DATA SHEET
µ
PC2747TB,
µ
PC2748TB
3 V, SUPER MINIMOLD SILICON MMIC
AMPLIFIER FOR MOBILE COMMUMICATIONS
BIPOLAR ANALOG INTEGRATED CIRCUITS
DESCRIPTION
The
µ
PC2747TB,
µ
PC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile
communications. These ICs are packaged in super minimold package which is smaller than conventional minimold.
The
µ
PC2747TB,
µ
PC2748TB have compatible pin connections and performance to
µ
PC2747T,
µ
PC2748T of
conventional minimold version. So, in the case of reducing your system size,
µ
PC2747TB,
µ
PC2748TB are suitable
to replace from
µ
PC2747T,
µ
PC2748T.
These ICs are manufactured using NEC’s 20 GHz f
T
NESAT
TM
lll silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.
FEATURES
• High-density surface mounting
• Supply voltage
• Noise figure
• Upper limit operating frequency
: 6-pin super minimold package
: V
CC
= 2.7 to 3.3 V
:
µ
PC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz
:
µ
PC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz
:
µ
PC2747TB ; f
u
= 1.8 GHz TYP.
:
µ
PC2748TB ; f
u
= 1.5 GHz TYP.
APPLICATION
• Buffer amplifiers for mobile telephones, etc. (PDC800M, GSM)
ORDERING INFORMATION
Part Number
Package
6-pin super minimold
Marking
C1S
C1T
Supplying Form
Embossed tape 8 mm wide.
1, 2, 3 pins face to perforation side of the tape.
Qty 3 kp/reel.
µ
PC2747TB-E3
µ
PC2748TB-E3
Remark
To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
µ
PC2747TB,
µ
PC2748TB)
Caution
Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P13444EJ2V0DS00 (2nd edition)
Date Published June 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1998, 1999
µ
PC2747TB,
µ
PC2748TB
PIN CONNECTIONS
Pin No.
Pin Name
INPUT
GND
GND
OUTPUT
GND
V
CC
(Top View)
(Bottom View)
4
5
6
4
5
6
3
2
1
1
2
3
4
5
6
2
1
Marking is an example of
µ
PC2747TB
PRODUCT LINE-UP (T
A
= +25°C, V
CC
= 3.0 V, Z
L
= Z
S
= 50
Ω
)
Part No.
f
u
(GHz)
1.8
P
O(sat)
(dBm)
–7.0
G
P
(dB)
12
NF (dB)
3.3
I
CC
(mA)
5.0
6-pin super minimold
6-pin minimold
0.2 to 1.5
–3.5
19
2.8
6.0
6-pin super minimold
C1T
Package
6-pin minimold
C1S
Marking
µ
PC2747T
µ
PC2747TB
µ
PC2748T
µ
PC2748TB
Remark
Notice
Typical performance. Please refer to
ELECTRICAL CHARACTERISTICS
in detail.
The package size distinguishes between minimold and super minimold.
SYSTEM APPLICATION EXAMPLE
EXAMPLE OF 900 MHz BAND DIGITAL CELLULER TELEPHONE
Digtal Cellular System Block Diagram
RX
DEMO
I
Q
C1S
3
PSC+PLL
SW
PLL
I
0˚
TX
PA
φ
90˚
Q
:
µ
PC2747TB,
µ
PC2748TB applicable
2
Data Sheet P13444EJ2V0DS00
µ
PC2747TB,
µ
PC2748TB
PIN EXPLANATION
Applied
Voltage
(V)
0.80
Pin
Voltage
(V)
Note
Pin
No.
1
Pin
Name
INPUT
Function and Applications
Internal Equivalent Circuit
0.80
4
OUTPUT
Signal input pin. A internal matching circuit,
configured with resistors, enables 50
Ω
connection over a wide band. This pin must
be coupled to signal source with capacitor
for DC cut.
Signal output pin. A internal matching
circuit, configured with resistors, enables 50
Ω
connection over a wide band. This pin
must be coupled to next stage with capacitor
for DC cut.
Power supply pin. This pin should be
externally equipped with bypass capacity to
minimize ground impedance.
Ground pin. This pin should be connected to
system ground with minimum inductance.
Ground pattern on the board should be
formed as wide as possible. All the ground
pins must be connected together with wide
ground pattern to decrease impedance
difference.
