Agilent HCPL-3180
2.5 Amp Output Current
High Speed Gate Drive
Optocoupler
Data Sheet
Functional Diagram
N/C
1
8 V
CC
7 V
O
6 V
O
5 V
EE
ANODE
CATHODE
N/C
2
3
4
SHIELD
Description
This family of devices consists of a
GaAsP LED. The LED is optically
coupled to an integrated circuit
with a power stage. These
optocouplers are ideally suited for
high frequency driving of power
IGBTs and MOSFETs used in
Plasma Display Panels, high
performance DC/DC converters,
and motor control inverter
applications.
Features
• 2.5 A maximum peak output current
• 2.0 A minimum peak output current
• 250 kHz maximum switching speed
• High speed response:
200 ns maximum propagation delay
over temperature range
• 10 kV/µs minimum Common Mode
Rejection (CMR) at V
CM
= 1500 V
• Under Voltage Lock-Out protection
(UVLO) with hysteresis
• Wide operating temperature range:
–40°C to 100°C
• Wide V
CC
operating range:
10 V to 20 V
• 20 ns typical pulse width distortion
• Safety approvals:
– UL approval, 3750 V
rms
for
1 minute
– CSA approval
– IEC/EN/DIN EN 60747-5-2
approval
Applications
• Plasma Display Panel (PDP)
• Distributed Power Architecture
(DPA)
• Switch Mode Rectifier (SMR)
• High performance DC/DC converter
• High performance Switching Power
Supply (SPS)
• High performance Uninterruptible
Power Supply (UPS)
• Isolated IGBT/Power MOSFET gate
drive
A 0.1
µF
bypass capacitor must be connected between pins V
CC
and Ground.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation, which may be induced by ESD.
Ordering Information
Specify part number followed by option number (if desired).
Example:
HCPL-3180-XXXX
No option = Standard DIP package, 50 per tube.
300 = Gull Wing Surface Mount Option, 50 per tube.
500 = Tape and Reel Packaging Option, 1000 per reel.
060 = IEC/EN/DIN EN 60747-5-2, V
IORM
= 630 V
PEAK
.
XXXE = Lead Free Option.
Package Outline Drawings
HCPL-3180 Standard DIP Package
9.65
±
0.25
(0.380
±
0.010)
TYPE NUMBER
8
7
6
5
7.62
±
0.25
(0.300
±
0.010)
OPTION CODE*
DATE CODE
6.35
±
0.25
(0.250
±
0.010)
A XXXXZ
YYWW
1
1.19 (0.047) MAX.
2
3
4
1.78 (0.070) MAX.
5° TYP.
3.56
±
0.13
(0.140
±
0.005)
4.70 (0.185) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1.080
±
0.320
(0.043
±
0.013)
0.65 (0.025) MAX.
2.54
±
0.25
(0.100
±
0.010)
2
HCPL-3180 Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
9.65
±
0.25
(0.380
±
0.010)
8
7
6
5
1.016 (0.040)
6.350
±
0.25
(0.250
±
0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
9.65
±
0.25
(0.380
±
0.010)
7.62
±
0.25
(0.300
±
0.010)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
3.56
±
0.13
(0.140
±
0.005)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
1.080
±
0.320
(0.043
±
0.013)
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.635
±
0.130
(0.025
±
0.005)
0.635
±
0.25
(0.025
±
0.010)
12° NOM.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C
±
0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C
±
0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
3
Recommended Pb-Free IR Profile
TIME WITHIN 5
°C
of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
T
L
260 +0/-5
°C
217
°C
RAMP-UP
3
°C/SEC.
MAX.
150 - 200
°C
Regulatory Information
The HCPL-3180 has been
approved by the following
organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)
UL
Approval under UL 1577,
component recognition program
up to V
ISO
= 3750 V
rms
. File
E55361.
CSA
Approval under CSA Component
Acceptance Notice #5, File CA
88324.
TEMPERATURE
T
smax
T
smin
RAMP-DOWN
6
°C/SEC.
MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t
L
60 to 150 SEC.
t 25
°C
to PEAK
TIME
NOTES:
THE TIME FROM 25
°C
to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200
°C,
T
smin
= 150
°C
IEC/EN/DIN EN 60747-5-2 Insulation Characteristics (HCPL-3180 Option 060)
Description
Installation classification per DIN EN 0110 1997-04
for rated mains voltage
≤
150 V
rms
for rated mains voltage
≤
300 V
rms
for rated mains voltage
≤
600 V
rms
Climatic Classification
Pollution Degree (DIN EN 0110 1997-04)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
IORM
x 1.875=V
PR
, 100% Production Test with
t
m
=1 sec, Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5=V
PR
, Type and Sample Test, t
m
=60 sec,
Partial Discharge < 5 pC
Highest Allowable Overvoltage
(Transient Overvoltage t
ini
= 10 sec)
Safety-limiting values – maximum values allowed in the
event of a failure.
Case Temperature
Input Current**
Output Power**
Insulation Resistance at T
S
, V
IO
= 500 V
V
IORM
V
PR
Symbol
HCPL-3180
I - IV
I - III
I-II
55/100/21
2
630
1181
V
peak
V
peak
Unit
V
PR
V
IOTM
945
6000
V
peak
V
peak
T
S
I
S,INPUT
P
S, OUTPUT
R
S
175
230
600
>10
9
°C
mA
mW
Ω
* Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section IEC/EN/DIN
EN 60747-5-2 for a detailed description of Method a and Method b partial discharge test profiles.
** Refer to the following figure for dependence of P
S
and I
S
on ambient temperature.
4
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
800
700
600
500
400
300
200
100
0
0
25
50
75
100 125 150 175 200
P
S
(mW)
I
S
(mA)
T
S
– CASE TEMPERATURE –
°C
Insulation
and Safety Related Specifications
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
Symbol
L(101)
L(102)
HCPL-3180
7.1
7.4
0.08
Units
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance conductor to
conductor, usually the straight line distance
thickness between the emitter and detector.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
>175
IIIa
V
Note:
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Junction Temperature
Average Input Current
Peak Transient Input Current
(<1
µs
pulse width, 300 pps)
Reverse Input Voltage
“High” Peak Output Current
“Low” Peak Output Current
Supply Voltage
Output Voltage
Output Power Dissipation
Total Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
T
S
T
J
I
F(AVG)
I
F(TRAN)
V
R
I
OH(PEAK)
I
OL(PEAK)
V
CC
-V
EE
V
O(PEAK)
P
O
P
T
-0.5
0
Min.
-55
-40
Max.
125
125
25
1.0
5
2.5
2.5
25
V
CC
250
295
Units
°C
°C
mA
A
V
A
A
V
V
mW
mW
3
4
2
2
1
Note
260°C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
5
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