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IDT2309B-1HDCI8

产品描述PLL Based Clock Driver, 2309 Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, SOIC-16
产品类别逻辑    逻辑   
文件大小166KB,共10页
制造商IDT (Integrated Device Technology)
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IDT2309B-1HDCI8概述

PLL Based Clock Driver, 2309 Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, SOIC-16

IDT2309B-1HDCI8规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码SOIC
包装说明SOP,
针数16
Reach Compliance Code_compli
系列2309
输入调节STANDARD
JESD-30 代码R-PDSO-G16
JESD-609代码e0
长度9.9314 mm
逻辑集成电路类型PLL BASED CLOCK DRIVER
湿度敏感等级1
功能数量1
反相输出次数
端子数量16
实输出次数8
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
认证状态Not Qualified
Same Edge Skew-Max(tskwd)0.25 ns
座面最大高度1.7272 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
宽度3.937 mm
最小 fmax133 MHz
Base Number Matches1

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IDT2309B
3.3V ZERO DELAY CLOCK BUFFER
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
3.3V ZERO DELAY
CLOCK BUFFER
FEATURES:
DESCRIPTION:
IDT2309B
• Phase-Lock Loop Clock Distribution
• 10MHz to 133MHz operating frequency
• Distributes one clock input to one bank of five and one bank of
four outputs
• Separate output enable for each output bank
• Output Skew < 250ps
• Low jitter <175 ps cycle-to-cycle
• 50ps typical cycle-to-cycle jitter (15pF, 66MHz)
• IDT2309B-1 for Standard Drive
• IDT2309B-1H for High Drive
• No external RC network required
• Operates at 3.3V V
DD
• Available in SOIC and TSSOP packages
NOTE: EOL for non-green parts to occur on 5/13/10 per
PDN U-09-01
The IDT2309B is a high-speed phase-lock loop (PLL) clock buffer,
designed to address high-speed clock distribution applications. The zero
delay is achieved by aligning the phase between the incoming clock and
the output clock, operable within the range of 10 to 133MHz.
The IDT2309B is a 16-pin version of the IDT2305B. The IDT2309B
accepts one reference input, and drives two banks of four low skew clocks.
The -1H version of this device operates at up to 133MHz frequency and
has higher drive than the -1 device. All parts have on-chip PLLs which lock
to an input clock on the REF pin. The PLL feedback is on-chip and is
obtained from the CLKOUT pad. In the absence of an input clock, the
IDT2309B enters power down, and the outputs are tri-stated. In this mode,
the device will draw less than 25µA.
The IDT2309B is characterized for both Industrial and Commercial
operation.
FUNCTIONAL BLOCK DIAGRAM
16
CLKOUT
1
REF
PLL
2
CLKA1
3
CLKA2
14
CLKA3
15
CLKA4
S2
S1
8
9
Control
Logic
6
CLKB1
7
CLKB2
10
CLKB3
11
CLKB4
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
c
2007
Integrated Device Technology, Inc.
AUGUST 2009
DSC 6996/3

IDT2309B-1HDCI8相似产品对比

IDT2309B-1HDCI8 IDT2309B-1HDC IDT2309B-1HDCI IDT2309B-1HDC8 IDT2309B-1HPG8 IDT2309B-1HPG
描述 PLL Based Clock Driver, 2309 Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, SOIC-16 PLL Based Clock Driver, 2309 Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, SOIC-16 PLL Based Clock Driver, 2309 Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, SOIC-16 PLL Based Clock Driver, 2309 Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, SOIC-16 PLL Based Clock Driver, 2309 Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, TSSOP-16 PLL Based Clock Driver, 2309 Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, TSSOP-16
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 SOIC SOIC SOIC SOIC TSSOP TSSOP
包装说明 SOP, SOP, SOP, SOP, TSSOP, TSSOP,
针数 16 16 16 16 16 16
Reach Compliance Code _compli _compli _compli _compli not_compliant not_compliant
系列 2309 2309 2309 2309 2309 2309
输入调节 STANDARD STANDARD STANDARD STANDARD STANDARD STANDARD
JESD-30 代码 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609代码 e0 e0 e0 e0 e0 e0
长度 9.9314 mm 9.9314 mm 9.9314 mm 9.9314 mm 5 mm 5 mm
逻辑集成电路类型 PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
湿度敏感等级 1 1 1 1 1 1
功能数量 1 1 1 1 1 1
端子数量 16 16 16 16 16 16
实输出次数 8 8 8 8 8 8
最高工作温度 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP SOP SOP TSSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Same Edge Skew-Max(tskwd) 0.25 ns 0.25 ns 0.25 ns 0.25 ns 0.25 ns 0.25 ns
座面最大高度 1.7272 mm 1.7272 mm 1.7272 mm 1.7272 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
宽度 3.937 mm 3.937 mm 3.937 mm 3.937 mm 4.4 mm 4.4 mm
最小 fmax 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Base Number Matches 1 1 1 1 - -
是否无铅 - 含铅 含铅 - 含铅 含铅
峰值回流温度(摄氏度) - 240 240 - 240 NOT SPECIFIED
处于峰值回流温度下的最长时间 - 20 20 - 20 NOT SPECIFIED
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