DATA SHEET
µ
PD753012, 753016, 753017
4-BIT SINGLE-CHIP MICROCONTROLLER
MOS INTEGRATED CIRCUIT
DESCRIPTION
The
µ
PD753017 is one of the 75XL series 4-bit single-chip microcontroller chips and has a data processing
capability comparable to that of an 8-bit microcontroller.
It has an on-chip LCD controller/driver with a larger ROM capacity and extended CPU functions compared with
the conventional
µ
PD75316B, and can provide high-speed operation. It can be supplied in a small plastic TQFP
package (12
×
12 mm) and is suitable for small sets using LCD panels.
For details of functions refer to the following User’s Manual.
µ
PD753017 User’s Manual : U11282E
FEATURES
• Low voltage operation: V
DD
= 2.2 to 5.5 V
· Can be driven by two 1.5 V batteries
• On-chip memory
· Program memory (ROM):
12288
×
8 bits (
µ
PD753012)
16384
×
8 bits (
µ
PD753016)
24576
×
8 bits (
µ
PD753017)
· Data memory (RAM):
1024
×
4 bits
• Capable of high-speed operation and variable in-
struction execution time for power saving
· 0.95, 1.91, 3.81, 15.3
µ
s (at 4.19 MHz operation)
· 0.67, 1.33, 2.67, 10.7
µ
s (at 6.0 MHz operation)
· 122
µ
s (at 32.768 kHz operation)
• Internal programmable LCD controller/driver
• Small plastic TQFP (12
×
12 mm)
· Suitable for small sets such as cameras
• One-time PROM:
µ
PD75P3018
APPLICATION
Remote controllers, camera-contained VCRs, cameras, gas meters, etc.
ORDERING INFORMATION
Part number
Package
80-pin plastic QFP (14
×
14 mm)
80-pin plastic TQFP (fine pitch) (12
×
12 mm)
80-pin plastic QFP (14
×
14 mm)
80-pin plastic TQFP (fine pitch) (12
×
12 mm)
80-pin plastic QFP (14
×
14 mm)
80-pin plastic TQFP (fine pitch) (12
×
12 mm)
µ
PD753012GC-XXX-3B9
µ
PD753012GK-XXX-BE9
µ
PD753016GC-XXX-3B9
µ
PD753016GK-XXX-BE9
µ
PD753017GC-XXX-3B9
µ
PD753017GK-XXX-BE9
Remark
XXX indicates a ROM code suffix.
In this document, unless otherwise specified, the description is made based on
µ
PD753017
as typical product.
The information in this document is subject to change without notice.
Document No. U10140EJ2V0DS00 (2nd edition)
Date Published December 1997 N
Printed in Japan
The mark
shows major revised points.
©
1995
µ
PD753012, 753016, 753017
FUNCTIONAL OUTLINE
Parameter
Instruction execution time
Function
• 0.95, 1.91, 3.81, 15.3
µ
s (main system clock: at 4.19 MHz operation)
• 0.67, 1.33, 2.67, 10.7
µ
s (main system clock: at 6.0 MHz operation)
• 122
µ
s (subsystem clock: at 32.768 kHz operation)
ROM
12288
×
8 bits (
µ
PD753012)
16384
×
8 bits (
µ
PD753016)
24576
×
8 bits (
µ
PD753017)
RAM
General-purpose register
1024
×
4 bits
• 4-bit operation: 8
×
4 banks
• 8-bit operation: 4
×
4 banks
8
16
8
8
Also used for segment pins
Withstands 13 V, on-chip pull-up resistors can be specified by using mask
option
On-chip pull-up resistors can be specified by using software: 23
On-chip memory
Input/
output
port
CMOS input
CMOS input/output
CMOS output
N-ch open-drain
input/output
Total
40
• Segment number selection
• Display mode selection
: 24/28/32 segments (can be changed to CMOS
output port in 4 time-unit; max. 8)
: Static 1/2 duty (1/2 bias)
1/3 duty (1/2 bias)
1/3 duty (1/3 bias)
1/4 duty (1/3 bias)
On-chip split resistor for LCD drive can be specified by using mask option
LCD controller/driver
Timer
5 channels
• 8-bit timer/event counter: 3 channels (can be used for 16-bit timer/event counter,
carrier generator, or timer with gate)
• Basic interval timer/watchdog timer: 1 channel
• Watch timer: 1 channel
Serial interface
• 3-wire serial I/O mode ... MSB or LSB can be selected for transferring top bit
• 2-wire serial I/O mode
• SBI mode
Bit sequential buffer
Clock output (PCL)
16 bits
•
Φ,
524, 262, 65.5 kHz (main system clock: at 4.19 MHz operation)
•
Φ,
750, 375, 93.8 kHz (main system clock: at 6.0 MHz operation)
• 2, 4, 32 kHz
(main system clock: at 4.19 MHz operation
or subsystem clock: at 32.768 kHz operation)
Buzzer output (BUZ)
• 2.93, 5.86, 46.9 kHz (main system clock: at 6.0 MHz operation)
Vectored interrupts
Test input
System clock oscillator
External: 3, Internal: 5
External: 1, Internal: 1
• Ceramic or crystal oscillator for main system clock oscillation
• Crystal oscillator for subsystem clock oscillation
STOP/HALT mode
V
DD
= 2.2 to 5.5 V
• 80-pin plastic QFP (14
×
14 mm)
• 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
Standby function
Power supply voltage
Package
2
µ
PD753012, 753016, 753017
CONTENTS
1. PIN CONFIGURATION (TOP VIEW) ................................................................................................... 5
2. BLOCK DIAGRAM ............................................................................................................................... 7
3. PIN
3.1
3.2
3.3
3.4
FUNCTION .................................................................................................................................... 8
