DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD78001B(A), 78002B(A)
8-BIT SINGLE-CHIP MICROCOMPUTER
DESCRIPTION
The
µ
PD78001B(A)/78002B(A) are products in the
µ
PD78002 subseries within the 78K/0 series.
The
µ
PD78001B(A)/78002B(A) have various peripheral hardware such as timer, serial interface and interrupt
function.
A one-time PROM or EPROM product, the
µ
PD78P014, capable of operating in the same power supply voltage
range as that of the mask ROM product and other development tools is provided.
Functions are described in detail in the following User's Manual, which should be read when carrying out design
work.
µ
PD78002, 78002Y Series User's Manual: IEU-1334
FEATURES
•
The
µ
PD78001B, in comparison with the 78002B, is a higher reliability device, as a result of a more comprehensive
quality assurance program (Refer to Quality Grade on NEC Semiconductor Devices (IEI-1209))
•
Large on-chip ROM & RAM
Item
Product Name
Program Memory
(ROM)
8K bytes
16K byte
Data Memory
(Internal High-Speed RAM)
256 bytes
384 bytes
•
64-pin plastic shrink DIP (750 mil)
•
64-pin plastic QFP ( 14 mm)
Package
µ
PD78001B(A)
µ
PD78002B(A)
•
External memory expansion space: 64K bytes
•
Instruction execution time can be varied from high-speed (0.4
µ
s) to ultra-low-speed (122
µ
s)
•
I/O ports: 53 (N-ch open-drain : 4)
•
Serial interface : 1 channel
•
Timer: 4 channels
•
Operating voltage range : 2.7 to 6.0 V
APPLICATION
Transmission equipment control device, gas detector circuit breaker, safety devices, etc.
The information in this document is subject to change without notice.
Document No. IC-3599
(O.D. No. IC-9078)
Date Published February 1995 P
Printed in Japan
©
1995
µ
PD78001B(A), 78002B(A)
ORDERING INFORMATION
Part Number
Package
64-pin plastic shrink DIP (750 mil)
64-pin plastic QFP (s 14 mm)
s
64-pin plastic shrink DIP (750 mil)
64-pin plastic QFP (s 14 mm)
s
Quality Grade
Special
Special
Special
Special
µ
PD78001BCW (A)-×××
µ
PD78001BGC (A)-×××-AB8
µ
PD78002BCW (A)-×××
µ
PD78002BGC (A)-×××-AB8
Remark
×××
indicates ROM code No.
Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
Difference between the
µ
PD78001B(A), 78002B(A) and the
µ
PD78001B, 78002B.
Product Name
Item
Quality Grade
µ
PD78001B(A), 78002B(A)
µ
PD78001B, 78002B
Special
Standard
2
µ
PD78001B(A), 78002B(A)
78K/0 SERIES PRODUCT DEVELOPMENT
These products are a further development in the 78K/0 Series. The designations appearing inside the boxes
are subseries names.
Products in Volume Production
Products under Development
For control
100-pin
80-pin
64-pin
64-pin
64-pin
42/44-pin
2
Y series products are compatible with I C bus.
µ
PD78078
µ
PD78054
µ
PD78018F
µ
PD78014
µ
PD78002
µ
PD78083
µ
PD78078Y
µ
PD78054Y
µ
PD78018FY
µ
PD78014Y
µ
PD78002Y
Timer added to the
µ
PD78054, external interface functions
UART and D/A added to the
µ
PD78014, I/O enhanced
Low-voltage (1.8 V) operation version of the
µ
PD78014, with enhanced ROM and RAM variations
A/D and 16-bit timer added to the
µ
PD78002
Basic subseries for control
Internal UART, low-voltage (1.8 V) operation possible
78K/0
Series
For FIP
®
driving
100-pin
µ
PD780208
80-pin
µ
PD78044A
64-pin
µ
PD78024
For LCD driving
100-pin
I/O, FIP C/D of the
µ
PD78044A enhanced, display output total: 53
6-bit U/D counter added to the
µ
PD78024, display output total: 34
Basic subseries for FIP driving, display output total: 26
µ
PD78064
For IEBus
TM
µ
PD78064Y
Subseries for LCD driving, internal UART
80-pin
µ
PD78098
IEBus controller added to the
µ
PD78054
The major functional differences among the subseries are shown below.
Function
Name
For Control
8-bit
16-bit
1ch
Timer
A/D
Watch
1ch
Watchdog
1ch
8-bit
×
8ch
D/A
V
DD
MIN.
