Datasheet> 器件分类 > 存储> 存储> MX29LA320DHXCI-70G

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MX29LA320DHXCI-70G: 产品描述Flash, 2MX16, 70ns, PBGA64, 10 X 13 MM, 1.20 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, MO-216, FBGA-64; 产品类别存储存储; 文件大小2MB，共63页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

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MX29LA320DHXCI-70G概述

Flash, 2MX16, 70ns, PBGA64, 10 X 13 MM, 1.20 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, MO-216, FBGA-64

MX29LA320DHXCI-70G规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Macronix
零件包装代码	BGA
包装说明	TBGA, BGA64,8X8,40
针数	64
Reach Compliance Code	unknown
ECCN代码	3A991.B.1.A
最长访问时间	70 ns
备用内存宽度	8
命令用户界面	YES
通用闪存接口	YES
数据轮询	YES
JESD-30 代码	R-PBGA-B64
长度	13 mm
内存密度	33554432 bit
内存集成电路类型	FLASH
内存宽度	16
功能数量	1
部门数/规模	64
端子数量	64
字数	2097152 words
字数代码	2000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	2MX16
封装主体材料	PLASTIC/EPOXY
封装代码	TBGA
封装等效代码	BGA64,8X8,40
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3/3.3 V
编程电压	3 V
认证状态	Not Qualified
就绪/忙碌	YES
座面最大高度	1.2 mm
部门规模	64K
最大待机电流	0.000015 A
最大压摆率	0.03 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
切换位	YES
类型	NOR TYPE
宽度	10 mm

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MX29LA320D H/L

DATASHEET

P/N:PM1427

REV.1.2, MAR. 01, 2010

MX29LA320D H/L

Contents

FEATURES ............................................................................................................................................................. 5

GENERAL DESCRIPTION ..................................................................................................................................... 6

PIN CONFIGURATION ........................................................................................................................................... 7

PIN DESCRIPTION ................................................................................................................................................. 7

BLOCK DIAGRAM.................................................................................................................................................. 8

BLOCK STRUCTURE............................................................................................................................................. 9

Table 1. MX29LA320D SECTOR ARCHITECTURE ..................................................................................... 9

BUS OPERATION ................................................................................................................................................. 11

Table 2-1. BUS OPERATION ...................................................................................................................... 11

Table 2-2. BUS OPERATION ...................................................................................................................... 12

FUNCTIONAL DESCRIPTION.............................................................................................................................. 13

WRITE COMMANDS/COMMAND SEQUENCES ....................................................................................... 13

REQUIREMENTS FOR READING ARRAY DATA....................................................................................... 13

ACCELERATED PROGRAM OPERATION ................................................................................................ 14

RESET# OPERATION ................................................................................................................................ 14

SECTOR PROTECT OPERATION ............................................................................................................. 14

CHIP UNPROTECT OPERATION............................................................................................................... 14

TEMPORARY SECTOR UNPROTECT OPERATION ................................................................................ 14

WRITE PROTECT (WP#) ........................................................................................................................... 15

AUTOMATIC SELECT OPERATION........................................................................................................... 15

VERIFY SECTOR PROTECT STATUS OPERATION ................................................................................ 15

SECURITY SECTOR FLASH MEMORY REGION ..................................................................................... 15

FACTORY LOCKED: SECURITY SECTOR PROGRAMMED AND PROTECTED AT THE FACTORY ..... 15

CUSTOMER LOCKABLE : SECURITY SECTOR NOT PROGRAMMED OR PROTECTED AT THE

FACTORY.................................................................................................................................................... 15

DATA PROTECTION ................................................................................................................................... 16

LOW VCC WRITE INHIBIT ......................................................................................................................... 16

WRITE PULSE "GLITCH" PROTECTION................................................................................................... 16

LOGICAL INHIBIT ....................................................................................................................................... 16

POWER-UP SEQUENCE ........................................................................................................................... 16

