IC BUFFER NON-INV DUAL LP X2SON6
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Nexperia |
包装说明 | X2SON-6 |
Reach Compliance Code | compliant |
系列 | AUP/ULP/V |
JESD-30 代码 | R-PBCC-B6 |
JESD-609代码 | e4 |
长度 | 1 mm |
逻辑集成电路类型 | BUFFER |
湿度敏感等级 | 1 |
功能数量 | 2 |
输入次数 | 1 |
端子数量 | 6 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVBCC |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
传播延迟(tpd) | 20.8 ns |
座面最大高度 | 0.35 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 0.8 V |
标称供电电压 (Vsup) | 1.1 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | BUTT |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 0.8 mm |
935307072147 | 74AUP2G34GF,132 | 74AUP2G34GN,132 | 74AUP2G34GXZ | 74AUP2G34GS,132 | 74AUP2G34GM,115 | 74AUP2G34GM,132 | 935307072125 | |
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描述 | IC BUFFER NON-INV DUAL LP X2SON6 | IC BUFFER NON-INVERT 3.6V 6XSON | IC BUFFER NON-INVERT 3.6V 6XSON | IC BUF NON-INVERT 3.6V 6X2SON | IC BUFFER NON-INVERT 3.6V 6XSON | 74AUP2G34 - Low-power dual buffer SON 6-Pin | Buffer, AUP/ULP/V Series, 2-Func, 1-Input, CMOS, PBCC6 | |
厂商名称 | Nexperia | Nexperia | Nexperia | - | Nexperia | Nexperia | Nexperia | - |
包装说明 | X2SON-6 | VSON, | SON, | - | 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 | VSON, | VSON, | HVBCC, |
Reach Compliance Code | compliant | compliant | compliant | - | compliant | compliant | compliant | unknown |
系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | - | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
JESD-30 代码 | R-PBCC-B6 | S-PDSO-N6 | R-PDSO-N6 | - | S-PDSO-N6 | R-PDSO-N6 | R-PDSO-N6 | R-PBCC-B6 |
JESD-609代码 | e4 | e3 | e3 | - | e3 | e3 | e3 | - |
长度 | 1 mm | 1 mm | 1 mm | - | 1 mm | 1.45 mm | 1.45 mm | 1 mm |
逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | - | BUFFER | BUFFER | BUFFER | BUFFER |
湿度敏感等级 | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
功能数量 | 2 | 1 | 1 | - | 1 | 1 | 1 | 2 |
输入次数 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 6 | 6 | 6 | - | 6 | 6 | 6 | 6 |
最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVBCC | VSON | SON | - | VSON | VSON | VSON | HVBCC |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
传播延迟(tpd) | 20.8 ns | 20.8 ns | 20.8 ns | - | 20.8 ns | 20.8 ns | 20.8 ns | 20.8 ns |
座面最大高度 | 0.35 mm | 0.5 mm | 0.35 mm | - | 0.35 mm | 0.5 mm | 0.5 mm | 0.35 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | - | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
表面贴装 | YES | YES | YES | - | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Tin (Sn) | - | Tin (Sn) | Tin (Sn) | Tin (Sn) | - |
端子形式 | BUTT | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | BUTT |
端子位置 | BOTTOM | DUAL | DUAL | - | DUAL | DUAL | DUAL | BOTTOM |
宽度 | 0.8 mm | 1 mm | 0.9 mm | - | 1 mm | 1 mm | 1 mm | 0.8 mm |
Brand Name | - | Nexperia | Nexperia | - | Nexperia | Nexperia | Nexperia | - |
制造商包装代码 | - | SOT891 | SOT1115 | - | SOT1202 | SOT886 | SOT886 | - |
Samacsys Description | - | 74AUP2G34 - Low-power dual buffer@en-us | 74AUP2G34 - Low-power dual buffer@en-us | - | 74AUP2G34 - Low-power dual buffer@en-us | 74AUP2G34 - Low-power dual buffer@en-us | 74AUP2G34 - Low-power dual buffer@en-us | - |
端子节距 | - | 0.35 mm | 0.3 mm | - | 0.35 mm | 0.5 mm | 0.5 mm | - |
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