PLL/Frequency Synthesis Circuit
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFN |
包装说明 | QCCN, |
针数 | 36 |
Reach Compliance Code | compliant |
JESD-30 代码 | S-XQCC-N36 |
JESD-609代码 | e0 |
长度 | 9 mm |
功能数量 | 1 |
端子数量 | 36 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | UNSPECIFIED |
封装代码 | QCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 225 |
认证状态 | Not Qualified |
座面最大高度 | 2.8 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
电信集成电路类型 | ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 0.635 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 9 mm |
M2005-01-666.5143 | M2005-01-644.5313 | M2005-01-625.0000 | M2005-01-622.0800 | M2005-01-627.3296 | |
---|---|---|---|---|---|
描述 | PLL/Frequency Synthesis Circuit | Support Circuit, 1-Func, 9 X 9 MM, SMT-36 | Support Circuit, 1-Func, 9 X 9 MM, SMT-36 | Support Circuit, 1-Func, 9 X 9 MM, SMT-36 | Support Circuit, 1-Func, 9 X 9 MM, SMT-36 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QFN | QFN | QFN | QFN | QFN |
包装说明 | QCCN, | QCCN, | QCCN, | QCCN, | QCCN, |
针数 | 36 | 36 | 36 | 36 | 36 |
Reach Compliance Code | compliant | compli | compliant | compliant | compliant |
JESD-30 代码 | S-XQCC-N36 | S-XQCC-N36 | S-XQCC-N36 | S-XQCC-N36 | S-XQCC-N36 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
长度 | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 36 | 36 | 36 | 36 | 36 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | QCCN | QCCN | QCCN | QCCN | QCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES |
电信集成电路类型 | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
宽度 | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm |
厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved