TELECOM, SURGE PROTECTION CIRCUIT, CXSS3, ROHS COMPLIANT, CERAMIC, PACKAGE-3
参数名称 | 属性值 |
厂商名称 | TE Connectivity(泰科) |
包装说明 | , |
Reach Compliance Code | unknown |
JESD-30 代码 | O-GXSS-W3 |
功能数量 | 1 |
端子数量 | 3 |
最高工作温度 | 90 °C |
最低工作温度 | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装形状 | ROUND |
封装形式 | SPECIAL SHAPE |
表面贴装 | NO |
电信集成电路类型 | SURGE PROTECTION CIRCUIT |
温度等级 | INDUSTRIAL |
端子形式 | WIRE |
端子位置 | UNSPECIFIED |
GTCA38-501M-R10-FS2 | GTCA38-501M-R10 | GTCA38-231M-R10-FS2 | |
---|---|---|---|
描述 | TELECOM, SURGE PROTECTION CIRCUIT, CXSS3, ROHS COMPLIANT, CERAMIC, PACKAGE-3 | TELECOM, SURGE PROTECTION CIRCUIT, CXSS3, ROHS COMPLIANT, CERAMIC, PACKAGE-3 | TELECOM, SURGE PROTECTION CIRCUIT, CXSS3, ROHS COMPLIANT, CERAMIC, PACKAGE-3 |
厂商名称 | TE Connectivity(泰科) | TE Connectivity(泰科) | TE Connectivity(泰科) |
Reach Compliance Code | unknown | unknown | unknown |
JESD-30 代码 | O-GXSS-W3 | O-GXSS-W3 | O-GXSS-W3 |
功能数量 | 1 | 1 | 1 |
端子数量 | 3 | 3 | 3 |
最高工作温度 | 90 °C | 90 °C | 90 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装形状 | ROUND | ROUND | ROUND |
封装形式 | SPECIAL SHAPE | SPECIAL SHAPE | SPECIAL SHAPE |
表面贴装 | NO | NO | NO |
电信集成电路类型 | SURGE PROTECTION CIRCUIT | SURGE PROTECTION CIRCUIT | SURGE PROTECTION CIRCUIT |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | WIRE | WIRE | WIRE |
端子位置 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved