MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24
| 参数名称 | 属性值 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 450 ns |
| JESD-30 代码 | R-CDIP-T24 |
| 长度 | 30.099 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | NMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| AM9218BDC | AM9218CDC | AM9218CCC | C8316E | AM9218CPC | AM9218BPC | AM9218BDM | P8316E | AM9218BCC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 350ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 350ns, NMOS, CDIP24, HERMETIC SEALED, CERDIP-24 | MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 350ns, NMOS, PDIP24, PLASTIC, DIP-24 | MASK ROM, 2KX8, 450ns, NMOS, PDIP24, PLASTIC, DIP-24 | MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 450ns, NMOS, PDIP24, PLASTIC, DIP-24 | MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERDIP-24 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 450 ns | 350 ns | 350 ns | 450 ns | 350 ns | 450 ns | 450 ns | 450 ns | 450 ns |
| JESD-30 代码 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-CDIP-T24 | R-PDIP-T24 | R-CDIP-T24 |
| 长度 | 30.099 mm | 30.099 mm | 31.9405 mm | 30.099 mm | 31.877 mm | 31.877 mm | 30.099 mm | 31.877 mm | 31.9405 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.715 mm | 5.08 mm | 5.461 mm | 5.461 mm | 5.08 mm | 5.461 mm | 5.715 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| 厂商名称 | AMD(超微) | AMD(超微) | - | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
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