3
GND
2
GND
5
6
V
CC
4
OUT
2.79
IN
1
*
2.72
6
V
CC
2.7 to
3.3
2
3
5
GND
0
The above diagram is for the
µ
PC2747TB.
The resistor marked with an asterisk does
not exist in the
µ
PC2748TB.
Note
Pin voltage is measured at V
CC
= 3.0 V. Above:
µ
PC2747TB, Below:
µ
PC2748TB
Data Sheet P13444EJ2V0DS00
3
µ
PC2747TB,
µ
PC2748TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Circuit Current
Power Dissipation
Symbol
V
CC
I
CC
P
D
T
A
= +25°C
T
A
= +25°C
Mounted on double sided copper clad
50
×
50
×
1.6 mm epoxy glass PWB (T
A
= +85°C)
Conditions
Ratings
4.0
15
200
−40
to +85
−55
to +150
T
A
= +25°C
0
Unit
V
mA
mW
Operating Ambient Temperature
Storage Temperature
Input Power Level
T
A
T
stg
P
in
°C
°C
dBm
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Operating Ambient Temperature
Symbol
V
CC
T
A
MIN.
2.7
−40
TYP.
3.0
+25
MAX.
3.3
+85
Unit
V
°C
ELECTRICAL CHARACTERISTICS (T
A
= +25°C, V
CC
= 3.0 V, Z
S
= Z
L
= 50
Ω
)
°
µ
PC2747TB
Parameter
Circuit Current
Power Gain
Maximum Output Level
Symbol
I
CC
G
P
P
O(sat)
Test Conditions
MIN.
No Signal
f = 900 MHz
f = 900 MHz
P
in
= –8 dBm
f = 900 MHz
3 dB down below
from gain at
f = 900 MHz
3 dB down below
from gain at
f = 900 MHz
f = 900 MHz
f = 900 MHz
f = 900 MHz
3.8
9
–9.5
TYP.
5.0
12
–7.0
MAX.
7.0
14
–
MIN.
4.5
16
–6.0
TYP.
6.0
19
–3.5
MAX.
8.0
21
–
mA
dB
dBm
µ
PC2748TB
Unit
Noise Figure
Upper Limit Operating Frequency
NF
f
u
–
1.5
3.3
1.8
4.5
–
–
1.2
2.8
1.5
4.0
–
dB
GHz
Lower Limit Operating Frequency
f
L
–
–
–
–
0.2
0.4
GHz
Isolation
Input Return Loss
Output Return Loss
ISL
RL
in
RL
out
35
11
7
40
14
10
–
–
–
35
8.5
5.5
40
11.5
8.5
–
–
–
dB
dB
dB
4
Data Sheet P13444EJ2V0DS00
µ
PC2747TB,
µ
PC2748TB
STANDARD CHARACTERISTICS FOR REFERENCE (T
A
= +25
°
C, Z
L
= Z
S
= 50
Ω
)
Reference
Parameter
Circuit Current
Symbol
I
CC
Test Conditions
V
CC
= 1.8 V,
No signals
V
CC
= 1.8 V,
f = 900 MHz
V
CC
= 1.8 V,
f = 900MHz,
Pin =
−8
dBm
V
CC
= 1.8 V,
f = 900 MHz
V
CC
= 1.8 V,
3 dB down below
from gain at
f = 900 MHz
V
CC
= 1.8 V,
3 dB down below
from gain at
f = 900 MHz
V
CC
= 1.8 V,
f = 900MHz
V
CC
= 1.8 V,
f = 900MHz
V
CC
= 1.8 V,
f = 900MHz
V
CC
= 3.0 V,
P
out
=
−20
dBm,
f
1
= 900 MHz,
f
2
= 902 MHz
V
CC
= 1.8 V,
P
out
=
−20
dBm,
f
1
= 900 MHz,
f
2
= 902 MHz
µ
PC2747TB
3.0
µ
PC2748B
3.5
Unit
mA
Power Gain
G
P
5.5
−13.7
11.5
−10.0
dB
Maximum Output Level
P
O(sat)
dBm
Noise Figure
NF
5.2
4.5
dB
Upper Limit Operating Frequency
f
u
1.8
1.5
GHz
Lower Limit Operating Frequency
f
L
0.2
GHz
Isolation
ISL
34
34
dB
Input Return Loss
RL
in
11
10
dB
Output Return Loss
RL
out
13
−34
12
−38
dB
3rd Order Intermodulation Distortion
IM
3
dBc
−20
−28
Data Sheet P13444EJ2V0DS00
5
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