equivalent to IEC 286 part 3).
Sizes SQCA through SQCB, CDR11/12 through 13/14.
—8mm carrier
—7" reel: ≤0.040" thickness = 2000 pcs
≤0.075" thickness = 2000 pcs
—13" reel: ≤0.075" thickness = 10,000 pcs
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
131

与CDR14BP132AFWM功能相似器件

器件名 厂商 描述
CDR13BP132AFMP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR13BP132AFMS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR13BP132AFNM ATC [American Technical Ceramics] Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR13BP132AFNP ATC [American Technical Ceramics] Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR13BP132AFNR ATC [American Technical Ceramics] Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR13BP132AFNS ATC [American Technical Ceramics] Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR13BP132AFYM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR13BP132AFYR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR13BP132AFYS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFSM ATC [American Technical Ceramics] Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFSP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFSS ATC [American Technical Ceramics] Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFUM ATC [American Technical Ceramics] Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFWP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFYM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFYR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFYS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFZM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFZP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
CDR14BP132AFZS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0013uF, Surface Mount, 1111, CHIP
【NXP Rapid IoT评测】触摸按键没有反应——I2C死锁解除方法
NXP Rapid IoT 上用I2C1上挂了很多外设, I2C1: Sensors + Touch: FXOS8700, FXAS21002, MPL3115, ENS210, TSL25711, CCS811 (behind I2C switch), SX9500 I2C2: after I2C switch (...NTAG_ ......
dvd1478 无线连接
PIC单片机用IIC总线读写片外EEPROM????
单片机用的PIC18F65J10,片外EEPROM是24LC16B,用IIC总线读写 代码是这样的: void Iic_EepromRd(BYTE chip,BYTE address,BYTE *p,BYTE num){while (num>EEPROM_PAGE_LENGTH){StartI2C();whi ......
yanjianguo 单片机
msp430 USART模块-双向串口通信,接受长度为8的字符串,再发送回PC机
msp430 USART模块。下边是TI官方的源码 功能:双向串口通信,先接受长度为8的字符串,再发送回PC机 问题描述:加入红色部分,判断TXBUF是否准备好,就无法实现发送功能 //************** ......
zhangxiajoa 微控制器 MCU
有没有什么型号的MCU集成了多个放大器和比较器呢?
本帖最后由 SsvepX 于 2018-7-24 08:47 编辑 4个运放,4个比较器吧...
SsvepX ARM技术
在DXP中的信号完整性分析
在DXP中的信号完整性分析!...
一支烟 PCB设计
浅谈电视机各式保护电路
浅谈电视机各式保护电路...
lorant 消费电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1503  1232  1210  2461  1029  42  43  35  50  26 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved