DUAL OP-AMP, 3000uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| parentfamilyid | 4194119 |
| 厂商名称 | ST(意法半导体) |
| Objectid | 1482483564 |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| compound_id | 4991645 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.00015 µA |
| 标称共模抑制比 | 80 dB |
| 频率补偿 | YES |
| 最大输入失调电压 | 3000 µV |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 4.4 mm |
| 低-偏置 | YES |
| 低-失调 | NO |
| 微功率 | NO |
| 负供电电压上限 | |
| 标称负供电电压 (Vsup) | |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 功率 | NO |
| 电源 | 10 V |
| 可编程功率 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 标称压摆率 | 5.5 V/us |
| 最大压摆率 | 3.2 mA |
| 供电电压上限 | 18 V |
| 标称供电电压 (Vsup) | 10 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 标称均一增益带宽 | 3500 kHz |
| 最小电压增益 | 7000 |
| 宽带 | NO |
| 宽度 | 3 mm |

| TS272BCP | TS272AMD | TS272AIP | TS272AMP | TS272BMP | TS272ACP | TS272BIP | |
|---|---|---|---|---|---|---|---|
| 描述 | DUAL OP-AMP, 3000uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 6500uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, MICRO, PLASTIC, SO-8 | DUAL OP-AMP, 6500uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 6500uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 3000uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 6500uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 | DUAL OP-AMP, 3000uV OFFSET-MAX, 3.5MHz BAND WIDTH, PDSO8, TSSOP-8 |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | not_compliant | _compli | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.00015 µA | 0.0003 µA | 0.0003 µA | 0.0003 µA | 0.0003 µA | 0.00015 µA | 0.0003 µA |
| 标称共模抑制比 | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB |
| 频率补偿 | YES | YES | YES | YES | YES | YES | YES |
| 最大输入失调电压 | 3000 µV | 6500 µV | 6500 µV | 6500 µV | 3000 µV | 6500 µV | 3000 µV |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e0 | e4 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 4.4 mm | 4.9 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| 低-偏置 | YES | YES | YES | YES | YES | YES | YES |
| 低-失调 | NO | NO | NO | NO | NO | NO | NO |
| 微功率 | NO | NO | NO | NO | NO | NO | NO |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -40 °C | -55 °C | -55 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP8,.25 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 功率 | NO | NO | NO | NO | NO | NO | NO |
| 电源 | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
| 可编程功率 | NO | NO | NO | NO | NO | NO | NO |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.75 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 标称压摆率 | 5.5 V/us | 5.5 V/us | 5.5 V/us | 5.5 V/us | 5.5 V/us | 5.5 V/us | 5.5 V/us |
| 最大压摆率 | 3.2 mA | 3.4 mA | 3.4 mA | 3.4 mA | 3.4 mA | 3.2 mA | 3.4 mA |
| 供电电压上限 | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| 标称供电电压 (Vsup) | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | AUTOMOTIVE | MILITARY | MILITARY | COMMERCIAL | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 标称均一增益带宽 | 3500 kHz | 3500 kHz | 3500 kHz | 3500 kHz | 3500 kHz | 3500 kHz | 3500 kHz |
| 最小电压增益 | 7000 | 6000 | 6000 | 6000 | 6000 | 7000 | 6000 |
| 宽带 | NO | NO | NO | NO | NO | NO | NO |
| 宽度 | 3 mm | 3.9 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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