Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO28,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | TEMIC |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| CPU系列 | 8051 |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 3 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 256 |
| ROM（单词） | 16384 |
| ROM可编程性 | FLASH |
| 速度 | 40 MHz |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| T89C51CC02-TISIL | T89C51CC02-TDSIL | T89C51CC02-SISEM | T89C51CC02-6KSIM | T89C51CC02-SISIL | T89C51CC02-TDSIM | T89C51CC02-TISIM | T89C51CC02-SISIM | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO28, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO24, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PQCC28, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO28, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PQCC28, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO24, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO28, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PQCC28, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | TEMIC | TEMIC | TEMIC | TEMIC | TEMIC | TEMIC | TEMIC | TEMIC |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G24 | S-PQCC-J28 | R-PDSO-G28 | S-PQCC-J28 | R-PDSO-G24 | R-PDSO-G28 | S-PQCC-J28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 28 | 24 | 28 | 28 | 28 | 24 | 28 | 28 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | QCCJ | TSSOP | QCCJ | SOP | SOP | QCCJ |
| 封装等效代码 | SOP28,.4 | SOP24,.4 | LDCC28,.5SQ | TSSOP28,.25 | LDCC28,.5SQ | SOP24,.4 | SOP28,.4 | LDCC28,.5SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
| 电源 | 3 V | 3 V | 5 V | 5 V | 3 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| ROM（单词） | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 速度 | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| 标称供电电压 | 3 V | 3 V | 5 V | 5 V | 3 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | J BEND | GULL WING | J BEND | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.635 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD |
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