Multi-Port SRAM Module, 8KX18, 30ns, BICMOS, CPGA142, CERAMIC, PGA-142
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | PGA |
| 包装说明 | CERAMIC, PGA-142 |
| 针数 | 142 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 最长访问时间 | 30 ns |
| 其他特性 | SELF-TIMED WRITE |
| 备用内存宽度 | 36 |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-CPGA-P142 |
| JESD-609代码 | e0 |
| 长度 | 34.036 mm |
| 内存密度 | 147456 bit |
| 内存集成电路类型 | MULTI-PORT SRAM MODULE |
| 内存宽度 | 18 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 142 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 8KX18 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装等效代码 | PGA142,13X13 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 座面最大高度 | 6.223 mm |
| 最大压摆率 | 1.44 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 34.036 mm |
| IDT7M1024S30GB | IDT7M1024S30G | IDT7M1024S20GB | IDT7M1024S25GB | IDT7M1024S20G | IDT7M1024S25G | |
|---|---|---|---|---|---|---|
| 描述 | Multi-Port SRAM Module, 8KX18, 30ns, BICMOS, CPGA142, CERAMIC, PGA-142 | Multi-Port SRAM Module, 4KX36, 30ns, BICMOS, CPGA142 | Multi-Port SRAM Module, 4KX36, 20ns, BICMOS, CPGA142 | Multi-Port SRAM Module, 8KX18, 25ns, BICMOS, CPGA142, CERAMIC, PGA-142 | Multi-Port SRAM Module, 8KX18, 20ns, BICMOS, CPGA142, CERAMIC, PGA-142 | Multi-Port SRAM Module, 8KX18, 25ns, BICMOS, CPGA142, CERAMIC, PGA-142 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | EAR99 | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 |
| 最长访问时间 | 30 ns | 30 ns | 20 ns | 25 ns | 20 ns | 25 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-CPGA-P142 | S-CPMA-P142 | S-CPMA-P142 | S-CPGA-P142 | S-CPGA-P142 | S-CPGA-P142 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit |
| 内存集成电路类型 | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE |
| 内存宽度 | 18 | 36 | 36 | 18 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 142 | 142 | 142 | 142 | 142 | 142 |
| 字数 | 8192 words | 4096 words | 4096 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 4000 | 4000 | 8000 | 8000 | 8000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| 组织 | 8KX18 | 4KX36 | 4KX36 | 8KX18 | 8KX18 | 8KX18 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | PGA | PGA | PGA | PGA | PGA |
| 封装等效代码 | PGA142,13X13 | PGA142,13X13 | PGA142,13X13 | PGA142,13X13 | PGA142,13X13 | PGA142,13X13 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 1.44 mA | 1.36 mA | 1.56 mA | 1.48 mA | 1.44 mA | 1.36 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 零件包装代码 | PGA | - | - | PGA | PGA | PGA |
| 包装说明 | CERAMIC, PGA-142 | - | - | CERAMIC, PGA-142 | CERAMIC, PGA-142 | CERAMIC, PGA-142 |
| 针数 | 142 | - | - | 142 | 142 | 142 |
| 其他特性 | SELF-TIMED WRITE | - | - | SELF-TIMED WRITE | SELF-TIMED WRITE | SELF-TIMED WRITE |
| 备用内存宽度 | 36 | - | - | 36 | 36 | 36 |
| 长度 | 34.036 mm | - | - | 34.036 mm | 34.036 mm | 34.036 mm |
| 座面最大高度 | 6.223 mm | - | - | 6.223 mm | 6.223 mm | 6.223 mm |
| 宽度 | 34.036 mm | - | - | 34.036 mm | 34.036 mm | 34.036 mm |
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