DATA SHEET
µ
PD754202, 754202(A)
4-BIT SINGLE-CHIP MICROCONTROLLERS
MOS INTEGRATED CIRCUIT
The
µ
PD754202 is a member of the 75XL Series of 4-bit single-chip microcontrollers that enable data processing
equivalent to that of an 8-bit microcontroller.
It features expanded CPU functions compared to the 75X Series and enables high-speed, low-voltage operation
at 1.8 V, making it suitable for battery-driven applications.
The
µ
PD754202(A) is a higher-reliability product compared to the
µ
PD754202.
Detailed function descriptions, etc., are provided in the following user’s manual. Be sure to read it
when designing.
µ
PD754202 User’s Manual: U11132E
FEATURES
•
•
•
Key return reset function for keyless entry
Low-voltage operation: V
DD
= 1.8 to 6.0 V
On-chip memory
• Program memory (ROM): 2048
×
8 bits
• Data memory (RAM)
: 128
×
4 bits
•
Variable instruction execution time useful for high-speed operation and power save
• 0.95, 1.91, 3.81, 15.3
µ
s (at 4.19-MHz operation)
• 0.67, 1.33, 2.67, 10.7
µ
s (at 6.0-MHz operation)
•
Compact package (20-pin plastic shrink SOP (300 mil, 0.65-mm pitch))
APPLICATIONS
Automotive electronics such as keyless entry units
The
µ
PD754202 and
µ
PD754202(A) have different quality grades. Unless otherwise specified, descriptions in
this data sheet apply to the
µ
PD754202.
The information in this document is subject to change without notice.
Document No. U12181EJ1V0DS00 (1st edition)
Date Published May 1997 N
Printed in Japan
©
1997
µ
PD754202, 754202(A)
ORDERING
INFORMATION
Package
20-pin plastic SOP (300 mil, 1.27-mm pitch)
20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
20-pin plastic SOP (300 mil, 1.27-mm pitch)
20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Quality Grade
Standard
Standard
Special
Special
Part Number
µ
PD754202GS-×××-BA5
µ
PD754202GS-×××-GJG
µ
PD754202GS(A)-×××-BA5
µ
PD754202GS(A)-×××-GJG
Remark
×××
indicates the ROM code suffix.
Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
Differences between
µ
PD754202 and
µ
PD754202(A)
Part Number
Item
Quality grade
Standard
Special
µ
PD754202
µ
PD754202(A)
2
µ
PD754202, 754202(A)
FUNCTION LIST
Parameter
Instruction execution time
Function
• 0.95, 1.91, 3.81, 15.3
µ
s (system clock: at 4.19-MHz operation)
• 0.67, 1.33, 2.67, 10.7
µ
s (system clock: at 6.0-MHz operation)
2048
×
8 bits
128
×
4 bits
• 4-bit manipulation: 8
×
4 banks
• 8-bit manipulation: 4
×
4 banks
4
9
13
4 channels
• 8-bit timer counter: 3 channels
(Usable as 16-bit timer counter)
• Basic interval timer/watchdog timer: 1 channel
16 bits
External: 1, Internal: 4
External: 1 (key return reset function provided)
Ceramic/crystal oscillation circuit
STOP/HALT mode
T
A
= –40 to +85 ˚C
V
DD
= 1.8 to 6.0 V
• 20-pin plastic SOP (300 mil, 1.27-mm pitch)
• 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Mask option-specifiable on-chip pull-up resistor
Software-specifiable on-chip pull-up resistor connection
On-chip memory
ROM
RAM
General-purpose register
I/O port
CMOS input
CMOS input/output
Total
Timer
Bit sequential buffer (BSB)
Vectored interrupt
Test input
System clock oscillation circuit
Standby function
Operating ambient temperature
Supply voltage
Package
3
µ
PD754202, 754202(A)
CONTENTS
1. PIN CONFIGURATION (Top View) .................................................................................................... 6
2. BLOCK DIAGRAM ............................................................................................................................... 7
3. PIN
3.1
3.2
3.3
3.4
FUNCTION .................................................................................................................................... 8
Port Pins ...................................................................................................................................... 8
Non-port Pins .............................................................................................................................. 9
Pin Input/Output Circuits ......................................................................................................... 10
Recommended Connection of Unused Pins .......................................................................... 11
4. SWITCHING FUNCTION BETWEEN Mk I MODE AND Mk II MODE ....................................... 12
4.1 Differences between Mk I Mode and Mk II Mode .................................................................... 12
4.2 Setting Method of Stack Bank Select Register (SBS) ........................................................... 13
5. MEMORY CONFIGURATION ............................................................................................................14
6. PERIPHERAL HARDWARE FUNCTION ......................................................................................... 17
6.1 Digital I/O Port ........................................................................................................................... 17
6.2 Clock Generator ........................................................................................................................17
6.3 Basic Interval Timer/Watchdog Timer ..................................................................................... 19
6.4 Timer Counter ........................................................................................................................... 20
6.5 Bit Sequential Buffer ................................................................................................................ 24
7. INTERRUPT FUNCTION AND TEST FUNCTION ........................................................................... 25
8. STANDBY FUNCTION .......................................................................................................................27
9. RESET FUNCTION ............................................................................................................................ 28
9.1 Configuration and Operation Status of Reset Function ........................................................ 28
9.2 Watchdog Flag (WDF), Key Return Flag (KRF) ...................................................................... 32
10. MASK OPTION .................................................................................................................................. 34
11. INSTRUCTION SETS ......................................................................................................................... 35
12. ELECTRICAL SPECIFICATIONS ...................................................................................................... 44
13. CHARACTERISTIC CURVES (REFERENCE VALUES) ................................................................ 53
14. PACKAGE DRAWINGS ...................................................................................................................... 55
15. RECOMMENDED SOLDERING CONDITIONS .................................................................................. 57
4
µ
PD754202, 754202(A)
APPENDIX A.
µ
PD754202, 75F4264 FUNCTION LIST ..................................................................... 58
APPENDIX B. DEVELOPMENT TOOLS ..............................................................................................59
APPENDIX C. RELATED DOCUMENTS .............................................................................................. 62
5
PCB设计
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