电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MVSMBJ5923BE3

产品描述Zener Diode, 8.2V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-214AA, ROHS COMPLIANT, PLASTIC, SMBJ, 2 PIN
产品类别分立半导体    二极管   
文件大小123KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

MVSMBJ5923BE3概述

Zener Diode, 8.2V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-214AA, ROHS COMPLIANT, PLASTIC, SMBJ, 2 PIN

MVSMBJ5923BE3规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microsemi
零件包装代码DO-214AA
包装说明R-PDSO-C2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-214AA
JESD-30 代码R-PDSO-C2
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量2
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
认证状态Not Qualified
标称参考电压8.2 V
表面贴装YES
技术ZENER
端子面层MATTE TIN
端子形式C BEND
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差5%
工作测试电流45.7 mA

文档预览

下载PDF文档
SMBG5913 thru SMBG5956B, e3
SMBJ5913 thru SMBJ5956B, e3
SILICON 2.0 Watt ZENER DIODES
SCOTTSDALE DIVISION
DESCRIPTION
The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 2.0
watt Zeners provides voltage regulation in a selection from 3.3 to 200
volts with different tolerances as identified by suffix letter on the part
number. This series is equivalent to the JEDEC registered 1N5913 thru
1N5956B with identical electrical characteristics except it is rated at 2.0 W
instead of 1.5 W with the lower thermal resistance features of the surface
mount packaging. It is available in J-bend design (SMBJ) with the DO-
214AA package for greater PC board mounting density or in Gull-wing
design (SMBG) in the DO-215AA for visible solder connections. It is also
available as RoHS Compliant with an e3 suffix. Microsemi also offers
numerous other Zener products to meet higher and lower power
applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Surface mount equivalent to 1N5913 to 1N5956B
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5% with
B suffix and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Options for screening in accordance with MIL-PRF-19500
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating
current and temperature range
Wide selection from 3.3 to 200 V
Popular DO-214AA or DO-215AA packages
and footprints for either high density J-bend or
Gull-wing designs for visible solder joints
Nonsensitive to ESD per MIL-STD-750 Method
1020
Withstands high surge stresses (see Figure 2)
Moisture classification: Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded
thermosetting epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified
J-bend) tin-lead or RoHS compliant annealed
matte-Tin plating solderable per MIL-STD-750,
method 2026
POLARITY: Cathode indicated by band.
Diode to be operated with banded end positive
with respect to opposite end for Zener
regulation
MARKING: Includes part number without
prefix (e.g. 5913B, 5913Be3, 5948C, 5956D,
etc.)
TAPE & REEL option: Standard per
EIA-481-1-
A
with 12 mm tape, 750 per 7 inch reel or 2500
per 13 inch reel
(add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimensions on last page
for JAN, JANTX, and JANTXV are available by adding MQ,
MX, or MV prefixes respectively to part numbers.
RoHS Compliant devices available by adding an “e3” suffix
MAXIMUM RATINGS
Power dissipation at 25
º
C: 2.0 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+150
º
C
Thermal Resistance: 35
º
C/W junction to lead, or
100
º
C/W junction to ambient when mounted on FR4
PC board (1oz Cu) with recommended footprint (see
last page)
Steady-State Power: 2 watts at T
L
< 80
o
C, or 1.25
watts at T
A
= 25
º
C when mounted on FR4 PC board
with recommended footprint (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (maximum)
SMBG(J)5913–5956B, e3
Copyright
©
2007
6-21--2007 REV H
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
导航软件在别人定制的平台上可以跑,在我定制的平台上为什么就跑不了呢(有些功能不行)?很奇怪,大家帮忙分析一下问题可能在那里啊!?
导航软件在别人定制的平台上可以跑,在我定制的平台上为什么就跑不了呢(有些功能不行)?很奇怪,大家帮忙分析一下问题可能在那里啊!? 在我定制的平台可以激活运行导航软件,但一进模拟 ......
polo_dai 嵌入式系统
F28026程序跑飞,知道的朋友帮个忙啊(问题已经解决,楼下给出了方法,关心的来看下)
定义了一个函数fun,和一个中断服务函数isr,都在内存中跑。fun里面定义一些局部变量,并且这个函数只有isr会调用。现在发现如果这个函数比较大(其实也不是很大,就几十行)情况下,程序就会跑 ......
w00d DSP 与 ARM 处理器
MSP432实现语音识别的方法
在万物互联的世界中,越来越多能够理解语音内容的电子设备逐渐进入我们的视线。在智能手机、平板电脑和笔记本等拥有Siri或Cortana应用程序的设备中,语音识别能够帮助用户搜索答案或控制周围 ......
Jacktang 微控制器 MCU
求救啊 DXP
之前一直用PROTEL 99,最近用ALTIUM DESIGNER6.6 ,今天进行PCB布板时,用鼠标移动元件时,为什么移动有些元件时,鼠标会一下子跳到很远啊, 鼠标为什么不能跟元件在一起移动呢 怎么才能调整过来 ......
jessie154727924 PCB设计
【聊聊DSP】我和DSP的一些故事
接触DSP很久很久之前的事了,大概是去年。 那是一个风和日丽的日子,天非常蓝,云非常白。 导师告诉我毕业课题为新能源方向,细细述之就是所谓的太阳能。而众所周知,太阳能最主要 ......
常见泽1 DSP 与 ARM 处理器
电子元器件的焊接
电子元器件的焊接 用电烙铁焊接元件是基本的装配工艺,它对保证电子产品的质量起着关键的作用。下面介绍一些元器件的焊接要点。1. 焊接最好是松香、松香油或无酸性焊剂。不能用酸性焊剂 ......
aabbcc 汽车电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 28  1974  2502  1994  104  1  40  51  41  3 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved