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MT48H16M32LFB5-75IT

产品描述Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, GREEN, PLASTIC, VFBGA-90
产品类别存储    存储   
文件大小2MB,共85页
制造商Micron Technology
官网地址http://www.mdtic.com.tw/
标准
下载文档 详细参数 全文预览

MT48H16M32LFB5-75IT概述

Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, GREEN, PLASTIC, VFBGA-90

MT48H16M32LFB5-75IT规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Micron Technology
包装说明VFBGA,
Reach Compliance Codecompliant
访问模式FOUR BANK PAGE BURST
最长访问时间5.4 ns
其他特性AUTO/SELF REFRESH
JESD-30 代码R-PBGA-B90
长度13 mm
内存密度536870912 bit
内存集成电路类型SYNCHRONOUS DRAM
内存宽度32
功能数量1
端口数量1
端子数量90
字数16777216 words
字数代码16000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织16MX32
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)NOT SPECIFIED
座面最大高度1 mm
自我刷新YES
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度8 mm

文档预览

下载PDF文档
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
Features
Mobile LPSDR SDRAM
MT48H32M16LF – 8 Meg x 16 x 4 Banks
MT48H16M32LF/LG – 4 Meg x 32 x 4 Banks
Features
V
DD
/V
DDQ
= 1.7–1.95V
Fully synchronous; all signals registered on positive
edge of system clock
Internal, pipelined operation; column address can
be changed every clock cycle
Four internal banks for concurrent operation
Programmable burst lengths: 1, 2, 4, 8, and continu-
ous
Auto precharge, includes concurrent auto precharge
Auto refresh and self refresh modes
LVTTL-compatible inputs and outputs
On-chip temperature sensor to control self refresh
rate
Partial-array self refresh (PASR)
Deep power-down (DPD)
Selectable output drive strength (DS)
64ms refresh period; 32ms for automotive tempera-
ture
Options
V
DD
/V
DDQ
: 1.8V/1.8V
Addressing
Standard addressing option
Reduced page size option
1
Configuration
32 Meg x 16 (8 Meg x 16 x 4 banks)
16 Meg x 32 (4 Meg x 32 x 4 banks)
Plastic “green” packages
54-ball VFBGA (8mm x 8mm)
2
90-ball VFBGA (8mm x 13mm)
3
Timing – cycle time
6ns at CL = 3
7.5ns at CL = 3
Power
Standard I
DD2
/I
DD7
Low-power I
DD2
/I
DD71
Operating temperature range
Commercial (0˚C to +70˚C)
Industrial (–40˚C to +85˚C)
Automotive (–40˚C to +105˚C)
Revision
Marking
H
LF
LG
32M16
16M32
B4
B5
-6
-75
None
L
None
IT
AT
:C
Notes:
1. Contact factory for availability.
2. Available only for x16 configuration.
3. Available only for x32 configuration.
Table 1: Configuration Addressing
Architecture
Number of banks
Bank address balls
Row address balls
Column address balls
Note: 1. Contact factory for availability.
32 Meg x 16
4
BA0, BA1
A[12:0]
A[9:0]
16 Meg x 32
4
BA0, BA1
A[12:0]
A[8:0]
16 Meg x 32 Reduced
Page Size Option
1
4
BA0, BA1
A[13:0]
A[7:0]
PDF: 09005aef83ea581f
512mb_mobile_sdram_y67m_at.pdf – Rev. B 3/11 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.

 
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