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Datasheet> 器件分类 > 逻辑> 逻辑> SN74LVC1G240YEAR
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SN74LVC1G240YEAR

产品描述LVC/LCX/Z SERIES, 1-BIT DRIVER, INVERTED OUTPUT, BGA5, MO-211EA, DSBGA-5
产品类别逻辑    逻辑   
文件大小1MB，共17页
制造商Rochester Electronics
官网地址https://www.rocelec.com/
标准  
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SN74LVC1G240YEAR概述

LVC/LCX/Z SERIES, 1-BIT DRIVER, INVERTED OUTPUT, BGA5, MO-211EA, DSBGA-5

SN74LVC1G240YEAR规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证不符合
厂商名称Rochester Electronics
零件包装代码DSBGA
包装说明MO-211EA, DSBGA-5
针数5
Reach Compliance Codeunknown
系列LVC/LCX/Z
JESD-30 代码R-XBGA-B5
JESD-609代码e0
长度1.4 mm
逻辑集成电路类型BUS DRIVER
湿度敏感等级1
位数1
功能数量1
端口数量2
端子数量5
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性INVERTED
封装主体材料UNSPECIFIED
封装代码VFBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）260
传播延迟（tpd）8.6 ns
座面最大高度0.5 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.65 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN LEAD
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度0.9 mm

SN74LVC1G240YEAR文档预览

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SN74LVC1G240
SINGLE BUFFER/DRIVER
WITH 3-STATE OUTPUT
www.ti.com
SCES305I – JANUARY 2001 – REVISED AUGUST 2006
FEATURES
•
•
•
•
•
•
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 3.7 ns at 3.3 V
Low Power Consumption, 10-µA Max I
CC
±24-mA
Output Drive at 3.3 V
I
off
Supports Partial-Power-Down Mode
Operation
DBV PACKAGE
(TOP VIEW)
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
OE
A
GND
1
5
V
CC
OE
A
1
2
3
5
V
CC
GND
A
OE
3 4
2
1 5
Y
V
CC
2
GND
4
4
Y
3
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2006, Texas Instruments Incorporated
SN74LVC1G240
SINGLE BUFFER/DRIVER
WITH 3-STATE OUTPUT
SCES305I – JANUARY 2001 – REVISED AUGUST 2006
www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1)
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
–40°C to 85°C NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
(1)
(2)
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
ORDERABLE PART NUMBER
SN74LVC1G240YEAR
SN74LVC1G240YZAR
Reel of 3000
SN74LVC1G240YEPR
SN74LVC1G240YZPR
SN74LVC1G240DBVR
SN74LVC1G240DBVT
SN74LVC1G240DCKR
SN74LVC1G240DCKT
C40_
CK_
_ _ _CK_
TOP-SIDE MARKING
(2)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
•
= Pb-free).
FUNCTION TABLE
INPUTS
OE
L
L
H
A
H
L
X
OUTPUT
Y
L
H
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
OE
A
1
2
4
Y
2
Submit Documentation Feedback
www.ti.com
SN74LVC1G240
SINGLE BUFFER/DRIVER
WITH 3-STATE OUTPUT
SCES305I – JANUARY 2001 – REVISED AUGUST 2006
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
V
CC
V
I
V
O
V
O
I
IK
I
OK
I
O
Supply voltage range
Input voltage range
(2)
Voltage range applied to any output in the high-impedance or power-off state
(2)
Voltage range applied to any output in the high or low
Input clamp current
Output clamp current
Continuous output current
Continuous current through V
CC
or GND
DBV package
θ
JA
Package thermal impedance
(4)
DCK package
YEA/YZA package
YEP/YZP package
T
stg
(1)
(2)
(3)
(4)
Storage temperature range
–65
state
(2) (3)
V
I
< 0
V
O
< 0
–0.5
–0.5
–0.5
–0.5
MAX
6.5
6.5
6.5
V
CC
+ 0.5
–50
–50
±50
±100
206
252
154
132
150
°C
°C/W
UNIT
V
V
V
V
mA
mA
mA
mA
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of V
CC
is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
Submit Documentation Feedback
3
SN74LVC1G240
SINGLE BUFFER/DRIVER
WITH 3-STATE OUTPUT
SCES305I – JANUARY 2001 – REVISED AUGUST 2006
www.ti.com
Recommended Operating Conditions
(1)
MIN
V
CC
Supply voltage
Operating
Data retention only
V
CC
= 1.65 V to 1.95 V
V
IH
High-level input voltage
V
CC
= 2.3 V to 2.7 V
V
CC
= 3 V to 3.6 V
V
CC
= 4.5 V to 5.5 V
V
CC
= 1.65 V to 1.95 V
V
IL
Low-level input voltage
V
CC
= 2.3 V to 2.7 V
V
CC
= 3 V to 3.6 V
V
CC
= 4.5 V to 5.5 V
V
I
V
O
Input voltage
Output voltage
V
CC
= 1.65 V
V
CC
= 2.3 V
I
OH
High-level output current
V
CC
= 3 V
V
CC
= 4.5 V
V
CC
= 1.65 V
V
CC
= 2.3 V
I
OL
Low-level output current
V
CC
= 3 V
V
CC
= 4.5 V
V
CC
= 1.8 V
±
0.15 V, 2.5 V
±
0.2 V
∆t/∆v
Input transition rise or fall rate
T
A
(1)
Operating free-air temperature
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5 V
±
0.5 V
–40
0
0
1.65
1.5
0.65
×
V
CC
1.7
2
0.7
×
V
CC
0.35
×
V
CC
0.7
0.8
0.3
×
V
CC
5.5
V
CC
–4
–8
–16
–24
–32
4
8
16
24
32
20
10
5
85
°C
ns/V
mA
mA
V
V
V
V
MAX
5.5
UNIT
V
All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs,
literature number SCBA004.
4
Submit Documentation Feedback
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SN74LVC1G240YEAR相似产品对比

