DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD750104,750106,750108,750104(A),750106(A),750108(A)
4 BIT SINGLE-CHIP MICROCONTROLLER
The
µ
PD750108 is one of the 75XL series 4-bit single-chip microcontrollers, which provide data processing
capability equal to that of an 8-bit microcontroller.
The
µ
PD750108 is produced by replacing the main system clock oscillator of the
µ
PD750008 with an RC oscillator,
enabling operation at a relatively low voltage of 1.8 V. In addition, it is best suited to applications using batteries.
The
µ
PD750108(A) has a higher reliability than the
µ
PD750108.
A built-in one-time PROM product,
µ
PD75P0116, is also available. It is suitable for small-scale production and
evaluation of application systems.
The following user’s manual describes the details of the functions of the
µ
PD750108. Be sure to read it
before designing application systems.
µ
PD750108 User’s Manual: U11330E
FEATURES
• Built-in RC oscillator
• Enables the immediate start of processing after the
release of standby mode
• Capable of low-voltage operation: V
DD
= 1.8 to 5.5 V
• Internal memory
Program memory (ROM)
: 4,096
×
8 bits (
µ
PD750104 and
µ
PD750104(A))
: 6,144
×
8 bits (
µ
PD750106 and
µ
PD750106(A))
: 8,192
×
8 bits (
µ
PD750108 and
µ
PD750108(A))
Data memory (RAM)
: 512
×
4 bits
• Function for specifying the instruction execution time
(useful for saving power)
4
µ
s, 8
µ
s, 16
µ
s, 64
µ
s (when operating at 1.0 MHz)
2
µ
s, 4
µ
s, 8
µ
s, 32
µ
s (when operating at 2.0 MHz)
122
µ
s (when operating at 32.768 kHz)
• Enhanced timer function (4 channels)
• Can be easily substituted for the
µ
PD750008 because
this product succeeds to the functions and instructions
of the
µ
PD750008.
APPLICATIONS
•
µ
PD750104,
µ
PD750106, and
µ
PD750108
Cameras, meters, and pagers
•
µ
PD750104(A),
µ
PD750106(A), and
µ
PD750108(A)
Electrical equipment for automobiles
The
µ
PD750104,
µ
PD750106,
µ
PD750108,
µ
PD750104(A),
µ
PD750106(A), and
µ
PD750108(A) differ only in
quality grade. In this manual, the
µ
PD750108 is described unless otherwise specified. Users of other than the
µ
PD750108 should read
µ
PD750108 as referring to the pertinent product.
When the description differs among
µ
PD750104,
µ
PD750106, and
µ
PD750108, they also refer to the pertinent
(A) products.
µ
PD750104
→
µ
PD750104(A),
µ
PD750106
→
µ
PD750106(A),
µ
PD750108
→
µ
PD750108(A)
The information in this document is subject to change without notice.
Document No. U12301EJ1V0DS00 (1st edition)
Date Published July 1997 J
Printed in Japan
©
1990
1997
µ
PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)
ORDERING INFORMATION
Part number
Package
42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
44-pin plastic QFP (10
×
10 mm, 0.8-mm-pitch)
42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
Quality grade
Standard
Standard
Standard
Standard
Standard
Standard
Special
Special
Special
Special
Special
Special
µ
PD750104CU-×××
µ
PD750104GB-×××-3BS-MTX
µ
PD750106CU-×××
µ
PD750106GB-×××-3BS-MTX
µ
PD750108CU-×××
µ
PD750108GB-×××-3BS-MTX
µ
PD750104CU(A)-×××
µ
PD750104GB(A)-×××-3BS-MTX
µ
PD750106CU(A)-×××
µ
PD750106GB(A)-×××-3BS-MTX
µ
PD750108CU(A)-×××
µ
PD750108GB(A)-×××-3BS-MTX
Remark
×××
is a mask ROM code number.
Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
DIFFERENCES BETWEEN
µ
PD75010× AND
µ
PD75010×(A)
Product number
µ
PD750104
µ
PD750106
µ
PD750104(A)
µ
PD750106(A)
µ
PD750108(A)
Special
Item
Quality grade
µ
PD750108
Standard
2
µ
PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)
FUNCTIONS
Item
Command execution
time
Function
• 4, 8, 16, or 64
µ
s (when the main system clock operates at 1.0 MHz)
• 2, 4, 8, or 32
µ
s (when the main system clock operates at 2.0 MHz)
• 122
µ
s (when the subsystem clock operates at 32.768 kHz)
4,096
×
8 bits (
µ
PD750104)
6,144
×
8 bits (
µ
PD750106)
8,192
×
8 bits (
µ
PD750108)
RAM
General-purpose
register
I/O port
CMOS input
CMOS I/O
512
×
4 bits
• When operating in 4 bits: 8
×
4 banks
• When operating in 8 bits: 4
×
4 banks
8
18
Can incorporate 7 pull-up resistors that are specified with the software.
