Operational Amplifier, 1 Func, 300uV Offset-Max, BIPolar, CDIP8, CERAMIC, DIP-8
| 参数名称 | 属性值 |
| 厂商名称 | Harris |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.15 µA |
| 标称共模抑制比 | 100 dB |
| 最大输入失调电压 | 300 µV |
| JESD-30 代码 | R-GDIP-T8 |
| JESD-609代码 | e0 |
| 负供电电压上限 | -22 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 供电电压上限 | 22 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 5962-8962701PA | 5962-89627012X | 5962-8962701PX | 5962-89627012A | |
|---|---|---|---|---|
| 描述 | Operational Amplifier, 1 Func, 300uV Offset-Max, BIPolar, CDIP8, CERAMIC, DIP-8 | Operational Amplifier, 1 Func, 300uV Offset-Max, CQCC20, CERAMIC, LCC-20 | Operational Amplifier, 1 Func, 300uV Offset-Max, BIPolar, CDIP8, CERAMIC, DIP-8 | Operational Amplifier, 1 Func, 300uV Offset-Max, CQCC20, CERAMIC, LCC-20 |
| 厂商名称 | Harris | Harris | Harris | Harris |
| 包装说明 | DIP, | QCCN, | DIP, | QCCN, |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.15 µA | 0.15 µA | 0.15 µA | 0.15 µA |
| 标称共模抑制比 | 100 dB | 100 dB | 100 dB | 100 dB |
| 最大输入失调电压 | 300 µV | 300 µV | 300 µV | 300 µV |
| JESD-30 代码 | R-GDIP-T8 | S-CQCC-N20 | R-GDIP-T8 | S-CQCC-N20 |
| 负供电电压上限 | -22 V | -22 V | -22 V | -22 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 20 | 8 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | DIP | QCCN |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 供电电压上限 | 22 V | 22 V | 22 V | 22 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | YES | NO | YES |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | QUAD | DUAL | QUAD |
| JESD-609代码 | e0 | e0 | - | e0 |
| 端子面层 | TIN LEAD | TIN LEAD | - | TIN LEAD |
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