D/A Converter, 1 Func, Serial Input Loading, CQCC68, 10 X 10 MM, 0.90 MM PITCH, QFN-68
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | QFN |
包装说明 | 10 X 10 MM, 0.90 MM PITCH, QFN-68 |
针数 | 68 |
Reach Compliance Code | not_compliant |
最大模拟输出电压 | 7.6 V |
最小模拟输出电压 | -3.25 V |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY |
输入格式 | SERIAL |
JESD-30 代码 | S-CQCC-N68 |
JESD-609代码 | e0 |
长度 | 10 mm |
最大线性误差 (EL) | 0.015% |
湿度敏感等级 | 1 |
标称负供电电压 | -4 V |
位数 | 16 |
功能数量 | 1 |
端子数量 | 68 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | VQCCN |
封装等效代码 | LCC68,.4SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 |
电源 | -4,5,10 V |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
标称供电电压 | 10 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10 mm |
MAX5631AEGK | MAX5631AEGK-T | MAX5632AEGK-T | MAX5633AEGK-T | |
---|---|---|---|---|
描述 | D/A Converter, 1 Func, Serial Input Loading, CQCC68, 10 X 10 MM, 0.90 MM PITCH, QFN-68 | D/A Converter, 1 Func, Serial Input Loading, CQCC68, 10 X 10 MM, 0.90 MM PITCH, QFN-68 | D/A Converter, 1 Func, Serial Input Loading, CQCC68, 10 X 10 MM, 0.90 MM PITCH, QFN-68 | D/A Converter, 1 Func, Serial Input Loading, CQCC68, 10 X 10 MM, 0.90 MM PITCH, QFN-68 |
零件包装代码 | QFN | QFN | QFN | QFN |
包装说明 | 10 X 10 MM, 0.90 MM PITCH, QFN-68 | VQCCN, | VQCCN, | VQCCN, |
针数 | 68 | 68 | 68 | 68 |
Reach Compliance Code | not_compliant | unknown | unknown | unknown |
最大模拟输出电压 | 7.6 V | 7.6 V | 7.6 V | 7.6 V |
最小模拟输出电压 | -3.25 V | -3.25 V | -3.25 V | -3.25 V |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY | BINARY | BINARY | BINARY |
输入格式 | SERIAL | SERIAL | SERIAL | SERIAL |
JESD-30 代码 | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 10 mm | 10 mm | 10 mm | 10 mm |
最大线性误差 (EL) | 0.015% | 0.015% | 0.015% | 0.015% |
标称负供电电压 | -4 V | -4 V | -4 V | -4 V |
位数 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 68 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | VQCCN | VQCCN | VQCCN | VQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
标称供电电压 | 10 V | 10 V | 10 V | 10 V |
表面贴装 | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
宽度 | 10 mm | 10 mm | 10 mm | 10 mm |
厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
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