50K DIGITAL POTENTIOMETER, INCREMENT/DECREMENT CONTROL INTERFACE, 32 POSITIONS, PDSO8, 2.50 X 2 MM, ROHS COMPLIANT, PLASTIC, TDFN-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, SOLCC8,.08,20 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | NONVOLATILE MEMORY |
| 控制接口 | INCREMENT/DECREMENT |
| 转换器类型 | DIGITAL POTENTIOMETER |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 2.5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 位置数 | 32 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.08,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3 V |
| 认证状态 | Not Qualified |
| 电阻定律 | LINEAR |
| 最大电阻容差 | 30% |
| 最大电阻器端电压 | 3.3 V |
| 最小电阻器端电压 | |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 标称温度系数 | 35 ppm/°C |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 标称总电阻 | 50000 Ω |
| 宽度 | 2 mm |
| X93154UU8IZ-3 | X93154UM8I-3T1 | X93154UM8IZ-3T1 | X93154UU8IZ-3T1 | X93154UM8IZ-3 | X93154UM8I-3 | |
|---|---|---|---|---|---|---|
| 描述 | 50K DIGITAL POTENTIOMETER, INCREMENT/DECREMENT CONTROL INTERFACE, 32 POSITIONS, PDSO8, 2.50 X 2 MM, ROHS COMPLIANT, PLASTIC, TDFN-8 | 50K DIGITAL POTENTIOMETER, INCREMENT/DECREMENT CONTROL INTERFACE, 32 POSITIONS, PDSO8, PLASTIC, MO-187AA, MSOP-8 | Digitally Controlled Potentiometer (XDCP™); MSOP8; Temp Range: -40° to 85°C | 50K DIGITAL POTENTIOMETER, INCREMENT/DECREMENT CONTROL INTERFACE, 32 POSITIONS, PDSO8, 2.50 X 2 MM, ROHS COMPLIANT, PLASTIC, TDFN-8 | Digitally Controlled Potentiometer (XDCP™); MSOP8; Temp Range: -40° to 85°C | 50K DIGITAL POTENTIOMETER, INCREMENT/DECREMENT CONTROL INTERFACE, 32 POSITIONS, PDSO8, MSOP-8 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | DFN | TSSOP | MSOP | DFN | MSOP | MSOP |
| 包装说明 | HVSON, SOLCC8,.08,20 | PLASTIC, MO-187AA, MSOP-8 | TSSOP, TSSOP8,.19 | HVSON, SOLCC8,.08,20 | TSSOP, TSSOP8,.19 | PLASTIC, MO-187AA, MSOP-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | not_compliant | compliant | compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 控制接口 | INCREMENT/DECREMENT | INCREMENT/DECREMENT | INCREMENT/DECREMENT | INCREMENT/DECREMENT | INCREMENT/DECREMENT | INCREMENT/DECREMENT |
| 转换器类型 | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER |
| JESD-30 代码 | R-PDSO-N8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-N8 | S-PDSO-G8 | S-PDSO-G8 |
| 长度 | 2.5 mm | 3 mm | 3 mm | 2.5 mm | 3 mm | 3 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位置数 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | TSSOP | TSSOP | HVSON | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 电阻定律 | LINEAR | LINEAR | LINEAR | LINEAR | LINEAR | LINEAR |
| 最大电阻器端电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3 V |
| 座面最大高度 | 0.8 mm | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm | 1.07 mm |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 标称温度系数 | 35 ppm/°C | 35 ppm/°C | 35 ppm/°C | 35 ppm/°C | 35 ppm/°C | 35 ppm/°C |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 标称总电阻 | 50000 Ω | 50000 Ω | 50000 Ω | 50000 Ω | 50000 Ω | 50000 Ω |
| 宽度 | 2 mm | 3 mm | 3 mm | 2 mm | 3 mm | 3 mm |
| 其他特性 | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY | - |
| JESD-609代码 | e3 | e0 | e3 | e3 | e3 | - |
| 湿度敏感等级 | 1 | 1 | 2 | 1 | 2 | - |
| 封装等效代码 | SOLCC8,.08,20 | TSSOP8,.19 | TSSOP8,.19 | SOLCC8,.08,20 | TSSOP8,.19 | - |
| 峰值回流温度（摄氏度） | 260 | 240 | 260 | 260 | 260 | - |
| 电源 | 3 V | 3 V | 3 V | 3 V | 3 V | - |
| 最大电阻容差 | 30% | 30% | 30% | 30% | 30% | - |
| 端子面层 | MATTE TIN | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - annealed | MATTE TIN | Matte Tin (Sn) - annealed | - |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 | 40 | 40 | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
DSP 与 ARM 处理器
RF/无线
微控制器 MCU
FPGA/CPLD
RF/无线
stm32/stm8
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
