REAL TIME CLOCK, PDSO14, ROHS COMPLIANT, SOP-14
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Seiko Epson Corporation |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 14 |
Reach Compliance Code | unknown |
信息访问方法 | I2C |
JESD-30 代码 | R-PDSO-G14 |
JESD-609代码 | e3 |
长度 | 10.1 mm |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
座面最大高度 | 3.3 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 1.8 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 10 |
宽度 | 5 mm |
uPs/uCs/外围集成电路类型 | TIMER, MEMORY REFRESH |
RX-8581SA:B3 | RX-8581JE:B0:ROHS | RX-8581SA:B0:ROHS | RX-8581JE:B:ROHS | RX-8581NB:B3:ROHS | RX-8581SA:B3:ROHS | RX-8581JE:B3:ROHS | RX-8581NB:B0:ROHS | |
---|---|---|---|---|---|---|---|---|
描述 | REAL TIME CLOCK, PDSO14, ROHS COMPLIANT, SOP-14 | MEMORY REFRESH TIMER | MEMORY REFRESH TIMER, PDSO14, ROHS COMPLIANT, SOP-14 | MEMORY REFRESH TIMER | MEMORY REFRESH TIMER | MEMORY REFRESH TIMER, PDSO14, ROHS COMPLIANT, SOP-14 | MEMORY REFRESH TIMER | MEMORY REFRESH TIMER |
是否无铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation |
包装说明 | SOP, | SOJ, SSOJ20,.25 | SOP, | SOJ, SSOJ20,.25 | SON, SOLCC22,.2,20 | SOP, | SOJ, SSOJ20,.25 | SON, SOLCC22,.2,20 |
Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | compliant | compliant | compli |
信息访问方法 | I2C | SERIAL, 2 WIRE/I2C | I2C | SERIAL, 2 WIRE/I2C | SERIAL, 2 WIRE/I2C | I2C | SERIAL, 2 WIRE/I2C | SERIAL, 2 WIRE/I2C |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-J20 | R-PDSO-G14 | R-PDSO-J20 | R-PDSO-N22 | R-PDSO-G14 | R-PDSO-J20 | R-PDSO-N22 |
JESD-609代码 | e3 | e2 | e3 | e2 | e3/e2 | e3 | e2 | e3/e2 |
端子数量 | 14 | 20 | 14 | 20 | 22 | 14 | 20 | 22 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOJ | SOP | SOJ | SON | SOP | SOJ | SON |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin (Sn) | TIN SILVER | TIN | TIN SILVER | TIN/TIN SILVER | TIN | TIN SILVER | TIN/TIN SILVER |
端子形式 | GULL WING | J BEND | GULL WING | J BEND | NO LEAD | GULL WING | J BEND | NO LEAD |
端子节距 | 1.27 mm | 0.635 mm | 1.27 mm | 0.635 mm | 0.5 mm | 1.27 mm | 0.635 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
uPs/uCs/外围集成电路类型 | TIMER, MEMORY REFRESH | TIMER, MEMORY REFRESH | TIMER, MEMORY REFRESH | TIMER, MEMORY REFRESH | TIMER, MEMORY REFRESH | TIMER, MEMORY REFRESH | TIMER, MEMORY REFRESH | TIMER, MEMORY REFRESH |
中断能力 | - | Y | - | Y | Y | - | Y | Y |
封装等效代码 | - | SSOJ20,.25 | - | SSOJ20,.25 | SOLCC22,.2,20 | - | SSOJ20,.25 | SOLCC22,.2,20 |
电源 | - | 2/5 V | - | 2/5 V | 2/5 V | - | 2/5 V | 2/5 V |
认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
最短时间 | - | SECONDS | - | SECONDS | SECONDS | - | SECONDS | SECONDS |
易失性 | - | YES | - | YES | YES | - | YES | YES |
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