Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, MOS, PQCC44,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Infineon(英飞凌) |
Reach Compliance Code | not_compliant |
位大小 | 8 |
CPU系列 | 8051 |
JESD-30 代码 | S-PQCC-J44 |
JESD-609代码 | e0 |
端子数量 | 44 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC44,.7SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 256 |
ROM(单词) | 8192 |
ROM可编程性 | MROM |
速度 | 12 MHz |
最大压摆率 | 175 mA |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | MOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
SAB8052B-N | SAB8052B-P-T40/85 | SAB8032B-P | SAB8032B-P-T40/100 | SAB8032B-P-T40/85 | SAB8052B-P | SAB8052B-P-T40/100 | SAB8032B-N | |
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描述 | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, MOS, PQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, MOS, PDIP40, | Microcontroller, 8-Bit, 8051 CPU, 12MHz, MOS, PDIP40, | Microcontroller, 8-Bit, 8051 CPU, 10MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, 8051 CPU, 12MHz, MOS, PDIP40, | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, MOS, PDIP40, | Microcontroller, 8-Bit, MROM, 8051 CPU, 10MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, 8051 CPU, 12MHz, MOS, PQCC44, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) |
Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown | not_compliant | not_compliant | _compli |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
JESD-30 代码 | S-PQCC-J44 | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | S-PQCC-J44 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 44 | 40 | 40 | 40 | 40 | 40 | 40 | 44 |
最高工作温度 | 70 °C | 85 °C | 70 °C | 100 °C | 85 °C | 70 °C | 100 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | DIP | DIP | DIP | DIP | DIP | DIP | QCCJ |
封装等效代码 | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
速度 | 12 MHz | 12 MHz | 12 MHz | 10 MHz | 12 MHz | 12 MHz | 10 MHz | 12 MHz |
最大压摆率 | 175 mA | 175 mA | 175 mA | 175 mA | 175 mA | 175 mA | 175 mA | 175 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | NO | NO | NO | NO | YES |
技术 | MOS | MOS | MOS | CMOS | MOS | MOS | CMOS | MOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
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