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MASMLG130E3

产品描述Trans Voltage Suppressor Diode, 3000W, 130V V(RWM), Unidirectional, 1 Element, Silicon, DO-215AB, ROHS COMPLIANT, PLASTIC PACKAGE-2
产品类别分立半导体    二极管   
文件大小190KB,共4页
制造商Microsemi
官网地址https://www.microsemi.com
标准
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MASMLG130E3概述

Trans Voltage Suppressor Diode, 3000W, 130V V(RWM), Unidirectional, 1 Element, Silicon, DO-215AB, ROHS COMPLIANT, PLASTIC PACKAGE-2

MASMLG130E3规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microsemi
零件包装代码DO-215AB
包装说明R-PDSO-G2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
最大击穿电压176 V
最小击穿电压144 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码DO-215AB
JESD-30 代码R-PDSO-G2
JESD-609代码e3
湿度敏感等级1
最大非重复峰值反向功率耗散3000 W
元件数量1
端子数量2
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.61 W
认证状态Not Qualified
最大重复峰值反向电压130 V
表面贴装YES
技术AVALANCHE
端子面层MATTE TIN
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED

文档预览

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SMLJ5.0 thru SMLJ170CA, e3
and SMLG5.0 thru SMLG170CA, e3
SCOTTSDALE DIVISION
SURFACE MOUNT 3000 Watt
Transient Voltage Suppressor
DESCRIPTION
The SMLJ5.0-170A or SMLG5.0-170A series of 3000 W Transient Voltage
Suppressors (TVSs) protects a variety of voltage-sensitive components
from destruction or degradation. It is available in J-bend design (SMLJ)
with the DO-214AB package for greater PC board mounting density or in a
Gull-wing design (SMLG) in the DO-215AB for visible solder connections.
Selections include unidirectional and bidirectional. They can protect from
secondary lightning effects per IEC61000-4-5 and class levels defined
herein, or for inductive switching environments and induced RF protection.
Since their response time is virtually instantaneous, they can also be used
in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
FEATURES
Economical surface mount TVS design in both J-bend
or Gull-wing terminations with fast response
Available in both Unidirectional and Bidirectional
construction with a C or CA suffix
Selections for 5.0 to 170 volts standoff voltages (V
WM
)
Optional 100% screening for avionics grade is
available by adding MA prefix to part number for
added 100% temperature cycle -55
o
C to +125
o
C (10X)
as well as surge (3X) and 24 hours HTRB with post
test V
Z
& I
R
(in the operating direction for unidirectional
or both directions for bidirectional)
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, and JANTXV are available by
adding MQ, MX, or MV prefixes respectively to part
numbers
Axial-lead packages for thru-hole mounting available
as 5KP5.0–110A with 5000 W rating (consult factory
for other surface mount options)
RoHS Compliant devices available by adding e3 suffix
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
APPLICATIONS / BENEFITS
Suppresses transients up to 3000 watts @ 10/1000 µs
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2 and
IEC 61000-4-4
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
Class 1 & 2: SML 5.0 to SML 170A or CA
Class 3: SML 5.0 to SML 150A or CA
Class 4: SML 5.0 to SML 75A or CA
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
Class 1: SML 5.0 to SML 170A or CA
Class 2: SML 5.0 to SML 90A or CA
Class 3: SML 5.0 to SML 48A or CA
Class 4: SML 5.0 to SML 24A or CA
Secondary lightning protection per IEC61000-4-5 with
2 Ohms source impedance:
Class 2: SML 5.0 to SML 43A or CA
Class 3: SML 5.0 to SML 22A or CA
Class 4: SML 5.0 to SML10A or CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25
º
C: 3000 watts at
10/1000
μs
(also see Fig 1,2, and 3)
Impulse repetition rate (duty factor): 0.01%
t
clamping
(0 volts to
V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Operating and Storage temperature: -65
º
C to +150
º
C
Thermal resistance: 17.5
º
C/W junction to lead, or
77.5
º
C/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint
o
Steady-State Power dissipation: 6 watts at T
L
= 45 C,
or 1.61 watts at T
A
= 25
º
C when mounted on FR4 PC
board with recommended footprint
Forward Surge at 25ºC: 200 Amps peak impulse of
8.3 ms half-sine wave (unidirectional only)
Solder temperatures: 260
º
C for 10 s (maximum)
Copyright
©
2009
4-06-2009 REV J
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-bend)
leads with tin-lead or RoHS Compliant annealed
matte-Tin plating solderable per MIL-STD-750,
method 2026
POLARITY: Cathode indicated by band. No marking
on bidirectional devices
MARKING: Part number without SM and G or J prefix
(e.g. L5.0, L5.0A, L5.0Ae3, L5.0CA, L36, L36A,
L36Ae3, L36CAe3, etc.)
TAPE & REEL option: Standard per EIA-481-2 with
16 mm tape, 750 per 7 inch reel or 2500 per 13 inch
reel (add “TR” suffix to part number)
WEIGHT:
0.25 grams
Page 1
SML 5.0 – 170V, e3
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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