Port Pins ...................................................................................................................................... 8
Pins Other than Port Pins ........................................................................................................ 10
Pin Input/Output Circuits ......................................................................................................... 12
Recommended Connection for Unused Pins ......................................................................... 14
4. SWITCHING FUNCTION BETWEEN MK I MODE AND MK II MODE ...................................... 15
4.1 Differences between Mk I Mode and Mk II Mode .................................................................... 15
4.2 Setting Method of Stack Bank Select Register (SBS) ........................................................... 16
5. MEMORY CONFIGURATION ............................................................................................................17
6. PERIPHERAL HARDWARE FUNCTIONS ....................................................................................... 21
6.1 Digital Input/Output Ports ........................................................................................................ 21
6.2 Clock Generator ........................................................................................................................22
6.3 Subsystem Clock Oscillator Control Functions .................................................................... 23
6.4 Clock Output Circuit ................................................................................................................. 24
6.5 Basic Interval Timer/Watchdog Timer ..................................................................................... 25
6.6 Watch Timer ..............................................................................................................................26
6.7 Timer/Event Counter ................................................................................................................. 27
6.8 Serial Interface ..........................................................................................................................31
6.9 LCD Controller/Driver ............................................................................................................... 33
6.10 Bit Sequential Buffer … 16 Bits ............................................................................................... 35
7. INTERRUPT FUNCTION AND TEST FUNCTION ........................................................................... 36
8. STANDBY FUNCTION ....................................................................................................................... 38
9. RESET FUNCTION ............................................................................................................................ 39
10. MASK OPTION .................................................................................................................................. 42
11. INSTRUCTION SETS AND THEIR OPERATIONS ........................................................................ 43
12. ELECTRICAL SPECIFICATIONS ...................................................................................................... 55
13. PACKAGE DRAWINGS ..................................................................................................................... 68
14. RECOMMENDED SOLDERING CONDITIONS ................................................................................ 70
3
µ
PD753012, 753016, 753017
APPENDIX A
µ
PD75316B, 753017 AND 75P3018 FUNCTION LIST ................................................ 72
APPENDIX B DEVELOPMENT TOOLS ................................................................................................. 74
APPENDIX C RELATED DOCUMENTS ................................................................................................. 78
4
µ
PD753012, 753016, 753017
1. PIN CONFIGURATION (TOP VIEW)
• 80-pin plastic QFP (14
×
14 mm)
µ
PD753012GC-XXX-3B9, 753016GC-XXX-3B9,
µ
PD753017GC-XXX-3B9
• 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
µ
PD753012GK-XXX-BE9, 753016GK-XXX-BE9,
µ
PD753017GK-XXX-BE9
S12
S13
S14
S15
S16
S17
S18
S19
S20
S21
S22
S23
S24/BP0
S25/BP1
S26/BP2
S27/BP3
S28/BP4
S29/BP5
S30/BP6
S31/BP7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
S7
S6
S5
S4
S3
S2
S1
S0
RESET
P73/KR7
P72/KR6
P71/KR5
P70/KR4
P63/KR3
P62/KR2
P61/KR1
S11
S10
S9
S8
P60/KR0
X2
X1
Note
IC
XT2
XT1
V
DD
P33
P32
P31/SYNC
P30/LCDCL
P23/BUZ
P22/PCL/PTO2
P21/PTO1
P20/PTO0
P13/TI0
P12/INT2/TI1/TI2
P11/INT1
P10/INT0
P03/SI/SB1
Note
Connect the IC (Internally Connected) pin directly to V
DD
.
P51
P52
P53
P00/INT4
P01/SCK
P02/SO/SB0
COM3
BIAS
V
LC0
COM0
COM1
COM2
V
LC1
V
LC2
P40
P41
P42
P43
V
SS
P50
5
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