POWER-UP WRITE INHIBIT ...................................................................................................................... 16

POWER SUPPLY DECOUPLING ............................................................................................................... 16

COMMAND DEFINITIONS.................................................................................................................................... 17

TABLE 3. MX29LA320D H/L COMMAND DEFINITIONS............................................................................ 17

RESET COMMAND .................................................................................................................................... 19

AUTOMATIC SELECT COMMAND SEQUENCE ....................................................................................... 19

AUTOMATIC PROGRAMMING .................................................................................................................. 20

CHIP ERASE.............................................................................................................................................. 21

SECTOR ERASE ........................................................................................................................................ 21

P/N:PM1427

REV.1.2, MAR. 01, 2010

MX29LA320D H/L

SECTOR ERASE SUSPEND ...................................................................................................................... 22

SECTOR ERASE RESUME ........................................................................................................................ 22

COMMON FLASH INTERFACE (CFI) MODE ...................................................................................................... 23

QUERY COMMAND AND COMMON FLASH MEMORY INTERFACE (CFI) MODE.................................. 23

Table 4-1. CFI mode: Identification Data Values

......................................................................................... 23

Table 4-2. CFI Mode: System Interface Data Values

.................................................................................. 23

Table 4-3. CFI Mode: Device Geometry Data Values

.................................................................................. 24

Table 4-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values

............................................ 25

ELECTRICAL CHARACTERISTICS .................................................................................................................... 26

ABSOLUTE MAXIMUM STRESS RATINGS............................................................................................... 26

OPERATING TEMPERATURE AND VOLTAGE .......................................................................................... 26

DC CHARACTERISTICS ............................................................................................................................ 27

SWITCHING TEST CIRCUITS .................................................................................................................... 28

SWITCHING TEST WAVEFORMS ............................................................................................................ 28

AC CHARACTERISTICS ............................................................................................................................ 29

WRITE COMMAND OPERATION......................................................................................................................... 30

Figure 1. COMMAND WRITE OPERATION WAVEFORM

......................................................................... 30

READ/RESET OPERATION ................................................................................................................................. 31

Figure 2. READ TIMING WAVEFORMS

..................................................................................................... 31

Figure 3. RESET# TIMING WAVEFORM

................................................................................................... 32

ERASE/PROGRAM OPERATION ........................................................................................................................ 33

Figure 4. AUTOMATIC CHIP ERASE TIMING WAVEFORM

...................................................................... 33

Figure 5. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART

............................................................ 34

Figure 6. AUTOMATIC SECTOR ERASE TIMING WAVEFORM

................................................................ 35

Figure 7. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART

.................................................... 36

Figure 8. ERASE SUSPEND/RESUME FLOWCHART

.............................................................................. 37

Figure 9. SECURED SILICON SECTOR PROTECTED ALGORITHMS FLOWCHART

............................. 38

Figure 10. AUTOMATIC PROGRAM TIMING WAVEFORMS

..................................................................... 39

Figure 11. ACCELERATED PROGRAM TIMING DIAGRAM

...................................................................... 39

Figure 12. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART

.................................................... 40

Figure 13. CE# CONTROLLED PROGRAM TIMING WAVEFORM

............................................................ 41

SECTOR PROTECT/CHIP UNPROTECT ............................................................................................................ 42

Figure 14. SECTOR PROTECT/CHIP UNPROTECT WAVEFORM (RESET# Control)

............................. 42

Figure 15-1. IN-SYSTEM SECTOR PROTECT WITH RESET#=Vhv

........................................................ 43

Figure 15-2. CHIP UNPROTECT ALGORITHMS WITH RESET#=Vhv

...................................................... 44

Figure 16. SECTOR PROTECT TIMING WAVEFORM (A9, OE# Control)

................................................ 45

Figure 17. SECTOR PROTECTION ALGORITHM (A9, OE# Control)

........................................................ 46

Figure 18. CHIP UNPROTECT TIMING WAVEFORM (A9, OE# Control)

