DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD754302,754304,754302(A),754304(A)
4-BIT SINGLE-CHIP MICROCONTROLLER
The
µ
PD754304 is one of the “75XL Series” 4-bit single-chip microcontrollers with data processing capability
comparable to that of 8-bit microcontrollers. The
µ
PD754303(A) has a higher reliability than the
µ
PD754304.
The microcontrollers in the 75XL Series have expanded CPU functions than those of the 75X Series and can
operate at a voltage of as low as 1.8 V; therefore, they are ideal for battery-driven application systems.
As the one-time PROM version of the
µ
PD754304, the
µ
PD75P4308 is ideal for evaluation of a system under
development or for small-scale production of application systems.
Detailed information about functions can be found in the following document. Be sure to read the following
document before designing.
µ
PD754304 User’s Manual: U10123E
FEATURES
• Low-voltage operation: V
DD
= 1.8 to 5.5 V
• Internal memory
Program memory (ROM):
2048
×
8 bits (
µ
PD754302, 754302(A))
4096
×
8 bits (
µ
PD754304, 754304(A))
Data memory (RAM): 256
×
4 bits
• Variable instruction execution time effective for high-
speed operation and power saving
0.95, 1.91, 3.81, or 15.3
µ
s (at 4.19 MHz)
0.67, 1.33, 2.67, or 10.7
µ
s (at 6.0 MHz)
• Internal serial interface (1 channel)
• Powerful timer function (3 channels)
• Inherits instruction set of existing 75X Series for easy
replacement
APPLICATIONS
•
µ
PD754302, 754302(A)
Cordless telephones, TVs, VCRs, audio systems, household appliances, office machines, etc.
•
µ
PD754304, 754304(A)
Automotive appliance, etc.
The
µ
PD754302 and 754304 differ from the
µ
PD754302(A) and 754304(A) only in terms of their quality grade.
Unless otherwise specified, the
µ
PD754304 is treated as a representative model in this Data Sheet.
For the models other than the
µ
PD754304,
µ
PD754304 can be read as the other model name.
If different descriptions are made for the
µ
PD754302 and 754304, the (A) models correspond as follows:
µ
PD754302
→
µ
PD754302(A),
µ
PD754304
→
µ
PD754304(A)
The information in this document is subject to change without notice.
Document No. U10797EJ2V0DS00 (2nd edition)
Date Published November 1996 N
Printed in Japan
The mark
shows major revised points.
©
1996
µ
PD754302, 754304, 754302(A), 754304(A)
ORDERING INFORMATION
Parts Number
Package
36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)
Quality Grade
Standard
Standard
Special
Special
µ
PD754302GS-×××
µ
PD754304GS-×××
µ
PD754302GS(A)-×××
µ
PD754304GS(A)-×××
Remark
×
indicates a ROM code number.
Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
Difference between
µ
PD75430× and
µ
PD75430×(A)
Parts Number
Item
Quality grade
µ
PD754302
µ
PD754304
Standard
µ
PD754302(A)
µ
PD754304(A)
Special
2
µ
PD754302, 754304, 754302(A), 754304(A)
Functional Outline
Parameter
Instruction execution time
On-chip memory
ROM
Function
• 0.95, 1.91, 3.81, 15.3
µ
s (@ 4.19 MHz with system clock)
• 0.67, 1.33, 2.67, 10.7
µ
s (@ 6.0 MHz with system clock)
2048
×
8 bits (
µ
PD754302)
4096
×
8 bits (
µ
PD754304)
RAM
General-purpose register
256
×
4 bits
• 4-bit operation: 8
×
4 banks
• 8-bit operation: 4
×
4 banks
8
18
On-chip pull-up resistors can be specified by software: 7
On-chip pull-up resistors can be specified by software: 18
Input/
output
port
CMOS input
CMOS input/output
N-ch open-drain
input/output pins
Total
Timer
4
13 V withstand voltage. On-chip pull-up resistors can be specified by
mask option.
30
3 channels
• 8-bit timer/event counter: 2 channels (16-bit timer/event counter)
• Basic interval timer/watchdog timer: 1 channel
Serial interface
• 3-wire serial I/O mode ... MSB or LSB can be selected for transferring top bit
• 2-wire serial I/O mode
16 bits
•
Φ,
524, 262, 65.5 kHz (@ 4.19 MHz with system clock)
•
Φ,
750, 375, 93.8 kHz (@ 6.0 MHz with system clock)
Bit sequential buffer
Clock output (PCL)
Vectored interrupts
Test input
System clock oscillator
Standby function
Operating ambient
temperature
Power supply voltage
Package
External: 3, Internal: 4
External: 1
Ceramic or crystal oscillator
STOP/HALT mode
T
A
= –40 to +85 ˚C
V
DD
= 1.8 to 5.5 V
36-pin plastic shrink SOP (300 mil, 0.8-mm pitch)
3
µ
PD754302, 754304, 754302(A), 754304(A)
CONTENTS
1. PIN CONFIGURATION (Top View) ······································································································ 6
2. BLOCK DIAGRAM ······························································································································· 8
3. PIN FUNCTION ···································································································································· 9
3.1 Port Pins ····································································································································· 9
3.2 Non-port Pins ···························································································································· 10
3.3 Pin Input/Output Circuits ········································································································· 11
3.4 Recommended Connections for Unused Pins ······································································· 13
4. SWITCHING FUNCTION BETWEEN Mk I MODE AND Mk II MODE ················································ 14
4.1 Difference between Mk I and Mk II Modes ·············································································· 14
4.2 Setting Method of Stack Bank Select Register (SBS) ··························································· 15
5. MEMORY CONFIGURATION············································································································· 16
6. PERIPHERAL HARDWARE FUNCTIONS ························································································· 20
6.1 Digital Input Ports ···················································································································· 20
6.2 Clock Generator ······················································································································· 21
6.3 Clock Output Circuit ················································································································ 22
6.4 Basic Interval Timer/Watchdog Timer ···················································································· 23
6.5 Timer/Event Counter ················································································································ 24
6.6 Serial Interface ·························································································································· 27
6.7 Bit Sequential Buffer ················································································································ 29
7. INTERRUPT FUNCTION AND TEST FUNCTION ·············································································· 30
8. STANDBY FUNCTION ······················································································································· 32
9. RESET FUNCTION ···························································································································· 33
10. MASK OPTION ··································································································································· 36
11. INSTRUCTION SETS ························································································································· 37
12. ELECTRICAL SPECIFICATIONS ······································································································ 49
13. CHARACTERISTICS CURVES (REFERENCE VALUES) ································································· 61
14. PACKAGE DRAWING ······················································································································· 63
15. RECOMMENDED SOLDERING CONDITIONS ················································································· 64
4
µ
PD754302, 754304, 754302(A), 754304(A)
APPENDIX A. COMPARISON OF FUNCTIONS AMONG
µ
PD750004, 754304, AND 75P4308 ·········· 65
APPENDIX B. DEVELOPMENT TOOLS ································································································· 67
APPENDIX C. RELATED DOCUMENTS ································································································ 70
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