HC/UH SERIES, 8-BIT RIGHT PARALLEL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, PDSO16, PLASTIC, TSSOP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 计数方向 | RIGHT |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | PARALLEL IN SERIAL OUT |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 48 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 4.4 mm |
| 最小 fmax | 25 MHz |
| MC74HC597ADT | MC74HC597ADTR2 | MC54HC597AJ | MC74HC597AD | MC74HC597ADR2 | MC74HC597AN | |
|---|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, 8-BIT RIGHT PARALLEL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, PDSO16, PLASTIC, TSSOP-16 | HC/UH SERIES, 8-BIT RIGHT PARALLEL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, PDSO16, PLASTIC, TSSOP-16 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, True Output, CMOS, CDIP16, CERAMIC, DIP-16 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, True Output, CMOS, PDSO16, 0.150 INCH, PLASTIC, SOIC-16 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, True Output, CMOS, PDSO16, 0.150 INCH, PLASTIC, SOIC-16 | HC/UH SERIES, 8-BIT RIGHT PARALLEL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16 |
| 包装说明 | TSSOP, | TSSOP, | DIP, DIP16,.3 | 0.150 INCH, PLASTIC, SOIC-16 | 0.150 INCH, PLASTIC, SOIC-16 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 计数方向 | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-GDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 |
| 长度 | 5 mm | 5 mm | 19.495 mm | 9.9 mm | 9.9 mm | 19.175 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 传播延迟（tpd） | 48 ns | 48 ns | 48 ns | 48 ns | 48 ns | 48 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 5.08 mm | 1.75 mm | 1.75 mm | 4.44 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.65 mm | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 4.4 mm | 4.4 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| 最小 fmax | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Motorola ( NXP ) | - | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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