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BDS16XSMD

产品描述Power Bipolar Transistor, 8A I(C), 120V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AB, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN
产品类别分立半导体    晶体管   
文件大小47KB,共2页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
下载文档 详细参数 选型对比 全文预览

BDS16XSMD概述

Power Bipolar Transistor, 8A I(C), 120V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AB, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN

BDS16XSMD规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称TT Electronics plc
包装说明HERMETIC SEALED, CERAMIC, SMD1, 3 PIN
Reach Compliance Codecompliant
ECCN代码EAR99
外壳连接COLLECTOR
最大集电极电流 (IC)8 A
集电极-发射极最大电压120 V
配置SINGLE
最小直流电流增益 (hFE)15
JEDEC-95代码TO-276AB
JESD-30 代码R-CBCC-N3
元件数量1
端子数量3
最高工作温度200 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式CHIP CARRIER
峰值回流温度(摄氏度)NOT SPECIFIED
极性/信道类型NPN
认证状态Not Qualified
表面贴装YES
端子形式NO LEAD
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用SWITCHING
晶体管元件材料SILICON
标称过渡频率 (fT)30 MHz

BDS16XSMD相似产品对比

BDS16XSMD BDS16XSMD05 BDS17XSMD05 BDS17XSMD BDS16X BDS17X
描述 Power Bipolar Transistor, 8A I(C), 120V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AB, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN Power Bipolar Transistor, 8A I(C), 120V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AA, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETIC SEALED, CERAMIC, SMD05, 3 PIN Power Bipolar Transistor, 8A I(C), 150V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AA, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETIC SEALED, CERAMIC, SMD05, 3 PIN Power Bipolar Transistor, 8A I(C), 150V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AB, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETIC SEALED, CERAMIC, SMD1, 3 PIN Power Bipolar Transistor, 8A I(C), 120V V(BR)CEO, 1-Element, NPN, Silicon, TO-220AB, Metal, 3 Pin, HERMETIC SEALED, METAL, TO-220M, 3 PIN Power Bipolar Transistor, 8A I(C), 150V V(BR)CEO, 1-Element, NPN, Silicon, TO-220AB, Metal, 3 Pin, HERMETIC SEALED, METAL, TO-220M, 3 PIN
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
包装说明 HERMETIC SEALED, CERAMIC, SMD1, 3 PIN HERMETIC SEALED, CERAMIC, SMD05, 3 PIN HERMETIC SEALED, CERAMIC, SMD05, 3 PIN HERMETIC SEALED, CERAMIC, SMD1, 3 PIN HERMETIC SEALED, METAL, TO-220M, 3 PIN HERMETIC SEALED, METAL, TO-220M, 3 PIN
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
外壳连接 COLLECTOR COLLECTOR COLLECTOR COLLECTOR ISOLATED ISOLATED
最大集电极电流 (IC) 8 A 8 A 8 A 8 A 8 A 8 A
集电极-发射极最大电压 120 V 120 V 150 V 150 V 120 V 150 V
配置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
最小直流电流增益 (hFE) 15 15 15 15 15 15
JEDEC-95代码 TO-276AB TO-276AA TO-276AA TO-276AB TO-220AB TO-220AB
JESD-30 代码 R-CBCC-N3 R-CBCC-N3 R-CBCC-N3 R-CBCC-N3 R-MSFM-T3 R-MSFM-T3
元件数量 1 1 1 1 1 1
端子数量 3 3 3 3 3 3
最高工作温度 200 °C 200 °C 200 °C 200 °C 200 °C 200 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED METAL METAL
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER FLANGE MOUNT FLANGE MOUNT
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
极性/信道类型 NPN NPN NPN NPN NPN NPN
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES NO NO
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM SINGLE SINGLE
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON
标称过渡频率 (fT) 30 MHz 30 MHz 30 MHz 30 MHz 30 MHz 30 MHz

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