IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-PDIP-T16 |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最大通态电阻 (Ron) | 1200 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| CD4051BC | CD4053BMJ | CD4052BCM | CD4052BCJ | CD4051BCM | CD4051BCJ | CD4051BMJ | CD4052BMJ | CD4053BCJ | CD4053BCM | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,16PIN,PLASTIC | SGL ENDED MULTIPLEXER | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16 | DIFFERENTIAL MULTIPLEXER | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16 | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP16,.3 | DIP-16 | SOP-16 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | LSOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDIP-T16 | R-GDIP-T16 | R-PDSO-G16 | R-GDIP-T16 | R-PDSO-G16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-PDSO-G16 |
| 信道数量 | 8 | 2 | 4 | 4 | 8 | 8 | 8 | 4 | 2 | 2 |
| 功能数量 | 1 | 3 | 1 | 1 | 1 | 1 | 1 | 1 | 3 | 3 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最大通态电阻 (Ron) | 1200 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | LSOP | DIP | SOP | DIP | DIP | DIP | DIP | LSOP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE, LOW PROFILE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE, LOW PROFILE |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | YES | NO | YES | NO | NO | NO | NO | YES |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 零件包装代码 | - | DIP | SOIC | DIP | - | DIP | DIP | DIP | DIP | SOIC |
| 针数 | - | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 | 16 |
| 其他特性 | - | LG-MAX | - | LG-MAX | - | LG-MAX | LG-MAX | LG-MAX | LG-MAX | - |
| 长度 | - | 19.94 mm | 9.902 mm | 19.94 mm | 9.902 mm | 19.94 mm | 19.94 mm | 19.94 mm | 19.94 mm | 9.902 mm |
| 通态电阻匹配规范 | - | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω |
| 座面最大高度 | - | 5.08 mm | 1.549 mm | 5.08 mm | 1.753 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 1.549 mm |
| 最大供电电压 (Vsup) | - | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 最小供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | - | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
| 最长断开时间 | - | 420 ns | 420 ns | 420 ns | 420 ns | 420 ns | 420 ns | 420 ns | 420 ns | 420 ns |
| 最长接通时间 | - | 1200 ns | 1200 ns | 1200 ns | 1200 ns | 1200 ns | 1200 ns | 1200 ns | 1200 ns | 1200 ns |
| 宽度 | - | 7.62 mm | 3.899 mm | 7.62 mm | 3.9 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 3.899 mm |
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