DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | SOP, |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 座面最大高度 | 1.75 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 电信集成电路类型 | SUPPORT CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| 935290454112 | 935303555118 | 935303555112 | TJF1051T/3 | 935290454118 | 935303553118 | 935295735118 | 935300644118 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO8 | DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO8 | DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO8 | DATACOM, ETHERNET TRANSCEIVER, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 | DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO8 | DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO8 | DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO8 | DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO8 |
| 包装说明 | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, |
| Reach Compliance Code | compliant | compliant | unknown | compliant | compliant | unknown | unknown | compliant |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 105 °C | 105 °C | 105 °C | 85 °C | 105 °C | 105 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 电信集成电路类型 | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | ETHERNET TRANSCEIVER | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
微控制器 MCU
嵌入式系统
stm32/stm8
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ST MEMS传感器创意设计大赛专区
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