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TSG421-690CGYH

产品描述IC Socket, BGA421, 421 Contact(s)
产品类别连接器    插座   
文件大小120KB,共3页
制造商Advanced Interconnections Corp
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TSG421-690CGYH概述

IC Socket, BGA421, 421 Contact(s)

TSG421-690CGYH规格参数

参数名称属性值
厂商名称Advanced Interconnections Corp
Reach Compliance Codeunknown
ECCN代码EAR99
设备插槽类型IC SOCKET
使用的设备类型BGA421
外壳材料POLYPHENYLENE SULFIDE
制造商序列号TS
触点数421

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True BGA Socket™
Ball Grid Array Sockets
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
PATENTED
How It Works
Step 1
• Solder True BGA Socket™ to PCB
Step 2
• Align and place BGA device on top
of True BGA Socket mating con-
tacts. Place Chip Support Plate
over BGA device.
Step 3
• Slide Clamp over assembly. Allow
space on PCB for sliding clamp
[approximately 33% of device
package size on one side only with
new Short Slide Clamp]. Refer to
Clamp Sliding Directions for pin 1
location (see page 4).
Step 4
• Tighten Coin Screw or Finned Heat
Sink to engage compression stroke.
Guide Box
Polyimide
Wafer
Support Plate
BGA Device
Compression
Stroke (Step 4)
ADVANCED®
P.C.B.
Solder Ball
Reflowed
Heat Sink Clamp
Coin Screw
or Finned
Heat Sink
Support Plate
Not Shown
True BGA Socket™ Features
• No soldering of BGA device required.
• AIC exclusive eutectic solder ball
terminals offer superior processing.
• Uses same footprint as BGA device.
• Designed for production, develop-
ment, programming and test applica-
tions.
• Compact design maximizes PCB real
estate:
TSG = Device Pkg. Size + 0.216/(5.5mm)
TSH = Device Pkg. Size + 0.374/(9.5mm)
BGA
ADVANCED®
P.C.B.
1.27mm Pitch Terminal Options
Standard Terminals
for Test, Development and Production Applications
Terminals for LGA or
De-balled BGA Device Applications
Type -690
Surface Mount
Type -708
Thru-Hole
.183
(4.65)
Type -712
.193
(4.90)
Type -713
• Available with integral, finned heat
sink or coin screw clamp assembly.
• Currently available in 1.0 and
1.27mm pitch.
• New Short Slide Clamp reduces
required installation space on PCB.
.030 Dia.
(0.76)
.183
(4.65)
.193
(4.90)
.018 Dia.
(0.46)
.125
(3.18)
.018 Dia.
(0.46)
.125
(3.18)
.030 Dia.
(0.76)
Terminals for BGA Device Test Applications
(Consult Factory for Availability)
1.0mm Pitch Terminals
for Test, Development and Production Applications
Type -657
Type -659
Type -709
.183
(4.65)
Type -752
Surface Mount
.162
(4.11)
Type -754
Thru-Hole
.162
(4.11)
Specifications
Terminals:
Brass; Copper Alloy
(C36000)
Terminal Support:
Polyimide Film
Contacts:
Beryllium Copper (C17200)
Plating:
G – Gold over Nickel
Spring Material:
Beryllium Copper
Clamp Assembly:
Aluminum
(Heat Sink/Coin Screw, Clamp, Support Plate)
.018 Dia.
(0.46)
.183
(4.65)
.183
(4.65)
.125
(3.18)
.030 Dia.
(0.76)
.016 Dia.
(0.41)
.125
(3.18)
.024/(0.61) Dia.
.011 Dia.
(0.28)
.125
(3.18)
How To Order
Footprint Dash #
If Applicable*
True BGA Socket™
X
TS G XXXX - 690 G G XX
Clamp Options
YH - Heat Sink (3 Fins Std.)
YC - Coin Screw
Contact Plating
G - Gold
Terminal Type
See options above
Terminal Plating
G - Gold
Insulator Material:
Molded PPS (High Temp. Glass Filled
Thermoplastic), U.L. Rated 94V-O,
-60°C to 260°C (-76°F to 500°F)
Solder Ball:
Eutectic, 63Sn/37Pb,183°C (361°F)
Pitch
G = .050/(1.27mm) pitch
H = .039/(1.0mm) pitch
Number of Positions
*See BGA Footprint Booklet
or web site
Mechanical specifications for BGA device package required for quoting/ordering.
REV. 8/01
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown:
inch/(mm).
5
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