Value
1.8 V
2.0 V
1.8 V
2.7 V
—
—
2ch
1ch
1ch
1ch
—
8-bit
×
8ch
8-bit
×
8ch
—
1ch
1ch (UART: 1ch)
2ch
33
74
68
54
2ch
1ch
1ch
1ch
8-bit
×
8ch
8-bit
×
8ch
—
2ch (UART: 1ch)
57
2.0 V
—
1.8 V
2.7 V
—
—
Serial
Interface
I/O
External
Expansion
µ
PD78078
µ
PD78054
µ
PD78018F
µ
PD78014
µ
PD78002
µ
PD78083
4ch
2ch
8-bit
×
2ch 3ch (UART: 1ch)
88
69
C
—
2ch
53
For FIP
®
driving
µ
PD780208
µ
PD78044A
µ
PD78024
For LCD
driving
For IEBus
TM
µ
PD78064
µ
PD78098
2ch
1ch
1ch
1ch
8-bit
×
2ch 3ch (UART: 1ch)
69
2.7 V
C
3
µ
PD78001B(A), 78002B(A)
OVERVIEW OF FUNCTION
Product Name
Item
Internal
memory
ROM
Internal high-
speed RAM
64K bytes
8 bits
×
32 registers (8 bits
×
8 registers
×
4 banks)
On-chip instruction execution time cycle modification function
0.4
µ
s/0.8
µ
s/1.6
µ
s/3.2
µ
s/6.4
µ
s (at 10.0 MHz operation)
122
µ
s (at 32.768 kHz operation)
µ
PD78001B(A)
8K bytes
256 bytes
µ
PD78002B(A)
16K bytes
384 bytes
Memory space
General registers
Instruction cycle
When main system
clock selected
When subsystem
clock selected
Instruction set
• 16-bit operation
• Bit manipulation (set, reset, test, boolean operation)
• BCD correction, etc.
Total
• CMOS input
• CMOS I/O
: 53
:
02
: 47
I/O ports
• N-channel open-drain I/O
(15 V withstand voltage) :
04
Serial interface
Timer
• 3-wire/SBI/2-wire mode selectable
• 8-bit timer/event counter
• Watch timer
• Watchdog timer
2
39.1 kHz, 78.1 kHz, 156 kHz, 313 kHz, 625 kHz, 1.25 MHz (at main system clock 10.0 MHz operation),
32.768 kHz (at subsystem clock 32.768 kHz operation)
2.4 kHz, 4.9 kHz, 9.8 kHz (at main system clock 10.0 MHz operation)
Internal : 5
External : 4
Internal : 1
: 2 channels
: 1 channel
: 1 channel
Timer output
Clock output
Buzzer output
Vectored
interrupts
Maskable
interrupts
Non-maskable
interrupt
Software
interrupt
Test input
Internal : 1
Internal : 1
External : 1
V
DD
= 2.7 to 6.0 V
–40 to +85°C
• 64-pin plastic shrink DIP (750 mil)
• 64-pin plastic QFP (s 14 mm)
s
Operating voltage range
Operating ambient
temperature range
Package
4
µ
PD78001B(A), 78002B(A)
CONTENTS
1.
2.
3.
PIN CONFIGURATION (TOP VIEW) .....................................................................................................
BLOCK DIAGRAM ...................................................................................................................................
6
9
PIN FUNCTIONS ..................................................................................................................................... 10
3.1
3.2
3.3
PORT PINS ...................................................................................................................................................... 10
OTHER PINS ................................................................................................................................................... 12
PIN I/O CIRCUIT AND RECOMMENDED CONNECTION OF UNUSED PINS ...................................... 13
4.
5.
MEMORY SPACE .................................................................................................................................... 15
PERIPHERAL HARDWARE FUNCTION FEATURES ............................................................................ 16
5.1
5.2
5.3
5.4
5.5
5.6
PORTS .............................................................................................................................................................. 16
CLOCK GENERATOR ...................................................................................................................................... 17
TIMER/EVENT COUNTER .............................................................................................................................. 18
CLOCK OUTPUT CONTROL CIRCUIT ......................................................................................................... 20
BUZZER OUTPUT CONTROL CIRCUIT ....................................................................................................... 20
SERIAL INTERFACES ..................................................................................................................................... 21
6.
INTERRUPT FUNCTIONS AND TEST FUNCTIONS .......................................................................... 22
6.1
6.2
INTERRUPT FUNCTIONS ............................................................................................................................... 22
TEST FUNCTIONS .......................................................................................................................................... 25
7.
8.
9.
EXTERNAL DEVICE EXPANSION FUNCTIONS ................................................................................. 26
STANDBY FUNCTIONS ......................................................................................................................... 26
RESET FUNCTION .................................................................................................................................. 26
10. INSTRUCTION SET ................................................................................................................................ 27
11. ELECTRICAL SPECIFICATIONS ............................................................................................................. 30
12. CHARACTERISTIC CURVE (REFERENCE VALUES) ........................................................................... 48
13. PACKAGE DRAWINGS ........................................................................................................................... 52
14. RECOMMENDED SOLDERING CONDITIONS ..................................................................................... 56
APPENDIX A. DEVELOPMENT TOOLS ...................................................................................................... 57
APPENDIX B. RELATED DOCUMENTS ...................................................................................................... 59
5
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