.................................................. 47

Figure 19. CHIP UNPROTECT ALROGITHM (A9, OE# Control)

............................................................... 48

Figure 20. TEMPORARY SECTOR UNPROTECT WAVEFORMS

............................................................. 49

Figure 21. TEMPORARY SECTOR UNPROTECT ALROGITHM

............................................................... 50

P/N:PM1427

REV.1.2, MAR. 01, 2010

MX29LA320D H/L

SILICON ID READ OPERATION .......................................................................................................................... 51

Figure 22. SILICON ID READ TIMING WAVEFORM

.................................................................................. 51

WRITE OPERATION STATUS .............................................................................................................................. 52

Figure 23. DATA# POLLING TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)

.................. 52

Figure 24. DATA# POLLING ALGORITHM

................................................................................................. 53

Figure 25. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)

....................... 54

Figure 26. TOGGLE BIT ALGORITHM........................................................................................................

Figure 27. Q6 versus Q2

............................................................................................................................. 56

RECOMMENDED OPERATING CONDITIONS .................................................................................................... 57

ERASE AND PROGRAMMING PERFORMANCE ............................................................................................... 58

DATA RETENTION .............................................................................................................................................. 58

LATCH-UP CHARACTERISTICS ......................................................................................................................... 58

PIN CAPACITANCE .............................................................................................................................................. 58

ORDERING INFORMATION ................................................................................................................................. 59

PART NAME DESCRIPTION ................................................................................................................................ 60

PACKAGE INFORMATION ................................................................................................................................... 61

REVISION HISTORY ............................................................................................................................................ 62

P/N:PM1427

REV.1.2, MAR. 01, 2010

MX29LA320DHXCI-70G相似产品对比

	MX29LA320DHXCI-70G	MX29LA320DLXCI-70G
描述	Flash, 2MX16, 70ns, PBGA64, 10 X 13 MM, 1.20 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, MO-216, FBGA-64	Flash, 2MX16, 70ns, PBGA64, 10 X 13 MM, 1.20 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, MO-216, FBGA-64
是否Rohs认证	符合	符合
厂商名称	Macronix	Macronix
零件包装代码	BGA	BGA
包装说明	TBGA, BGA64,8X8,40	TBGA, BGA64,8X8,40
针数	64	64
Reach Compliance Code	unknown	unknown
ECCN代码	3A991.B.1.A	3A991.B.1.A
最长访问时间	70 ns	70 ns
备用内存宽度	8	8
命令用户界面	YES	YES
通用闪存接口	YES	YES
数据轮询	YES	YES
JESD-30 代码	R-PBGA-B64	R-PBGA-B64
长度	13 mm	13 mm
内存密度	33554432 bit	33554432 bit
内存集成电路类型	FLASH	FLASH
内存宽度	16	16
功能数量	1	1
部门数/规模	64	64
端子数量	64	64
字数	2097152 words	2097152 words
字数代码	2000000	2000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C
最低工作温度	-40 °C	-40 °C
组织	2MX16	2MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TBGA	TBGA
封装等效代码	BGA64,8X8,40	BGA64,8X8,40
封装形状	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE
并行/串行	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED
电源	3/3.3 V	3/3.3 V
编程电压	3 V	3 V
认证状态	Not Qualified	Not Qualified
就绪/忙碌	YES	YES
座面最大高度	1.2 mm	1.2 mm
部门规模	64K	64K
最大待机电流	0.000015 A	0.000015 A
最大压摆率	0.03 mA	0.03 mA
最大供电电压 (Vsup)	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V
表面贴装	YES	YES
技术	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	BALL
端子节距	1 mm	1 mm
端子位置	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED
切换位	YES	YES
类型	NOR TYPE	NOR TYPE
宽度	10 mm	10 mm

MX29LA320DHXCI-70G

MX29LA320DHXCI-70G概述

MX29LA320DHXCI-70G规格参数

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