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GT40T321

产品描述Consumer Application Voltage Resonance Inverter Switching Application
文件大小200KB,共6页
制造商Toshiba(东芝)
官网地址http://toshiba-semicon-storage.com/
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GT40T321概述

Consumer Application Voltage Resonance Inverter Switching Application

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GT40T321
TOSHIBA Insulated Gate Bipolar Transistor
Silicon N Channel IGBT
GT40T321
Consumer Application
Voltage Resonance Inverter Switching Application
Sixth Generation IGBT
FRD included between emitter and collector
Enhancement mode type
High speed
Low saturation voltage
High Junction temperature
IGBT: t
f
=
0.24
μs
(typ.) (I
C
=
40 A)
FRD: t
rr
=
0.7
μs
(typ.) (di/dt
= −20
A/μs)
V
CE (sat)
=2.15
V (typ.) (I
C
=
40 A)
T
j
= 175°C (max)
Unit: mm
Absolute Maximum Ratings
(Ta = 25°C)
Characteristics
Collector-emitter voltage
Gate-emitter voltage
Collector current
DC
1ms
DC
1ms
Symbol
V
CES
V
GES
I
C
I
CP
I
F
I
FP
P
C
T
j
T
stg
Rating
1500
±
25
40
80
30
80
230
175
-55 to 175
Unit
V
V
A
JEDEC
JEITA
TOSHIBA
2-16C1C
Diode forward current
Collector power dissipation
(Tc
=
25°C)
Junction temperature
Storage temperature
A
Weight: 4.6 g (typ.)
W
°C
°C
Note 1: Ensure that the channel temperature does not exceed 175°C during use of the device.
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor
Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data
(i.e. reliability test report and estimated failure rate, etc).
In general, loss of IGBT increases more when it has positive temperature coefficient and gets higher
temperature. In case that the temperature rise due to loss of IGBT exceeds the heat release capacity of a
device, it leads to thermorunaway and results in destruction. Therefore, please design heat release of a device
with due consideration to the temperature rise of IGBT.
1
2009-12-04

 
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