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MT48LC16M32S2F5-6

产品描述Synchronous DRAM, 16MX32, CMOS, PBGA90
产品类别存储    存储   
文件大小1MB,共56页
制造商Micron Technology
官网地址http://www.mdtic.com.tw/
下载文档 详细参数 选型对比 全文预览

MT48LC16M32S2F5-6概述

Synchronous DRAM, 16MX32, CMOS, PBGA90

MT48LC16M32S2F5-6规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Micron Technology
Reach Compliance Codeunknown
最大时钟频率 (fCLK)166 MHz
I/O 类型COMMON
交错的突发长度1,2,4,8
JESD-30 代码R-PBGA-B90
内存密度536870912 bit
内存集成电路类型SYNCHRONOUS DRAM
内存宽度32
端子数量90
字数16777216 words
字数代码16000000
最高工作温度70 °C
最低工作温度
组织16MX32
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码FBGA
封装等效代码BGA90,9X15,32
封装形状RECTANGULAR
封装形式GRID ARRAY, FINE PITCH
电源3.3 V
认证状态Not Qualified
刷新周期8192
连续突发长度1,2,4,8,FP
最大待机电流0.0024 A
最大压摆率0.375 mA
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM

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256Mb: x32
SDRAM
SYNCHRONOUS
DRAM
Features
• PC100 functionality
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal pipelined operation; column address can
be changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto Precharge, includes Concurrent Auto
Precharge, and Auto Refresh Modes
• Self Refresh Mode
• 64ms, 4,096-cycle refresh (15.6µs/row)
• LVTTL-compatible inputs and outputs
• Single +3.3V ±0.3V power supply
• Supports CAS latency of 1, 2, and 3
MT48LC8M32B2 - 2 MEG x 32 x 4 BANKS
For the latest data sheet, please refer to the Micron Web
site:
www.micron.com/dramds
Figure 1: Pin Assignment (Top View)
86-Pin TSOP
V
DD
DQ0
V
DD
Q
DQ1
DQ2
V
SS
Q
DQ3
DQ4
V
DD
Q
DQ5
DQ6
V
SS
Q
DQ7
NC
V
DD
DQM0
WE#
CAS#
RAS#
CS#
A11
BA0
BA1
A10
A0
A1
A2
DQM2
V
DD
NC
DQ16
V
SS
Q
DQ17
DQ18
V
DD
Q
DQ19
DQ20
V
SS
Q
DQ21
DQ22
V
DD
Q
DQ23
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
Options
Configuration
• 8 Meg x 32 (2 Meg x 32 x 4 banks)
Package
• 86-pin TSOP (400 mil)
• 86-pin TSOP (400 mil) lead-free
• 90-ball FBGA (8mm x 13mm)
• 90-ball FBGA (8mm x 13mm) lead-
free
Timing (Cycle Time)
• 6ns (166 MHz)
• 7ns (143 MHz)
Operating Temperature Range
• Commercial (0°C to +70°C)
• Industrial (-40°C to +85°C)
NOTE:
1. Available on -7 only.
Marking
8M32B2
TG
P
F5
B5
-6
-7
None
IT
1
NOTE:
V
SS
DQ15
V
SS
Q
DQ14
DQ13
V
DD
Q
DQ12
DQ11
V
SS
Q
DQ10
DQ9
V
DD
Q
DQ8
NC
V
SS
DQM1
NC
NC
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
DQM3
V
SS
NC
DQ31
V
DD
Q
DQ30
DQ29
V
SS
Q
DQ28
DQ27
V
DD
Q
DQ26
DQ25
V
SS
Q
DQ24
V
SS
The # symbol indicates signal is active LOW.
8 Meg x 32
Table 1:
Key Timing Parameters
ACCESS
TIME
CL = 3*
5.5ns
6.0ns
SETUP
TIME
1.5ns
2ns
HOLD
TIME
1ns
1ns
SPEED
CLOCK
GRADE FREQUENCY
-6
-7
166 MHz
143 MHz
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
2 Meg x 32 x 4 banks
4K
4K (A0–A11)
4 (BA0, BA1)
512 (A0–A8)
Part Number Example:
*CL = CAS (READ) latency
MT48LC8M32B2TG-7
1
09005aef8140ad6d
MT48LC8M32B2_1.fm - Rev. B 10/04 EN
©2003 Micron Technology, Inc. All rights reserved.