SN74LVC1G240YEAR SN74LVC1G240DBVR SN74LVC1G240YEPR SN74LVC1G240DCKR SN74LVC1G240DBVT SN74LVC1G240DCKT SN74LVC1G240YZPR
描述 LVC/LCX/Z SERIES, 1-BIT DRIVER, INVERTED OUTPUT, BGA5, MO-211EA, DSBGA-5 LVC/LCX/Z SERIES, 1-BIT DRIVER, INVERTED OUTPUT, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN LVC/LCX/Z SERIES, 1-BIT DRIVER, INVERTED OUTPUT, BGA5, DSBGA-5 LVC/LCX/Z SERIES, 1-BIT DRIVER, INVERTED OUTPUT, PDSO5, GREEN, PLASTIC, SC-70, 5 PIN LVC/LCX/Z SERIES, 1-BIT DRIVER, INVERTED OUTPUT, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN LVC/LCX/Z SERIES, 1-BIT DRIVER, INVERTED OUTPUT, PDSO5, GREEN, PLASTIC, SC-70, 5 PIN LVC/LCX/Z SERIES, 1-BIT DRIVER, INVERTED OUTPUT, BGA5, GREEN, DSBGA-5
是否无铅 不含铅 不含铅 含铅 含铅 不含铅 不含铅 含铅
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
零件包装代码 DSBGA SOT-23 BGA SOIC SOT-23 SOIC BGA
包装说明 MO-211EA, DSBGA-5 GREEN, PLASTIC, SOT-23, 5 PIN DSBGA-5 GREEN, PLASTIC, SC-70, 5 PIN GREEN, PLASTIC, SOT-23, 5 PIN GREEN, PLASTIC, SC-70, 5 PIN GREEN, DSBGA-5
针数 5 5 5 5 5 5 5
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-XBGA-B5 R-PDSO-G5 R-XBGA-B5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-XBGA-B5
JESD-609代码 e0 e4 e0 e0 e4 e4 e1
长度 1.4 mm 2.9 mm 1.4 mm 2 mm 2.9 mm 2 mm 1.4 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
湿度敏感等级 1 1 1 1 1 1 1
位数 1 1 1 1 1 1 1
功能数量 1 1 1 1 1 1 1
端口数量 2 2 2 2 2 2 2
端子数量 5 5 5 5 5 5 5
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED
封装主体材料 UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
封装代码 VFBGA LSSOP VFBGA TSSOP LSSOP TSSOP VFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度） 260 260 260 260 260 260 260
传播延迟（tpd） 8.6 ns 8.6 ns 8.6 ns 8.6 ns 8.6 ns 8.6 ns 8.6 ns
座面最大高度 0.5 mm 1.45 mm 0.5 mm 1.1 mm 1.45 mm 1.1 mm 0.5 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN LEAD NICKEL PALLADIUM GOLD TIN LEAD TIN LEAD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD TIN SILVER COPPER
端子形式 BALL GULL WING BALL GULL WING GULL WING GULL WING BALL
端子节距 0.5 mm 0.95 mm 0.5 mm 0.65 mm 0.95 mm 0.65 mm 0.5 mm
端子位置 BOTTOM DUAL BOTTOM DUAL DUAL DUAL BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 0.9 mm 1.6 mm 0.9 mm 1.25 mm 1.6 mm 1.25 mm 0.9 mm
是否Rohs认证 不符合 符合 不符合 - 符合 - 符合

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器件捷径:   00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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