IC SAMPLE AND HOLD AMPLIFIER, 3.5 us ACQUISITION TIME, UUC7, 2.235 X 2.108 MM, DIE-7, Sample and Hold Circuit
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | DIE |
包装说明 | 2.235 X 2.108 MM, DIE-7 |
针数 | 7 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
标称采集时间 | 3.5 µs |
放大器类型 | SAMPLE AND HOLD CIRCUIT |
最大模拟输入电压 | 10.5 V |
最小模拟输入电压 | -10.5 V |
最大下降率 | 0.5 V/s |
JESD-30 代码 | R-XUUC-N7 |
JESD-609代码 | e0 |
负供电电压上限 | -18 V |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 7 |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装形状 | RECTANGULAR |
封装形式 | UNCASED CHIP |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE |
供电电压上限 | 18 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
技术 | BIPOLAR |
端子面层 | TIN LEAD |
端子形式 | NO LEAD |
端子位置 | UPPER |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
SMP10G | SMP10BIEY | SMP10BIFY | SMP10N | |
---|---|---|---|---|
描述 | IC SAMPLE AND HOLD AMPLIFIER, 3.5 us ACQUISITION TIME, UUC7, 2.235 X 2.108 MM, DIE-7, Sample and Hold Circuit | IC SAMPLE AND HOLD AMPLIFIER, 5 us ACQUISITION TIME, CDIP14, HERMETIC SEALED, CERDIP-14, Sample and Hold Circuit | IC SAMPLE AND HOLD AMPLIFIER, 5 us ACQUISITION TIME, CDIP14, HERMETIC SEALED, CERDIP-14, Sample and Hold Circuit | IC SAMPLE AND HOLD AMPLIFIER, 3.5 us ACQUISITION TIME, UUC7, 2.235 X 2.108 MM, DIE-7, Sample and Hold Circuit |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | DIE | DIP | DIP | DIE |
包装说明 | 2.235 X 2.108 MM, DIE-7 | HERMETIC SEALED, CERDIP-14 | HERMETIC SEALED, CERDIP-14 | 2.235 X 2.108 MM, DIE-7 |
针数 | 7 | 14 | 14 | 7 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
标称采集时间 | 3.5 µs | - | 5 µs | 3.5 µs |
放大器类型 | SAMPLE AND HOLD CIRCUIT | - | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT |
最大下降率 | 0.5 V/s | - | 0.13 V/s | 0.2 V/s |
JESD-30 代码 | R-XUUC-N7 | - | R-GDIP-T14 | R-XUUC-N7 |
JESD-609代码 | e0 | - | e0 | e0 |
负供电电压上限 | -18 V | - | -18 V | -18 V |
标称负供电电压 (Vsup) | -15 V | - | -15 V | -15 V |
功能数量 | 1 | - | 1 | 1 |
端子数量 | 7 | - | 14 | 7 |
封装主体材料 | UNSPECIFIED | - | CERAMIC, GLASS-SEALED | UNSPECIFIED |
封装代码 | DIE | - | DIP | DIE |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | UNCASED CHIP | - | IN-LINE | UNCASED CHIP |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE | - | SAMPLE | SAMPLE |
供电电压上限 | 18 V | - | 18 V | 18 V |
标称供电电压 (Vsup) | 15 V | - | 15 V | 15 V |
表面贴装 | YES | - | NO | YES |
端子面层 | TIN LEAD | - | TIN LEAD | TIN LEAD |
端子形式 | NO LEAD | - | THROUGH-HOLE | NO LEAD |
端子位置 | UPPER | - | DUAL | UPPER |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
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