MT48LC16M32S2F5-6相似产品对比

MT48LC16M32S2F5-6 MT48LC8M32B2F5-7 MT48LC8M32B2P-7 MT48LC8M32B2TG-7 MT48LC8M32B2P-6 MT48LC16M32S2B5-6 MT48LC16M32S2B5-7 MT48LC16M32S2F5-7 MT48LC8M32B2F5-6
描述 Synchronous DRAM, 16MX32, CMOS, PBGA90 Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 8 X 13 MM, FBGA-90 Synchronous DRAM, 8MX32, 6ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP-86 Synchronous DRAM, 8MX32, 6ns, CMOS, PDSO86, 0.400 INCH, TSOP-86 Synchronous DRAM, 8MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP-86 Synchronous DRAM, 16MX32, CMOS, PBGA90 Synchronous DRAM, 16MX32, CMOS, PBGA90, 8 X13 MM, LEAD FREE, PLASTIC, FBGA-90 Synchronous DRAM, 16MX32, CMOS, PBGA90, 8 X13 MM, PLASTIC, FBGA-90 Synchronous DRAM, 8MX32, 5.5ns, CMOS, PBGA90, 8 X 13 MM, FBGA-90
是否Rohs认证 不符合 不符合 符合 不符合 符合 符合 符合 不符合 不符合
厂商名称 Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
Reach Compliance Code unknown unknown unknown not_compliant unknown unknown unknown not_compliant not_compliant
JESD-30 代码 R-PBGA-B90 R-PBGA-B90 R-PDSO-G86 R-PDSO-G86 R-PDSO-G86 R-PBGA-B90 R-PBGA-B90 R-PBGA-B90 R-PBGA-B90
内存密度 536870912 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 536870912 bit 536870912 bit 536870912 bit 268435456 bit
内存集成电路类型 SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
内存宽度 32 32 32 32 32 32 32 32 32
端子数量 90 90 86 86 86 90 90 90 90
字数 16777216 words 8388608 words 8388608 words 8388608 words 8388608 words 16777216 words 16777216 words 16777216 words 8388608 words
字数代码 16000000 8000000 8000000 8000000 8000000 16000000 16000000 16000000 8000000
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 16MX32 8MX32 8MX32 8MX32 8MX32 16MX32 16MX32 16MX32 8MX32
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FBGA VFBGA TSSOP TSSOP TSSOP FBGA LFBGA LFBGA VFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 BALL BALL GULL WING GULL WING GULL WING BALL BALL BALL BALL
端子节距 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM DUAL DUAL DUAL BOTTOM BOTTOM BOTTOM BOTTOM
最大时钟频率 (fCLK) 166 MHz 143 MHz 143 MHz 143 MHz 166 MHz 166 MHz - - 166 MHz
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON - - COMMON
交错的突发长度 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 - - 1,2,4,8
封装等效代码 BGA90,9X15,32 BGA90,9X15,32 TSSOP86,.46,20 TSSOP86,.46,20 TSSOP86,.46,20 BGA90,9X15,32 - - BGA90,9X15,32
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - - 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - - Not Qualified
刷新周期 8192 4096 4096 4096 4096 8192 - - 4096
连续突发长度 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP - - 1,2,4,8,FP
最大待机电流 0.0024 A 0.0012 A 0.0012 A 0.0012 A 0.0012 A 0.0024 A - - 0.0012 A
最大压摆率 0.375 mA 0.295 mA 0.295 mA 0.295 mA 0.335 mA 0.375 mA - - 0.335 mA
零件包装代码 - BGA TSOP TSOP TSOP - BGA BGA BGA
包装说明 - 8 X 13 MM, FBGA-90 TSSOP, TSSOP86,.46,20 0.400 INCH, TSOP-86 TSSOP, TSSOP86,.46,20 FBGA, BGA90,9X15,32 LFBGA, 8 X13 MM, PLASTIC, FBGA-90 8 X 13 MM, FBGA-90
针数 - 90 86 86 86 - 90 90 90
ECCN代码 - EAR99 EAR99 EAR99 EAR99 - EAR99 EAR99 EAR99
访问模式 - FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST - FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
最长访问时间 - 6 ns 6 ns 6 ns 5.5 ns - - - 5.5 ns
其他特性 - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-609代码 - e0 e3 e0 e3 - e1 e0 e0
长度 - 13 mm 22.22 mm 22.22 mm 22.22 mm - 13 mm 13 mm 13 mm
功能数量 - 1 1 1 1 - 1 1 1
端口数量 - 1 1 1 1 - 1 1 1
工作模式 - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
峰值回流温度(摄氏度) - 235 260 235 260 - - - 235
座面最大高度 - 1 mm 1.2 mm 1.2 mm 1.2 mm - 1.4 mm 1.4 mm 1 mm
自我刷新 - YES YES YES YES - YES YES YES
最大供电电压 (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) - 3 V 3 V 3 V 3 V - 3 V 3 V 3 V
端子面层 - Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead/Silver (Sn/Pb/Ag) Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间 - 30 30 30 30 - - - 30
宽度 - 8 mm 10.16 mm 10.16 mm 10.16 mm - 8 mm 8 mm 8 mm

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