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IS45S16800E-7BLA2

产品描述Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, BGA-54
产品类别存储    存储   
文件大小886KB,共62页
制造商Integrated Silicon Solution ( ISSI )
标准  
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IS45S16800E-7BLA2概述

Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, BGA-54

IS45S16800E-7BLA2规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Integrated Silicon Solution ( ISSI )
零件包装代码BGA
包装说明TFBGA, BGA54,9X9,32
针数54
Reach Compliance Codecompliant
ECCN代码EAR99
访问模式FOUR BANK PAGE BURST
最长访问时间5.4 ns
其他特性AUTO/SELF REFRESH
最大时钟频率 (fCLK)143 MHz
I/O 类型COMMON
交错的突发长度1,2,4,8
JESD-30 代码S-PBGA-B54
JESD-609代码e1
长度8 mm
内存密度134217728 bit
内存集成电路类型SYNCHRONOUS DRAM
内存宽度16
湿度敏感等级3
功能数量1
端口数量1
端子数量54
字数8388608 words
字数代码8000000
工作模式SYNCHRONOUS
最高工作温度105 °C
最低工作温度-40 °C
组织8MX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装等效代码BGA54,9X9,32
封装形状SQUARE
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
刷新周期4096
座面最大高度1.2 mm
自我刷新YES
连续突发长度1,2,4,8,FP
最大待机电流0.001 A
最大压摆率0.16 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间10
宽度8 mm

IS45S16800E-7BLA2相似产品对比

IS45S16800E-7BLA2 IS45S16800E-7BLA2-TR IS45S16800E-7TLA1-TR IS45S16800E-7TLA2 IS45S16800E-7BLA1 IS45S16800E-7BLA1-TR IS45S16800E-7TLA2-TR IS45S16800E-6BLA1-TR IS45S16800E-6BLA1 IS45S16800E-7TLA1
描述 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, BGA-54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT, TSOP2-54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, BGA-54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, BGA-54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT, TSOP2-54
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
最长访问时间 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns 5.4 ns
最大时钟频率 (fCLK) 143 MHz 143 MHz 143 MHz 143 MHz 143 MHz 143 MHz 143 MHz 166 MHz 166 MHz 143 MHz
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
交错的突发长度 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8
JESD-30 代码 S-PBGA-B54 S-PBGA-B54 R-PDSO-G54 R-PDSO-G54 S-PBGA-B54 S-PBGA-B54 R-PDSO-G54 S-PBGA-B54 S-PBGA-B54 R-PDSO-G54
内存密度 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit
内存集成电路类型 SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
内存宽度 16 16 16 16 16 16 16 16 16 16
端子数量 54 54 54 54 54 54 54 54 54 54
字数 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
字数代码 8000000 8000000 8000000 8000000 8000000 8000000 8000000 8000000 8000000 8000000
最高工作温度 105 °C 105 °C 85 °C 105 °C 85 °C 85 °C 105 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 8MX16 8MX16 8MX16 8MX16 8MX16 8MX16 8MX16 8MX16 8MX16 8MX16
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFBGA FBGA TSOP TSOP2 TFBGA FBGA TSOP FBGA TFBGA TSOP2
封装等效代码 BGA54,9X9,32 BGA54,9X9,32 TSOP54,.46,32 TSOP54,.46,32 BGA54,9X9,32 BGA54,9X9,32 TSOP54,.46,32 BGA54,9X9,32 BGA54,9X9,32 TSOP54,.46,32
封装形状 SQUARE SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR SQUARE SQUARE RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 4096 4096 4096 4096 4096 4096 4096 4096 4096 4096
连续突发长度 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP
最大待机电流 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
最大压摆率 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.16 mA 0.18 mA 0.18 mA 0.16 mA
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL GULL WING GULL WING BALL BALL GULL WING BALL BALL GULL WING
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM DUAL DUAL BOTTOM BOTTOM DUAL BOTTOM BOTTOM DUAL

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