SRAM Module, 256KX64, CMOS
参数名称 | 属性值 |
厂商名称 | SMART Modular Technology Inc |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.B.2.A |
JESD-30 代码 | R-XZMA-N144 |
内存密度 | 16777216 bit |
内存集成电路类型 | SRAM MODULE |
内存宽度 | 64 |
功能数量 | 1 |
端子数量 | 144 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | SYNCHRONOUS |
组织 | 256KX64 |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | CMOS |
端子形式 | NO LEAD |
端子位置 | ZIG-ZAG |
SM564X460B1NWAA | FUJ64X460B1NWAA | FUJ64X260B1NWAA | SM564X460B1NWAC | FUJ64X260B1NWAC | SM564X260B1NWAA | SM564X260B1NWAC | |
---|---|---|---|---|---|---|---|
描述 | SRAM Module, 256KX64, CMOS | SRAM Module, 256KX64, CMOS | SRAM Module, 512KX64, CMOS | SRAM Module, 256KX64, CMOS | SRAM Module, 512KX64, CMOS | SRAM Module, 512KX64, CMOS | SRAM Module, 512KX64, CMOS |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
JESD-30 代码 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 |
内存密度 | 16777216 bit | 16777216 bit | 33554432 bit | 16777216 bit | 33554432 bi | 33554432 bi | 33554432 bi |
内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
字数 | 262144 words | 262144 words | 524288 words | 262144 words | 524288 words | 524288 words | 524288 words |
字数代码 | 256000 | 256000 | 512000 | 256000 | 512000 | 512000 | 512000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
组织 | 256KX64 | 256KX64 | 512KX64 | 256KX64 | 512KX64 | 512KX64 | 512KX64 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
厂商名称 | SMART Modular Technology Inc | - | SMART Modular Technology Inc | SMART Modular Technology Inc | SMART Modular Technology Inc | SMART Modular Technology Inc | SMART Modular Technology Inc |
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