Fast Page DRAM Module, 512KX32, 70ns, CMOS, SIMM-72
参数名称 | 属性值 |
厂商名称 | SAMSUNG(三星) |
零件包装代码 | SIMM |
包装说明 | SIMM, SSIM72 |
针数 | 72 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE |
最长访问时间 | 70 ns |
其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-XSMA-N72 |
内存密度 | 16777216 bit |
内存集成电路类型 | FAST PAGE DRAM MODULE |
内存宽度 | 32 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 72 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512KX32 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | SIMM |
封装等效代码 | SSIM72 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 512 |
座面最大高度 | 25.4 mm |
自我刷新 | NO |
最大待机电流 | 0.016 A |
最大压摆率 | 0.536 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | SINGLE |
KMM532512CV-7 | KMM532512CV-6 | KMM532512CV-8 | KMM532512CVG-8 | KMM532512CVG-7 | KMM532512CVG-6 | |
---|---|---|---|---|---|---|
描述 | Fast Page DRAM Module, 512KX32, 70ns, CMOS, SIMM-72 | Fast Page DRAM Module, 512KX32, 60ns, CMOS, SIMM-72 | Fast Page DRAM Module, 512KX32, 80ns, CMOS, SIMM-72 | Fast Page DRAM Module, 512KX32, 80ns, CMOS, SIMM-72 | Fast Page DRAM Module, 512KX32, 70ns, CMOS, SIMM-72 | Fast Page DRAM Module, 512KX32, 60ns, CMOS, SIMM-72 |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
零件包装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
包装说明 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
针数 | 72 | 72 | 72 | 72 | 72 | 72 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 70 ns | 60 ns | 80 ns | 80 ns | 70 ns | 60 ns |
其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 |
内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 72 | 72 | 72 | 72 | 72 | 72 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 512KX32 | 512KX32 | 512KX32 | 512KX32 | 512KX32 | 512KX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
封装等效代码 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 |
座面最大高度 | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm |
自我刷新 | NO | NO | NO | NO | NO | NO |
最大待机电流 | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
最大压摆率 | 0.536 mA | 0.576 mA | 0.496 mA | 0.496 mA | 0.536 mA | 0.576 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
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