Math Processor, CMOS, CQCC84
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | unknow |
| JESD-30 代码 | S-XQCC-J84 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 1 |
| 端子数量 | 84 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC84,1.2SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 最大压摆率 | 720 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 79R2010A16QJB | IDT79R2010A16QJ | 79R2010A16QJ | IDT79R2010A16QJB | 79R2010A12QJ | 79R2010A12QJB | 79R2010AA-12QJ | 79R2010AA-16QJ | IDT79R2010A12QJ | IDT79R2010A12QJB | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Math Processor, CMOS, CQCC84 | Math Processor, CMOS, CQCC84 | Math Processor, CMOS, CQCC84 | Math Processor, CMOS, CQCC84 | Math Processor, CMOS, CQCC84 | Math Processor, CMOS, CQCC84 | Math Processor, CMOS, CQCC84 | Math Processor, CMOS, CQCC84 | Math Processor, CMOS, CQCC84 | Math Processor, CMOS, CQCC84 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| JESD-30 代码 | S-XQCC-J84 | S-XQCC-J84 | S-XQCC-J84 | S-XQCC-J84 | S-XQCC-J84 | S-XQCC-J84 | S-XQCC-J84 | S-XQCC-J84 | S-XQCC-J84 | S-XQCC-J84 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 720 mA | 625 mA | 625 mA | 720 mA | 550 mA | 675 mA | 550 mA | 625 mA | 550 mA | 675 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 厂商名称 | - | - | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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