Low Cost, Low-Power 2.4 GHz RF Transceiver Designed for Low-Power Wireless Apps in the 2.4 GHz ISM B
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC20,.16SQ,20 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| JESD-30 代码 | S-PQCC-N20 |
| JESD-609代码 | e4 |
| 长度 | 4 mm |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC20,.16SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8/3.6 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.9 mm |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4 mm |
| CC2500RTKRG3 | CC2500-RTY1 | CC2500RGP | CC2500RTK | |
|---|---|---|---|---|
| 描述 | Low Cost, Low-Power 2.4 GHz RF Transceiver Designed for Low-Power Wireless Apps in the 2.4 GHz ISM B | RF Transceiver S-Chip Lo POW RF | RF Transceiver FSK/GFSK/MSK/OOK 20-Pin VQFN EP Tube | RF Transceiver 2.4GHz TRANSCEIVER CHIP |
| Brand Name | Texas Instruments | Texas Instruments | - | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 |
| 零件包装代码 | QFN | QFN | - | QFN |
| 包装说明 | HVQCCN, LCC20,.16SQ,20 | HVQCCN, LCC20,.16SQ,20 | - | HVQCCN, LCC20,.16SQ,20 |
| 针数 | 20 | 20 | - | 20 |
| Reach Compliance Code | compli | compli | - | compli |
| JESD-30 代码 | S-PQCC-N20 | S-PQCC-N20 | - | S-PQCC-N20 |
| JESD-609代码 | e4 | e4 | - | e4 |
| 长度 | 4 mm | 4 mm | - | 4 mm |
| 湿度敏感等级 | 3 | 3 | - | 3 |
| 功能数量 | 1 | 1 | - | 1 |
| 端子数量 | 20 | 20 | - | 20 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | - | HVQCCN |
| 封装等效代码 | LCC20,.16SQ,20 | LCC20,.16SQ,20 | - | LCC20,.16SQ,20 |
| 封装形状 | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 |
| 电源 | 1.8/3.6 V | 1.8/3.6 V | - | 1.8/3.6 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 0.9 mm | 0.9 mm | - | 0.9 mm |
| 标称供电电压 | 3 V | 3 V | - | 3 V |
| 表面贴装 | YES | YES | - | YES |
| 技术 | CMOS | CMOS | - | CMOS |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | - | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | - | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | - | 0.5 mm |
| 端子位置 | QUAD | QUAD | - | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 4 mm | 4 mm | - | 4 mm |
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