Line Driver, 1 Func, 1 Driver, CMOS, CDIP16, ROHS COMPLIANT, SIDE BRAZED, CERAMIC, DIP-16
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Holt Integrated Circuits |
零件包装代码 | DIP |
包装说明 | DIP, DIP16,.3 |
针数 | 16 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
差分输出 | YES |
驱动器位数 | 1 |
高电平输入电流最大值 | 0.000001 A |
输入特性 | DIFFERENTIAL |
接口集成电路类型 | LINE DRIVER |
接口标准 | ARINC 429 |
JESD-30 代码 | R-CDIP-T16 |
JESD-609代码 | e4 |
长度 | 20.57 mm |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
最小输出摆幅 | 9.5 V |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5,+-12/+-15 V |
认证状态 | Not Qualified |
最大接收延迟 | |
座面最大高度 | 5.08 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
电源电压1-最大 | 15 V |
电源电压1-分钟 | 12 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Gold (Au) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
最大传输延迟 | 3000 ns |
宽度 | 7.62 mm |
HI-8382C-T | HI-8382C-M-01 | HI-8382C-M-03 | 5962-8687901EA | HI-8382JF | HI-8382S-T | |
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描述 | Line Driver, 1 Func, 1 Driver, CMOS, CDIP16, ROHS COMPLIANT, SIDE BRAZED, CERAMIC, DIP-16 | Line Driver, 1 Func, 1 Driver, CMOS, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | Line Driver, 1 Func, 1 Driver, CMOS, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | Line Driver, 1 Func, 1 Driver, CMOS, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | Line Driver, 1 Func, 1 Driver, CMOS, PQCC28, ROHS COMPLIANT, PLASTIC, LCC-28 | Line Driver, 1 Func, 1 Driver, CMOS, CQCC28, CERAMIC, LCC-28 |
是否无铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 |
厂商名称 | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits |
零件包装代码 | DIP | DIP | DIP | DIP | QLCC | QLCC |
包装说明 | DIP, DIP16,.3 | SIDE BRAZED, CERAMIC, DIP-16 | SIDE BRAZED, CERAMIC, DIP-16 | SIDE BRAZED, CERAMIC, DIP-16 | ROHS COMPLIANT, PLASTIC, LCC-28 | QCCN, LCC28,.45SQ |
针数 | 16 | 16 | 16 | 16 | 28 | 28 |
Reach Compliance Code | compliant | compliant | compliant | unknown | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | 7A994 | 7A994 | EAR99 |
差分输出 | YES | YES | YES | YES | YES | YES |
驱动器位数 | 1 | 1 | 1 | 1 | 1 | 1 |
高电平输入电流最大值 | 0.000001 A | 0.000001 A | 0.000001 A | 0.00001 A | 0.000001 A | 0.000001 A |
输入特性 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER |
接口标准 | ARINC 429 | ARINC 429 | ARINC 429 | ARINC 429 | ARINC 429 | ARINC 429 |
JESD-30 代码 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | S-PQCC-J28 | S-CQCC-N28 |
JESD-609代码 | e4 | e0 | e0 | e0 | e3 | e4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 28 | 28 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C |
最小输出摆幅 | 9.5 V | 9.5 V | 9.5 V | 9.5 V | 9.5 V | 9.5 V |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DIP | QCCJ | QCCN |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LDCC28,.5SQ | LCC28,.45SQ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 245 | 250 |
电源 | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V | 5,+-15 V | 5,+-12/+-15 V | 5,+-12/+-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 4.597 mm | 2.54 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
电源电压1-最大 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
电源电压1-分钟 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
表面贴装 | NO | NO | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
端子面层 | Gold (Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Gold (Au) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | NO LEAD |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 |
最大传输延迟 | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 11.5062 mm | 11.4554 mm |
长度 | 20.57 mm | 20.57 mm | 20.57 mm | - | 11.5062 mm | 11.4554 mm |
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