1 CHANNEL(S), 400Mbps, SERIAL COMM CONTROLLER, PQFP100, PLASTIC, QFP-100
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, |
| 针数 | 100 |
| Reach Compliance Code | unknown |
| 地址总线宽度 | 32 |
| 总线兼容性 | CARDBUS; VGA |
| 最大数据传输速率 | 132 MBps |
| 驱动器接口标准 | IEEE 1394 |
| 外部数据总线宽度 | 32 |
| JESD-30 代码 | S-PQFP-G100 |
| 长度 | 14 mm |
| 端子数量 | 100 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 14 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI |
| TSB12LV23APZ | TSB12LV23PZ | TSB12LV23PZR | TSB12LV23APZT | |
|---|---|---|---|---|
| 描述 | 1 CHANNEL(S), 400Mbps, SERIAL COMM CONTROLLER, PQFP100, PLASTIC, QFP-100 | OHCI-Lynx - PCI to 1394 3.3V Open Host Controller Interface Link Layer w/32-bit PCI I/F, 8K FIFOs 100-LQFP | PCI BUS CONTROLLER, PQFP100, PLASTIC, QFP-100 | IEEE 1394-1995, 1394a Serial Link Layer Controller 100-TQFP 0 to 70 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | LFQFP, | LFQFP, QFP100,.63SQ,20 | LFQFP, | TFQFP, |
| 针数 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown |
| 地址总线宽度 | 32 | 32 | 32 | 32 |
| 最大数据传输速率 | 132 MBps | 50 MBps | 50 MBps | 132 MBps |
| 驱动器接口标准 | IEEE 1394 | IEEE 1394 | IEEE 1394 | IEEE 1394 |
| 外部数据总线宽度 | 32 | 8 | 8 | 32 |
| JESD-30 代码 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 |
| 长度 | 14 mm | 14 mm | 14 mm | 14 mm |
| 端子数量 | 100 | 100 | 100 | 100 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFQFP | LFQFP | TFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.2 mm |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI |
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