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SKIIP1213GB171-3DUW

产品描述Half Bridge Based Peripheral Driver
产品类别模拟混合信号IC    驱动程序和接口   
文件大小26KB,共1页
制造商SEMIKRON
官网地址http://www.semikron.com
下载文档 详细参数 选型对比 全文预览

SKIIP1213GB171-3DUW概述

Half Bridge Based Peripheral Driver

SKIIP1213GB171-3DUW规格参数

参数名称属性值
厂商名称SEMIKRON
包装说明,
Reach Compliance Codeunknown
ECCN代码EAR99
内置保护TRANSIENT
接口集成电路类型HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码R-XXMA-X
功能数量3
输出电流流向SOURCE AND SINK
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
表面贴装NO
端子形式UNSPECIFIED
端子位置UNSPECIFIED

文档预览

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SKiiP 1213GB171-3DL
I. Power section 3 * SKiiP413GB171CT per phase
Absolute maximum ratings
Symbol
Conditions
1)
Values
1700
1200
±
20
1200 (900)
1200 (900)
12960
840
-40...+150 (125)
4000
3 * 500
Units
V
V
V
A
A
A
2
kA s
°C
V
A
IGBT
V
CES
V
CC
Operating DC link voltage
V
GES
I
C
T
heat sink
= 25 (70) °C
Inverse diode
I
F
T
heat sink
= 25 (70) °C
I
FSM
T
j
= 150 °C, t
p
= 10ms; sin
2
I t (Diode) Diode, T
j
= 150 °C, 10ms
T
j
, (T
stg
)
V
isol
AC, 1min.
3)
I
C-package
T
heat sink
= 70°C, T
term
=115°C
®
SKiiP
®
3
SK integrated intelligent
Power PACK
2-pack
SKiiP 1213GB171-3DL
2)
Target data
housing S33
Characteristics
Symbol
IGBT
5)
V
CEsat
V
CEO
r
CE
E
on
+ E
off
I
CES
L
CE
R
CC´-EE´
4)
Conditions
1)
min.
typ.
max.
Units
V
V
mΩ
mJ
mJ
mA
nH
mΩ
V
V
mΩ
mJ
mJ
°C/W
°C/W
°C/W
A
A
I
C
= 900A, T
j
= 25 (125)°C
V
GE
= 15V; T
j
= 25 (125) °C
V
GE
= 15V; T
j
= 25 (125) °C
I
C
=900A
Vcc=900V
T
j
=125°C
Vcc=1200V
V
GE
=0,V
CE
=V
CES
,T
j
=25(125) °C
top, bottom
resistance, terminal-chip
2,7 (3,1)
3,2
1,5 (1,6) 1,7 (1,8)
1,4 (1,9) 1,8 (2,2)
900
1327
3,6 (216)
4
0,13
2,0 (1,8)
2,3
1,5 (1,2) 1,7 (1,4)
0,7 (0,8) 0,8 (0,9)
108
158
3 * 400
3 * 500
0,021
0,042
0,033
Inverse diode
5)
V
F
= V
EC
I
F
= 900A; T
j
= 25(125) °C
V
TO
T
j
= 25 (125) °C
r
T
T
j
= 25 (125) °C
I
C
=900A
Vcc=900V
4)
E
RR
T
j
=125°C
Vcc=1200V
Thermal characteristics
R
thjs
per IGBT
R
thjs
per diode
2)
R
thsa
L: P16 heat sink; 280 m3/ h
Current sensor
I
p RMS
T
a
=100° C , V
supply
=
±
15V
I
pmax RMS
t
2 s, T
a
=100° C
Mechanical data
M1
DC terminals, SI Units
M2
AC terminals, SI Units
Features
SKiiP technology inside
-
pressure contact of ceramic
to heat sink; low thermal
impedance
-
pressure contact of main
electric terminals
-
pressure contact of auxiliary
electric terminals
-
increased thermal cycling
capability
-
low stray inductance
-
homogenous current
distribution
CAL diode technology
integrated current sensor
integrated temperature sensor
high power density
1)
2)
4
8
6
10
Nm
Nm
3)
4)
5)
8)
T
heatsink
= 25 °C, unless
otherwise specified
D integrated gate driver
U with DC-bus voltage
measurement (option for GB)
L mounted on standard heat
sink for forced air cooling
W mounted on standard liquid
cooled heat sink
T
term
= temperature of terminal
with SKiiP 3 gate driver
Measured at chip level
external paralleling necessary
This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee,
expressed or implied is made regarding delivery, performance or suitability.
B 7
24
25.01.01 09:41
©by
SEMIKRON

SKIIP1213GB171-3DUW相似产品对比

SKIIP1213GB171-3DUW SKIIP1213GB171-3DL SKIIP1213GB171-3DUL SKIIP1213GB171-3DW
描述 Half Bridge Based Peripheral Driver Half Bridge Based Peripheral Driver Half Bridge Based Peripheral Driver Half Bridge Based Peripheral Driver
厂商名称 SEMIKRON SEMIKRON SEMIKRON SEMIKRON
Reach Compliance Code unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99
内置保护 TRANSIENT TRANSIENT TRANSIENT TRANSIENT
接口集成电路类型 HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码 R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X
功能数量 3 3 3 3
输出电流流向 SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 NO NO NO NO
端子形式 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
端子位置 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
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