Operational Amplifier, 1 Func, 90uV Offset-Max, CMOS, CDIP8
| 参数名称 | 属性值 |
| 厂商名称 | ALD [Advanced Linear Devices] |
| 零件包装代码 | DIP |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.002 µA |
| 标称共模抑制比 | 97 dB |
| 最大输入失调电压 | 90 µV |
| JESD-30 代码 | R-CDIP-T8 |
| 标称负供电电压 (Vsup) | -2.5 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 标称压摆率 | 2.1 V/us |
| 供电电压上限 | 13.2 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 标称均一增益带宽 | 1500 kHz |
| ALD1722EDAMXXXX | ALD1722PAXXXX | ALD1722SAXXXX | ALD1722ESAXXXX | ALD1722DAMXXXX | ALD1722EPAXXXX | |
|---|---|---|---|---|---|---|
| 描述 | Operational Amplifier, 1 Func, 90uV Offset-Max, CMOS, CDIP8 | Operational Amplifier, 1 Func, 90uV Offset-Max, CMOS, PDIP8 | Operational Amplifier, 1 Func, 90uV Offset-Max, CMOS, PDSO8 | Operational Amplifier, 1 Func, 90uV Offset-Max, CMOS, PDSO8 | Operational Amplifier, 1 Func, 90uV Offset-Max, CMOS, CDIP8 | Operational Amplifier, 1 Func, 90uV Offset-Max, CMOS, PDIP8 |
| 零件包装代码 | DIP | DIP | SOIC | SOIC | DIP | DIP |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.002 µA | 0.00028 µA | 0.00028 µA | 0.00028 µA | 0.002 µA | 0.00028 µA |
| 标称共模抑制比 | 97 dB | 97 dB | 97 dB | 97 dB | 97 dB | 97 dB |
| 最大输入失调电压 | 90 µV | 90 µV | 90 µV | 90 µV | 90 µV | 90 µV |
| JESD-30 代码 | R-CDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-CDIP-T8 | R-PDIP-T8 |
| 标称负供电电压 (Vsup) | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称压摆率 | 2.1 V/us | 2.1 V/us | 2.1 V/us | 2.1 V/us | 2.1 V/us | 2.1 V/us |
| 供电电压上限 | 13.2 V | 13.2 V | 13.2 V | 13.2 V | 13.2 V | 13.2 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | NO | NO | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 标称均一增益带宽 | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
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