Can directly drive the LED.
Can incorporate 18 pull-up resistors that are specified with the software.
Can directly drive the LED.
Can withstand 13 V.
Can incorporate pull-up resistors that are specified with the mask option.
Internal memory
ROM
N-ch open
drain I/O
8
Total
Timer
34
4 channels
•
8-bit timer/event counter: 1 channel
•
8-bit timer counter: 1 channel
Serial interface
•
•
•
•
•
Basic interval timer/watchdog timer: 1 channel
lock timer: 1 channel
Three-wire serial I/O mode ... switchable between the start LSB and the start MSB
Two-wire serial I/O mode
SBI mode
Bit sequential buffer (BSB)
Clock output (PCL)
16 bits
•
Φ
, 125, 62.5, or 15.6 kHz (when the main system clock operates at 1.0 MHz)
•
Φ
, 250, 125, or 31.3 kHz (when the main system clock operates at 2.0 MHz)
•
2, 4, or 32 kHz (when the subsystem clock operates at 32.768 kHz)
•
0.488, 0.977, or 7.813 kHz (when the main system clock operates at 1.0 MHz)
•
0.977, 1.953, or 15.625 kHz (when the main system clock operates at 2.0 MHz)
External :
Internal :
3
4
1
1
Buzzer output (BUZ)
Vectored interrupt
Test input
External :
Internal :
System clock oscillator
Standby
Operating ambient
temperature range
Supply voltage
Package
•
•
RC oscillator for main system clock (with external resistor and capacitor)
Crystal oscillator for subsystem clock
STOP/HALT mode
T
A
= -40 to +85
°C
V
DD
= 1.8 to 5.5 V
42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
44-pin plastic QFP (10
×
10 mm, 0.8-mm pitch)
3
µ
PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)
CONTENTS
1.
2.
3.
PIN CONFIGURATION (TOP VIEW) .........................................................................................
BLOCK DIAGRAM .....................................................................................................................
PIN FUNCTIONS ........................................................................................................................
3.1
3.2
3.3
3.4
Port Pins .........................................................................................................................................
Non-Port Pins .................................................................................................................................
Pin Input/Output Circuits ..............................................................................................................
Connection of Unused Pins .........................................................................................................
6
8
9
9
10
11
13
4.
Mk
Ι
MODE/Mk
ΙΙ
MODE SWITCH FUNCTION ........................................................................
4.1
4.2
Differences between Mk
Ι
Mode and Mk
ΙΙ
Mode ......................................................................
Setting of the Stack Bank Selection Register (SBS) ................................................................
14
14
15
5.
6.
MEMORY CONFIGURATION ....................................................................................................
PERIPHERAL HARDWARE FUNCTIONS ................................................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
Digital I/O Ports ..............................................................................................................................
Clock Generator .............................................................................................................................
Control Functions of Subsystem Clock Oscillator ...................................................................
Clock Output Circuit ......................................................................................................................
Basic Interval Timer/Watchdog Timer ........................................................................................
Clock Timer .....................................................................................................................................
Timer/Event Counter .....................................................................................................................
Serial Interface ...............................................................................................................................
Bit Sequential Buffer .....................................................................................................................
16
21
21
21
23
24
25
26
27
30
32
7.
8.
9.
INTERRUPT FUNCTIONS AND TEST FUNCTIONS ...............................................................
STANDBY FUNCTION ...............................................................................................................
RESET FUNCTION .....................................................................................................................
33
35
36
39
40
53
65
10. MASK OPTION ...........................................................................................................................
11. INSTRUCTION SET ....................................................................................................................
12. ELECTRICAL CHARACTERISTICS .........................................................................................
13. CHARACTERISTIC CURVE (REFERENCE VALUES) ............................................................
4
µ
PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)
14. EXAMPLES OF RC OSCILLATOR FREQUENCY CHARACTERISTICS (REFERENCE
VALUES) .....................................................................................................................................
15. PACKAGE DRAWINGS .............................................................................................................
16. RECOMMENDED SOLDERING CONDITIONS ........................................................................
APPENDIX A
APPENDIX B
APPENDIX C
FUNCTIONS OF THE
µ
PD750008,
µ
PD750108, AND
µ
PD75P0116 ..................
DEVELOPMENT TOOLS ........................................................................................
RELATED DOCUMENTS ........................................................................................
66
68
70
71
73
77
5
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