H
Dual Channel Low Input
Current, High Gain
Optocouplers
Technical Data
HCPL-2730 HCPL-0730
HCPL-2731 HCPL-0731
Features
• High Current Transfer Ratio
– 1800% Typical
• Low Input Current
Requirements – 0.5 mA
• Low Output Saturation
Voltage – 0.1 V
• High Density Packaging
• Performance Guaranteed
over Temperature
0
°
C to 70
°
C
• LSTTL Compatible
• High Output Current –
60 mA
• Safety Approval
UL Recognized - 2500 V rms
for 1 Minute and
5000 V rms* for 1 minute
CSA Approved
• Available in 8 Pin DIP and
SO-8 Footprint
• MIL-STD-1772 Version
Available (HCPL-5730/5731)
• Surface Mount Gull Wing
Option Available for 8-Pin
DIP (Option 300)
Applications
• Digital Logic Ground
Isolation
• Telephone Ring Detector
• Level Shifting
• EIA RS-232C Line Receiver
• Polarity Sensing
• Low Input Current Line
Receiver - Long Line or Party
Line
• Microprocessor Bus
Isolation
• Current Loop Receiver
• Line Voltage Status Indicator
-Low Input Power
Dissipation
Description
These dual channel optocouplers
contain a separated pair of GaAsP
light emitting diodes optically
coupled to a pair of integrated
high gain photo detectors. They
provide extremely high current
transfer ratio and excellent input-
output common mode transient
immunity. A separate pin for the
photodiodes and first gain stages
(V
CC
) permits lower output satura-
tion voltage and higher speed
operation than possible with
conventional photodarlington
type optocouplers. In addition,
V
CC
may be as low as 1.6 V
Functional Diagram
ANODE
1
1
CATHODE
1
2
CATHODE
2
3
ANODE
2
4
8 V
CC
7 V
O1
6 V
O2
5 GND
TRUTH TABLE
LED
V
O
ON
LOW
OFF
HIGH
*5000 V rms/1 minute withstand voltage rating is for Option 020 (HCPL-2730, HCLP-2731) products only.
A 0.1
µF
bypass capacitor connected between pins 5 and 8 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
1-108
5965-3597E
without adversely affecting the
parametric performance.
These dual channel optocouplers
are available in an 8-Pin DIP and
in an industry standard SO-8
package. The following is a cross
reference table listing the 8-Pin
DIP part number and the
electrically equivalent SOIC-8 part
number.
8-Pin DIP
SO-8
HCPL-2730 HCPL-0730
HCPL-2731 HCPL-0731
The SO-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Guaranteed operation at low input
currents and the high current
transfer ratio (CTR) reduce the
magnitude and effects of CTR
degradation.
The outstanding high temperature
performance of this split
Darlington type output amplifier
results from the inclusion of an
integrated emitter-base bypass
resistor which shunts photodiode
and first stage leakage currents to
ground.
The HCPL-2731/0731 have a
400% minimum CTR at an input
current of only 0.5 mA making it
ideal for use in low input current
applications such as MOS, CMOS,
and low power logic interfacing or
RS232C data transmission
systems. In addition, the high
CTR and high output current
capability make this device
extremely useful in applications
where a high fanout is required.
Compatibility with high voltage
CMOS logic systems is guaranteed
by the 18 V V
CC
and V
O
specifica-
tions and by testing output high
leakage (I
OH
) at 18 V.
The HCPL-2730/0730 are speci-
fied at an input current of 1.6 mA
and have a 7 V V
CC
and V
O
rating.
The 300% minimum CTR allows
TTL to TTL interfacing at this
input current.
Important specifications such as
CTR, leakage current, and output
saturation voltage are guaranteed
over the 0°C to 70°C temperature
range to allow trouble-free system
operation. Selection for lower
input currents down to 250
µA
is
available upon request.
Selection Guide
8-Pin DIP
(300 Mil)
Single
Channel
Package
6N139
[1]
6N138
[1]
HCPL-4701
[1]
Dual
Channel
Package
HCPL-
2731
2730
4731
[1]
Widebody
Package
(400 mil)
Single
Channel
Package
HCNW139
[1]
HCNW138
[1]
Minimum
Input ON
Current
(I
F
)
0.5 mA
1.6 mA
40
µA
0.5 mA
Absolute
Maxi-
mum
V
CC
18 V
7V
18 V
20 V
5701
[1]
5700
[1]
5731
[1]
5730
[1]
Hermetic
Single and
Dual
Channel
Packages
HCPL-
Small Outline SO-8
Single
Dual
Channel Channel
Package Package
HCPL-
HCPL-
0701
[1]
0700
[1]
070A
[1]
0731
0730
073A
[1]
Minimum
CTR
400%
300%
800%
300%
Note:
1. Technical data are on separate HP publications.
1-109
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2731#XXX
020 = 5000 V rms/1 Minute UL Rating Option.*
300 = Gull Wing Surface Mount Option, 50 per tube.**
500 = Tape and Reel Packaging Option, 1000 per reel.
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
*For HCPL-2731 and HCPL-2730 only.
**Gull wing surface mount option applies to through hole parts only.
Schematic
1
+
V
F1
I
F1
I
CC
8
V
CC
–
2
I
O1
V
O1
7
3
–
V
F2
I
F2
I
O2
6
V
O2
+
4
GND
5
HCPL-2731/0731 SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 8)
1-110
Package Outline Drawings
8-Pin DIP Package (HCPL-2731/HCPL-2730)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
HP XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2731/HCPL-2730)
PAD LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
1.194 (0.047)
4.826 TYP.
(0.190)
6.350 ± 0.25
(0.250 ± 0.010)
9.398 (0.370)
9.906 (0.390)
1
2
3
4
1.194 (0.047)
1.778 (0.070)
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.381 (0.015)
0.635 (0.025)
1.19
(0.047)
MAX.
4.19 MAX.
(0.165)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
1-111
Small Outline SO-8 Package (HCPL-0731/HCPL-0730)
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.842 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
1
2
3
0.381 ± 0.076
(0.016 ± 0.003)
1.270 BSG
(0.050)
7°
0.432
(0.017)
5.080 ± 0.127
(0.200 ± 0.005)
45° X
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0.152 ± 0.051
(0.006 ± 0.002)
0.228 ± 0.025
(0.009 ± 0.001)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.305 MIN.
(0.012)
Solder Reflow Temperature Profile (HCPL-073X and Gull Wing Surface Mount Option 300 Parts).
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Note: Use of nonchlorine activated fluxes is highly recommended.
Regulatory Information
The HCPL-2731/2730 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
1-112
FPGA/CPLD
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